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Table of contents S tudent Guide SIPLACE V ision (Customer) Edition 12/2008 EN 4 4.11 Component Shape Wizard .... ................. ................................................................................ .......…

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Table of contents
Student Guide SIPLACE Vision (Customer)
Edition 12/2008 EN
3
Table of contents
1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
1.1 SIPLACE on the World Wide Web (WWW)..........................................................................................7
2 Operational Safety . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.1 Conventions for the Use of Safety Instructions................................................................................. 9
3 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3.1 Board Centering and Inkspot Recognition....................................................................................... 11
3.2 Component Centering ........................................................................................................................ 12
3.3 Machine Tests with Cameras............................................................................................................. 12
3.3.1 Nozzle Scan.......................................................................................................................................... 12
3.3.2 Feeder Position Recognition................................................................................................................. 13
3.4 Camera Overview................................................................................................................................ 13
3.4.1 Individual Camera Types - Details........................................................................................................ 14
3.4.1.1 CO Camera C&P20 SST 23 ............................................................................................................... 14
3.4.1.2 CO Camera C&P12 SST 28 ............................................................................................................... 15
3.4.1.3 CO Camera C&P6 (C&P12 'HR') SST 29.......................................................................................... 15
3.4.1.4 CO Camera TWIN 'IC' SST 33 ('FC' SST 25)..................................................................................... 16
3.4.1.5 PCB Camera Standard SST34 ........................................................................................................... 16
3.4.1.6 PCB Camera SST 24.......................................................................................................................... 17
3.4.1.7 Coplanarity Sensors ........................................................................................................................... 17
4 User Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
4.1 User Management and Programming Privileges for SIPLACE Pro................................................ 19
4.2 Operating Level "Operator" ............................................................................................................... 20
4.2.1 SIPLACE Pro Component Shape Editor............................................................................................... 20
4.2.2 Station Interface for Teaching Component Shapes.............................................................................. 21
4.3 Operating Level " Supervisor"........................................................................................................... 22
4.3.1 SIPLACE Pro Component Shape Editor............................................................................................... 22
4.3.2 Station Interface for Teaching Component Shapes.............................................................................. 23
4.4 Editing the Camera Image (for all Vision Menus) ............................................................................ 24
4.5 Menu for Results and Recognition Steps......................................................................................... 26
4.6 Checking and Correcting the Geometry. .......................................................................................... 27
4.7 Setting the Illumination ...................................................................................................................... 28
4.8 Programming Interface for Illumination Adjustment....................................................................... 30
4.9 Setting the Algorithms ....................................................................................................................... 31
4.10 Error Analysis Logs............................................................................................................................ 32
4.10.1 Enabling Vision Log Recording............................................................................................................. 32
4.10.1.1 Vision Measurement Options.............................................................................................................. 32
4.10.1.2 Vision Measurement ........................................................................................................................... 33
4.10.2 Paths and Settings................................................................................................................................ 34
Table of contents
Student Guide SIPLACE Vision (Customer)
Edition 12/2008 EN
4
4.11 Component Shape Wizard ................................................................................................................. 35
4.11.1 Creating Component Shapes................................................................................................................ 35
4.11.2 Quality-Influencing Decisions................................................................................................................ 37
5 Component Shapes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
5.1 Structure of Component Shape Data ................................................................................................ 39
5.1.1 Component Centering with Combined Usage of SIPLACE Vision and ICOS....................................... 40
5.1.2 Overview of Component Shapes Which Require Separate Group Descriptions .................................. 42
5.2 Component Shape Description Rules............................................................................................... 43
5.2.1 Lead Shapes......................................................................................................................................... 46
5.2.2 Key Placement Accuracy Points ........................................................................................................... 48
5.2.3 Processing Data.................................................................................................................................... 48
5.3 Specific Component Shapes ............................................................................................................. 49
5.3.1 Unleaded Component Shapes.............................................................................................................. 49
5.3.2 BareDie Component Shape.................................................................................................................. 50
5.3.3 CHIP Component Shape ...................................................................................................................... 51
5.3.4 MELF Component Shape ..................................................................................................................... 55
5.3.5 Moulded (Injection Moulded) Components (for Tantal Capacitors) ...................................................... 56
5.3.6 Optical Recognition and Evaluation of Unleaded COs .........................................................................58
5.3.6.1 Position Determination for Unleaded COs.......................................................................................... 58
5.3.6.2 Dimension Check for Unleaded Components..................................................................................... 62
5.3.6.3 Algorithm Values................................................................................................................................. 64
5.3.7 Leaded Component Shapes ................................................................................................................. 65
5.3.7.1 ECV Component Shape (Electrolyte Capacitor Vertical).................................................................... 66
5.3.7.2 SOD/SOT Component Shape (Small Outline Diode / Small Outline Transistor) ................................ 67
5.3.7.3 DPACK Component Shape ................................................................................................................ 69
5.3.7.4 SOJ Component Shape (Small Outline J-Lead) ................................................................................. 74
5.3.7.5 SOxx Component Shape (Small Outline xx)....................................................................................... 75
5.3.7.6 PLCC Component Shape (Plastic Leaded Chip Carrier).................................................................... 76
5.3.7.7 QFP Component Shape (Quad Flat Pack) ......................................................................................... 77
5.3.7.8 Socket Component Shape.................................................................................................................. 78
5.3.8 Optical Recognition and Evaluation of Leaded COs............................................................................. 79
5.3.8.1 Determination of Leaded CO Position ................................................................................................ 79
5.3.8.2 Recognition of Very Wide Leads ........................................................................................................ 83
