00198502-02_VD_SIPLACE_Pro_15.1_R18-1_DE_EN.pdf - 第14页

SIPLACE Pro 15.1 (R 18 - 1) / V ersion Description 05/2018 Edition 14 4.4 SIPLACE CA4 V 2 – Fiducials on Conve yor Rails On the SIPLACE CA4 V 2 placement machine, the co nveyor has been eq uipped with f iducials on the c…

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SIPLACE Pro 15.1 (R18-1) / Version Description 05/2018 Edition
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4 Features of SIPLACE Pro 15.1
If not differently described, the features of the previous SIPLACE Pro versions are contained in
SIPLACE Pro 15.1. The main new features of SIPLACE Pro 15.1 are listed below.
Detailed information on the individual functions can be found in the Online Help for
4.1 SIPLACE TX V2 – New Placement Machine
The new SIPLACE TX V2 placement machine supports placement on a dual conveyor system. The
placement machine is available in three configurations: TX1 V2 (single gantry), TX2 V2 (dual
gantry) and TX2i V2 (dual gantry, inner table). The dual conveyor can be used as single conveyor
in Flexible Dual Lane mode when boards with at width > 260 mm are placed. In this case, the
Flexible Dual Lane – Machine Connection Bound license is required.
4.2 SIPLACE C&P20 P2 – New Placement Head
The new SIPLACE C&P20 P2 placement head is supported on the SIPLACE TX V2 placement
machine. A new 6xxx nozzle series has been introduced for this placement head together with the
new 6xxx (20) nozzle magazine (NC C&P 20 P2 6xxx 1x3 and NC C&P 20 P2 6xxx 2x2 nozzle
changers). This nozzle series is also supported by the C&P20 P placement head.
The placement head is able to pick up components with very low force when selected in the
Handling tab of the Component Shape Editor (please refer to section 5.5).
4.3 New X-Feeders
To support the high placement performance of the SIPLACE C&P20 P2 placement head, new
4 mm X, 8 mm X and 2 x 8 mm X feeders have been introduced.
These feeders are compatible with the correspondent previous X-feeders. The feeder types remain
unchanged in SIPLACE Pro. However, their maximum performance depends on the placement
head that uses the feeder.
Using an X-feeder of the previous type together with the SIPLACE C&P20 P2 placement head may
lead to decreased placement performance since the new X-feeder provides optimizations that only
work together with this placement head. In other situations, both feeders behave identical.
The respective "official" product names SIPLACE SmartFeeder X (previous type) and
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4.4 SIPLACE CA4 V2 – Fiducials on Conveyor Rails
On the SIPLACE CA4 V2 placement machine, the conveyor has been equipped with fiducials on
the conveyor rails. These fiducials can optionally be used for the dual gantry correction at the
station.
For each board side in the Board Editor, the user can select the Dual gantry correction mode
with conveyor fiducials option for the board. If this option is not selected or no conveyor fiducials
exist on the conveyor, the board fiducials will be used for the dual gantry correction.
4.5 Support of DEK Version 10 with ASM Printer Programming 2.0
SIPLACE Pro supports DEK Printer Software Version V10 together with ASM Printer Programming
2.0.
Only the major DEK versions (09, 10) can be selected in SIPLACE Pro Desk, the complete version
(e.g. 10.6) can only be selected in ASM Printer Programming.
ASM Printer Programming can be started from the External Tools menu in SIPLACE Pro Desk
and in the Line Control GUI.
4.6 Linear Dipping Unit 2 X – New Dipping Module
SIPLACE Pro supports the new Linear Dipping Unit 2 X that exists in two variants:
– Linear Dipping Unit 2 X for X-tables
– Linear Dipping Unit E for E-tables on E-series machine only
The Linear Dipping Unit 2 X can be used alternatively to the existing Linear Dipping Unit X and set
up physically wherever the existing SIPLACE Pro setup requires the former model with one
exception: it cannot be used at the SWS.
Additionally, two new parameters have been added to the Material Type option in the Process
Material Editor:
– Warm-up cycles (default: 30)
– Squeegee speed (default: 200 mm/s)
Detailed information can be found in the Linear Dipping Unit 2 X User Manual,
item no. [00198517-xx].
4.7 Front-Back-Offset Measurement
SIPLACE Pro supports the new Front-Back-Offset Measurement when placing chips with the
Fan-out Panel Level Package (FOPLP) technology. It measures the offset between the bottom
outline of a die and the electrical connection on the top. The Front-Back-Offset Measurement is
supported on the CA4 placement machine together with the C&P20 M and CPP placement heads.
The new stationary Camera Type 40 with glass plate has been introduced for this measurement.
The camera has to be manually mounted for each station. The die is placed on the center of the
glass plate for measurement. First the camera measures the bottom outline of the die. The result of
this measurement is used to correct the estimated position of the structure on the top side which is
measured afterwards. The difference between the expected and the measured position of the
structure is the so-called "die offset".
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You can define n dies per wafer to be measured by the Front-Back-Offset Measurement in the
beginning to determine the offset average for this wafer when a wafer is first used in this recipe. It
is also possible to select a 100% Front-Back-Offset Measurement.
The dies which are used for Front-Back-Offset Measurement will be picked-up at first and used to
compute the offset average. The resulting offset is used for all other dies of this wafer to place the
dies correctly.
The Measure offset option has to be enabled in the Component Editor for each die that shall be
measured by the Front-Back-Offset Measurement.
Additionally, the following parameters must be specified:
Count of measurements
Number of individual dies per wafer that shall be measured by the Front-Back-Offset
Measurement to calculate the total die offset to be applied to all other dies of the wafer.
Valid values: 1..100000
Min. valid measurements
Minimum percentage of the measured individual dies per wafer for which the measurement
should be valid. Valid values: 1..100 [%]
Additionally, camera type 40 has to be added to the list of valid camera types for the component in
the Component Shape Editor.
4.8 Copy Feeders and Nozzles Feature – Extension
The Copy Feeders and Nozzles from option in the Setup Editor has been extended to bring a
setup or a nozzle configuration of a placement machine with two processing areas (e.g. an X4i S)
onto two machines with one processing area (TX, TX V2 placement machines). Additionally, the
option has been extended to transfer nozzle configurations of setups with different placement
heads (i.e. from a TX to a TX V2 placement machine).
Two modes are available for copying feeders and nozzles:
Match placement stations when possible
Default mode. If the same placement machine exists in both lines, the feeders and nozzles will
be copied directly to that machine in the target line, regardless of the position of the machine
within the line. The station pairs should preferably have the same number of placing areas
(1 or 2). The number of placement machines must not be the same in the lines. Only nozzle
configurations with the same series are copied.
Maintain placing area order
Feeders and nozzles will be copied by making pairs of placing areas rather than matching
specific placement machines. This can be used to copy from a placement machine with two
placing areas (e.g. an X4i S) to two placement machines each having a single placing area
(e.g. 2x TX V2). Beginning at the first placing area of the source line, feeders and nozzles from
the right-side station location will be copied to the right-side station location of the first placing
area in the target line. Feeders and nozzles from the left-side station location of the source
placing area will be copied to the left-side station location of the matching placing area in the
target line. Feeders and nozzles from station locations with no counterpart in the paired placing
area of the target line will not be copied. The placing areas are matched in the travel direction
of the conveyor.
A nozzle configuration from a placement machine with C&P20 P placement head and 4xxx
nozzles can be copied to a TX V2 placement machine with C&P20 P2 placement head and
6xxx nozzles. The 4xxx nozzles will be transferred to 6xxx nozzles. The nozzle changer type
with its magazine type will also be changed.