00195679-02_AI_XPS_DE+EN.pdf - 第87页
29 Assembly Instructions 5 Mounting the XPS SIPLACE X-Series Productivity Shuttle T y pe I/II 5.5 Cover over the Transfer Openings 7. Adjust the adjust able feet so that the XPS is in the water and the printed -circuit b…
5 Mounting the XPS Assembly Instructions
5.4 Aligning the XPS SIPLACE X-Series Productivity Shuttle Type I/II
28
2. Remove the transport lock on the shuttle.
3. Connect the XPS to the power supply system and switch it on at the main switch.
4. The SIPLACE X-Series can now be switched on again if required, for example, to adjust the
transport width.
5. Start with Track 1. Manually move the shuttle conveyor of the XPS to the appropriate position;
the fixed stops of both conveyors must match up. Refer to the operating manual for the XPS
for this.
6. Place two printed-circuit boards on the shuttle conveyor and one printed-circuit board on Track
1 of the inlet/outlet conveyor of the placement system. Place the precision spirit level on the
printed-circuit boards on the shuttle conveyor.
NOTE
The widths of both machines should be adjusted to the width of the printed-circuit boards you
are using for this adjustment. Follow the procedure for this in the operating manuals for the
machines.
The shuttle is secured for
transport.
The toothed drive belt is
held together with a clamp.
Precision spirit level
29
Assembly Instructions 5 Mounting the XPS
SIPLACE X-Series Productivity Shuttle Type I/II 5.5 Cover over the Transfer Openings
7. Adjust the adjustable feet so that the XPS is in the water and the printed-circuit boards can be
slid from the shuttle conveyor onto Track 1 of the placement system without tipping and
colliding.
8. Repeat the procedure for Track 2.
9. Check the adjustments for tracks 1 and 2 again and make corrections as necessary.
10.Remove the printed-circuit boards used for the adjustment and the precision spirit level.
11.Switch off the XPS again at the main switch and disconnect it from the power supply system.
5.5 Cover over the Transfer Openings
The transfer opening on the SIPLACE X-Series Productivity Shuttle (XPS) must always be
covered with the plates provided, except for the necessary printed-circuit board width. This applies
to the input module (at the inlet), the end module (at the outlet) and every transfer opening of each
XPS that does not adjoin a SIPLACE placement system.
Figure 5 - 1 Cover over the Transfer Openings: Minimum Printed-Circuit Board Width
Attach the cover plate according to the your requirements (printed-circuit board width).
Minimum printed-
circuit board width
Input module,
view in pass-
through direction
5 Mounting the XPS Assembly Instructions
5.5 Cover over the Transfer Openings SIPLACE X-Series Productivity Shuttle Type I/II
30
The cover plates are both the same size. The opening width is adjusted by means of the oblong
holes and, if required, by shifting over one screw hole.
Figure 5 - 2 Cover over the Transfer Openings: Maximum Printed-Circuit Board Width
The opening is opened up to the maximum. Both plates are kept in the position shown below.
NOTE
This adjustment is only permissible for the intermediate module and cross module equipment
types, that is, these XPSs are located between two SIPLACE placement systems.
Figure 5 - 3 Cover over the Transfer Openings: Maximum Opening Width
Maximum printed-
circuit board width
Input module,
view in pass-
through direction
Maximum opening
Intermediate
module,
view in pass-through
direction