5.3.9 Components With Round Leads........................................................................................................... 85
5.3.9.1 BGA Component Shape (Ball Grid Array / FlipChip) .......................................................................... 85
5.3.9.2 CCGA Component Shape (Ceramic Column Grid Array)................................................................... 86
5.3.10 Optical Recognition of Hemispherical Leads ........................................................................................ 89
5.3.11 Shields .................................................................................................................................................. 91
5.3.11.1 Shield Component Shape................................................................................................................... 91
5.3.11.2 Special Features for Shields............................................................................................................... 93
5.3.12 Optical Recognition of Shields ............................................................................................................. 95
5.3.13 Components with Open Descriptions.................................................................................................... 97
5.3.13.1 Connector Component Shape ............................................................................................................ 97
5.3.13.2 Nonstandard Component Shapes ...................................................................................................... 98
5.3.14 Optical Recognition of Free Programmed COs .................................................................................... 99
5.4 New SIPLACE Vision Functions for 605 and 701 Station SW....................................................... 101
5.4.1 SIPLACE Vision Image Export/Import ................................................................................................ 101
5.4.1.1 Export Function................................................................................................................................. 101
5.4.1.2 Import Function................................................................................................................................. 101
5.4.2 SIPLACE Vision Robustness Display ................................................................................................. 102
5.4.2.1 Interface for Robustness Display...................................................................................................... 102
5.4.2.2 Measurements in the Robustness Display ....................................................................................... 103
5.4.2.3 Brightness Modification..................................................................................................................... 104
5.4.2.4 Shading at the Image Border............................................................................................................ 105
5.4.2.5 Scale or FeatureSize ........................................................................................................................ 106
Table of contents
Student Guide SIPLACE Vision (Customer)
Edition 12/2008 EN
5
5.4.2.6 Rotation ............................................................................................................................................ 109
5.4.3 SIPLACE Vision Flux Inspection – only in 605 SW............................................................................. 110
5.4.3.1 Flux Inspection.................................................................................................................................. 110
5.5 New SIPLACE Vision Functions for 702 Station SW ..................................................................... 117
5.5.1 Face Down Recognition...................................................................................................................... 118
5.5.2 Lead Measurement............................................................................................................................. 118
5.5.3 Rectangle............................................................................................................................................ 120
5.6 Coplanarity Measurement for Gullwing and Ball Leads................................................................ 121
5.6.1 Coplanarity Measurement ILD2200 .................................................................................................... 121
5.6.2 Coplanarity Measurement for IVP 3D Coplan..................................................................................... 123
6 SIPLACE Vision - Teaching Fiducials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127
6.1 What are Fiducials?.......................................................................................................................... 127
6.1.1 PCB Position Recognition Fiducials in the PCB Layout...................................................................... 129
6.1.2 Placement Position Recognition ......................................................................................................... 131
6.1.3 Good/Bad Board Recognition of So-Called Inkspot Recognition........................................................ 131
6.2 Fiducial shapes ................................................................................................................................. 132
6.2.1 Synthetic Fiducials for Position Recognition Applications................................................................... 132
6.2.1.1 Programming the Fiducial................................................................................................................. 133
6.2.1.2 Shapes and Sizes of Synthetic Fiducials.......................................................................................... 134
6.2.1.3 Recognition of Synthetic Fiducials.................................................................................................... 135
6.2.1.4 Illuminating Fiducials with the Different PCB Cameras ....................................................................137
6.2.1.5 Algorithm Setting .............................................................................................................................. 138
6.2.2 Sample Fiducials for Position Recognition.......................................................................................... 140
6.2.2.1 Position Candidates.......................................................................................................................... 141
6.2.2.2 Position and Quality.......................................................................................................................... 142
6.2.2.3 Sample Fiducial Patterns.................................................................................................................. 143
6.2.2.4 Algorithm Parameters ....................................................................................................................... 143
6.3 Fiducials for Good/Bad Recognition of panels.............................................................................. 144
6.3.1 Synthetic Inkspots............................................................................................................................... 144
6.3.2 Teach Surface for Inkspots ................................................................................................................. 146
6.3.3 Trained Inkspots ................................................................................................................................. 146
6.3.3.1 Algorithm Parameters ....................................................................................................................... 146
6.3.3.2 Template........................................................................................................................................... 147
6.3.3.3 Brightness Histogram ....................................................................................................................... 148
6.3.3.4 Middle gray value.............................................................................................................................. 150
6.4 Station SW Menu Functions Combined with 'Fiducials' ............................................................... 151
6.4.1 Machine Functions.............................................................................................................................. 151
6.4.2 Fiducial Position Teaching.................................................................................................................. 151
6.5 Feeder Position Recognition Fiducials........................................................................................... 152
6.5.1 Component Pocket Fiducials .............................................................................................................. 152
7 SIPLACE Pro 3.0 Programming Interface for Component Shapes . . . . . . . . . . . . 155
7.1 Component Shape Import and Data Conversion for SIPLACE Vision......................................... 155
7.1.1 Step-by Step: Component Shape Import............................................................................................ 155
7.1.2 Body Colors Codes for Changes to Component Shapes in SIPLACE Vision..................................... 156
7.1.3 General Information about Automatic Conversion of Component Shapes ......................................... 156
7.2 Converting the Component Shape with LC Import from a UNIX/LINUX Line Computer............ 157
7.2.1 Converting the Component Shape Type............................................................................................. 158
7.2.2 Adopting the Standard Component Shape from the SIPLACE Pro Installation in the Customer's Component
Shape Database159
7.2.3 SIPLACE Pro Reports for LC Import and Conversion Procedure....................................................... 161