SIPLACE Vision Customer_en.pdf - 第49页

Component Shapes Unleaded Component Shapes Specific Component Shapes S tudent Guide SIPLACE Vision (Customer) Edition 12/2008 EN Component Shapes 49 5.3 Specific Component Shapes The following pages des cribe the key c o…

Component Shapes

Component Shape Description Rules Key Placement Accuracy Points

Student Guide SIPLACE Vision (Customer)

Component Shapes Edition 12/2008 EN

5.2.2 Key Placement Accuracy Points

When describing component shapes, observe the following points for correct placement:

 The group offsets describe the offset for a group of visible features, on the basis of which the body

center is calculated for the placement procedure. Make sure that the group offsets have the same

values for all components which are symmetrical to the center axes.

 The correct offset values will need to be calculated for those components which are not

symmetrically aligned around the center axes (see D-Packs). In this case, the body dimensions

should reflect the actual dimensions, to simplify evaluation of CS tests.

The measurement analysis shown on the screen helps you to assess whether the group offset

values really have the correct dimensions to the body center, thereby ensuring placement accuracy.

ALWAYS check that placement on the board is accurate, as the CAD layout system generally

determines the placement coordinates symmetrically to the center of the pad positions on the PCB.

 When programming, we recommend that you first correct the CS dimensions and then shift these

onto the outer edges of the body. Subsequently, check the lead lengths and group offsets with the

help of the evaluation diagram and the correlation with the camera image.

 Inspection mode allows shape-specific tests, such as the evaluation of body sizes in SIPLACE Vision

(ICOS systems only check this parameter with a SIZE measurement). This prevents COs (Chip

shape) from being placed in an upright position. For this test to work, make sure that the CO body

dimensions have been described correctly and the tolerance description is precise (the lead

dimensions are also processed in inspection mode for molded shapes)!

 The lead spacing is also checked for all Leaded component shapes.

5.2.3 Processing Data

 When programming the camera, do not forget to set the max. field of vision (FOV) data and the

smallest possible lead/Ball structure or smallest pitch (see camera overview at the end of this

document).

 The C&P nozzles have various lengths, so that the bottom edge of the CO can be optimally

positioned in the focal range of the placement head CO camera. A deviation from this is calculated,

displayed and taken into account in the measurement algorithm with C&P head component cameras.

 For optimum processing of COs during the placement procedure, the acceleration and delay values

can be reduced for all axes.

 In addition, the pick and place procedure can be optimized by selecting one of the various positioning

profiles for the Z-axis (Pickup - contactless; Placement - with very high force; Placement - slow

braking; Slow start;...).

 Components smaller than 6 mm should be processed with the pickup mode Early Vacuum .

 Feeder data can be set as default data for the CS (pickup offset ; pickup tolerance; CO availability

time (waiting time ) for the feeder pitch; COs per reel;...). If feeder information has been programmed

for a CO, this will be prioritized for the setup.

 If the pickup tolerance data from the feeder is specified illogically high, this could have a negative

effect on the measurement procedure (feature search range will be too great).

ATTENTION:

Shifting the group offset values means that the centering procedure in the ICOS

system will now apply a placement offset identical to the value entered.

Component Shapes

Unleaded Component Shapes Specific Component Shapes

Student Guide SIPLACE Vision (Customer)

Edition 12/2008 EN Component Shapes

5.3 Specific Component Shapes

The following pages describe the key component shapes with programming information for SIPLACE

Vision.

The last item in each case, dataset, refers to the SIPLACE Pro option in which datasets for SIPLACE

Vision and the older ICOS Vision systems can be managed separately. The Requires separate group

description checkbox creates separate folders for these datasets. Only enable this checkbox if you are

unable to assign separate descriptions to these datasets. Using this option too often will increase your

data management work.

5.3.1 Unleaded Component Shapes

Definition

Components, which have no leads or which have leads situated inside the body dimensions, will be

specified as unleaded shapes in this section.

In these cases, SIPLACE Vision will not perform lead measurement (exception: extensions 702 SW).

 From SC/MC 702 (SV 4.0.1) (see: New SV functions 702), BareDie and molded components can

also be used for face down recognition (non-specific component features), in addition to the CHIP

components.

CHIP and molded CSs have an additional lead length inspection.

Measurement procedure

The component position and angle at the nozzle are determined through gradient formation and various

other steps. In a second step, the body dimensions are determined through gradient formation and other

measurement steps.

Component Shapes

Specific Component Shapes BareDie Component Shape

Student Guide SIPLACE Vision (Customer)

Component Shapes Edition 12/2008 EN

5.3.2 BareDie Component Shape

JEDEC description

 Since there are no leads on the underside of the component, a group description is not required.

Lead description

 There are no leads which need to be recognized.

 The measurement method used is Body Dimension Check (no multiple measurement possible).

Special features

 BareDies are component shapes which are connected or bonded (i.e. with gold wire) from the top

side.

 BareDies must be symmetrical. In contrast to the ICOS system, SIPLACE Vision does inspect this

optically visible symmetry.

 Since the component needs to be centered with the help of body dimension measurement,

inspection mode is set as a default.

 The back surface is highly reflective. It needs to be illuminated with an illumination angle of 0°, to

ensure that this mirror reflects correctly.

 MFU ceramic components are a special type of BareDies.

The illumination of the BareDie defaults needs to be changed from steep to flat for these

components.

Joint datasets with ICOS data possible:There are no fundamental differences during evaluation.

Due to the very simple programming method, ONLY involving body size, NO component shape wizard

is offered for BareDie programming.

SW extensions: FaceDown recognition (See: New Siplace Vision Functions 702).can be programmed

and from SC 702.01 SW (SIPLACE Vision 4.1).

Body description: rectangular.

 The Z height of the body determines the measurable height

in the CO sensors.

 The X/Y body dimensions determine the field of vision, the

Region of Interest.