JUKI KE775点胶机说明书1.pdf - 第18页

CHAPTER1GENERAL 1ˉ 1ˉ 7.Printed circu∶ t board specifications ■ BOard sIze ■ BOard thickness ■ BOard warp ■ Board Ⅱ mⅡ a刂 ons ⊥ 3mm T Min.board size∶ X50mmXY30mm Note1 MaX,board size∶ X410mmXY360mm Note2 X∶ Along the mov…

CHAPTER1GENERAL

1ˉ 1ˉ5。

AppⅡ cable adhesive and syⅡ

nge

The appⅡ

cable adhesiVe is the SMT mounted componenttemporary fixing type."sha"be f"led in the spec亻

ied

syringe vv"h bubbIes Completely eⅡ

minated.

Sy"nge∶

30mltype(PS30N)rna-e bylwash"a EngineeⅡ

ng Co,Ltd.

Recommendable adhesive∶

L0CKTITE3609

∵

∷

∵

Hereus PD959

somarlRˉ

120H

Note1: We re0oⅡ

lmend that you use the adhesive f:I】

ed bythe:nanufacturer ofthe adhesive.If you want

to fi"the adhesive,be sure to use the specia卜

purpose adhesive repIacing tooI so that a∶

r Ψv∶ Ⅱ not

be:n:xed in the adhesiˇ

PresentIy,theˇ

a"dity perIOd is marked on most packages,so use the adhesive carefu"y。

AIso,note that the adhesive storage environment(i.e.st°

rage at a low temperature in a

refrigerator).

Note1: When using the adhesiˇ

e at O.1s(per°

ne shot),the adhesive we recon1mendis of L0CKTITE

3609.

1+6。

AppI∶

cabIe parts

TabIe1ˉ

1ˉ 3AppⅡ

cabIe parts

Pa吐s name and shape

square chip resistor

1608,2012,3216,3225(5025,6432)

Net work resistor(eXCluding sOP,S0J,PLCC types)

R/lELF resistor 1,6x¤

1。 0,2.OX¤

1,25,3‘

5x¤

14,59X¤

2.2

Lam∶ nated ceramiC capacitor 1608,2012,3216,3225,4532,5750(5632)

TantaIunη ohip capacⅡ

3216,3528,6032,7343

Aluminum eIectroIytic capaC"or Height

Chip

ⅡIm capac"or

Vaoable tHmmer capac"or,chip poten廿

o meter,t"mmer

Chip ferrite beads

Chip induCtor

SOT

mold podion 1608/2012,s0Tˉ

23,s0Tˉ

89,sOTˉ

143,sOTˉ 223

s0P

8,14,16,18,20,24,28,32,40pin

s0J★

16,18,20,24,26,28,32,40pin

Note

PLCC* 18,20,22,28(square),28(rectangIe),32,44,52,68,84pin NOte

QFP,BQFP

o.3/0.4/0.5/0.65/08/1.Omm□

∶50mm orIess

COnneCtor P"ch

∶0,4mm or greater and□

150mm orIess

Note

IC soCket PⅡ

ch ∶05mm or greater and□

50mm orless

NOte

N°

te)specia"yˉ

ordered needle is app"ed.

1ˉ 6

CHAPTER1GENERAL

1ˉ 1ˉ7.Printed circu∶

t board specifications

■

BOard sIze

■

BOard thickness

■

BOard warp

■

Board ⅡmⅡa刂 ons

⊥

3mm

Min.board size∶

X50mmXY30mm Note1

MaX,board size∶

X410mmXY360mm Note2

X∶ Along the movement

σ the board

Y∶ From frontto rear(and reverse丨

yl o"he machine

NOte1 : When the aut0matIc、

″idth∶

adjustmentfunction is provided,min,borad

s∶

zeis X50mmxY40mm.

NOte2: Atthe t∶

me ofO.1s(per shot),max,board size∶ sX180口nm XY15o

mm.

Min,0.4mm(when O,1s(per shot),min,1,6mm)

Max4,Omm

NOte1: ProduCt∶ on mounting PVVB On the pa"et(jig board),etc.cannot be

pe亻

ormed.Consu"JUκ

l orthe agents、 ″hen using the paⅡ

et.

NOte2: When centering(cIamp∶

ng)PWB Of2Ⅱ,m thick or more,adjustment

ofthe backˉ

up table up'down sensor∶ s required.

Free state∶

∪

pward max,05mm wⅡ

h pre丬 oad component

Max1.Ommw"hout preˉ

load component

DOwnward max。

5mm

At cente"ng∶

Upward max.0,5mmw"h preˉ

load component

Max.1,O mm wⅡ

hout pre丬

oad component

DoWnWard max,O mm

orced bythe backˉ up)

Note1:、

″ith rnaX.board size,for others,the value is proport∶ onalto diagonaI

Iength.

Direction of board flow

Dispensing not

p°

ssibIe in this area

(H。

wever,there‘

aⅡ

m"depending on n∞

dle angle,)

Transport ra"fixed side standard5±

0.1

50to410mm

Note:Dimensions atthe t"η

e of de"very from factory

Fig.,ˉ

1ˉ 1BOard I∶

mitationsˉ 1

¤2.5to g4喟

勺

¤6 Dispensing not op刂

onaI:5to7mm

lHOweve1there⒗

aⅡm1depending on n∞

dle

1ˉ 7

CHAPTER1GENERAL

■

BOard Recognition Marks

Make the board recogn"ion rnarks underthe beIowˉ

mentioned cond"ions‘

(FIg,1ˉ

1ˉ 4)

Recommend,however,thatthe shape is a circIe which is evenIy painted black.

In addition,the Clearance area around the rη

ark is in the range as shown in the Fig.1ˉ

1ˉ

5,and in this area,there

should not be any components such as s"k,strip Iine(including inner pauern),through hole,resist,etC。

田mension A:1to3mm± 0.1mm

Dimension B:0.2±

0.03mm

Dirnension C:0.5to3mm± 0.丬 mm

F:g.1ˉ 1ˉ

4shape of mark

NOte) 1・ AngIe of the mark shouId be in the

aforement∶ oned direction at the time of

recogn;tion.

2."is reCoΠ 1mended thatthe fiduciaIin one

piece ofthe board should be the same

shape and the same size.

3.Recogn"ion∶

s possibIe ifthe processing

is of copperfo∶

I Or solder pIating.

4.Max。 number of registrations

Board mark1set(2°r3marks)

5.RegistabIe items

Gravity center detect window

Norma∶

'back revoIution at the time of

detecting

shape of mark

outer dimension

寺

o.s mm or greater

o.5mm or greater

Fig.1ˉ

⒈5CIearance area

1-9