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User Manual SIPLAC E S-25 HM 5 Station extensions Software Vers ion SR.503.xx 04/2002 US Edition 5.13 Component s ensor 207 5.13 Com ponent se nsor 5.13.1 Function The com ponent se nsor is fixe d to the und erside of th…
5 Station extensions User Manual SIPLACE S-25 HM
5.12 DCA vision module on the 6-segment Collect&Place head Software Version SR.503.xx 04/2002 US Edition
206
5.12.1 Description of the 6-segment Collect&Place head with
DCA vision module
With the DCA vision module, the 6-segment Collect&Place head is able to optically center and
place components of the order of magnitude of 0.6 mm x 0.3 mm to 13 mm x 13 mm. The DCA
package optimizes the speed and accuracy when placing high-speed flip chips and bare die
components.
5.12.2 Technical data for the 6-segment Collect&Place head with
DCA vision module
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PLEASE NOTE 5
The technical data for the DCA vision module is given in section 5.11.3 on page 204. 5
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Component range 0201 to 13 mm x 13 mm
Component specification
Max. height
Min. lead pitch
Min. bump pitch
Min. ball/bump diameter
Min. dimensions
Max. dimensions
Max. weight
8.5 mm
0.4 mm
0.2 mm
0.11 mm
0.6 mm x 0.3 mm
13 mm x 13 mm
5 g
Travel of the Z axis max. 16 mm
Programmable placement force 2.4 to 5.0 N
Nozzle types 8xx, 9xx
Max. placement rate 8.500 components/hour
Angular accuracy ± 0.4° / 4
σ
Placement accuracy of the DCA vision module ± 70 µm / 4 σ
User Manual SIPLACE S-25 HM 5 Station extensions
Software Version SR.503.xx 04/2002 US Edition 5.13 Component sensor
207
5.13 Component sensor
5.13.1 Function
The component sensor is fixed to the underside of the casing of the 12-segment Collect&Place
head (see Fig. 5.13 - 2). It measures the height of the nozzle and the height of the nozzle with the
component. The component height is then determined from the two values. The sensor thus also
checks that the component is actually present.
Component heights from 0.1 to 4 mm can be checked. It is also possible to determine whether
the component is in its normal position or is sticking to the nozzle on edge. This requires the dif-
ference between the height and width of the component to be at least 100 µm, i.e. component
sizes 0603 or larger.
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Fig. 5.13 - 1 Component sensor
To the
‘head gantry distribu-
tor’ board
Infrared LED
Phototransistor
(receiver)
5 Station extensions User Manual SIPLACE S-25 HM
5.13 Component sensor Software Version SR.503.xx 04/2002 US Edition
208
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Fig. 5.13 - 2 Placement head with component sensor
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The green control LED lights up if the component sensor is switched on and the invisible IR light
beam for the component height measurement (see Fig. 5.13 - 2 red strip) is not interrupted. You
can interrupt the IR beam to check that it is working correctly, in which case the green LED must
go out.
Green control LED