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6 Product / Package Form User’s Manu al Line Computer UNIX 6.1 Package Form Editor Software Version 403.xx Edition 06/ 97 6 - 16 6.1.2.7 P ackage Form Editor Selection Fi elds - "Handling data" Display In the s…

User’s Manual Line Computer UNIX 6 Product / Package Form

Software Version 403.xx Edition 06/97 6.1 Package Form Editor

6 - 15

Opening the window for entering or changing model data

●

Select desired pin or ball by (quickly) double-clicking.

The window for editing the model data is opened (see Fig. 6.1.17 and Fig. 6.1.22).

NOTE

The window for editing the group or model data can also be opened using the commands "Group"

or "Pin/Ball" (see section 6.1.2.4).

6 Product / Package Form User’s Manual Line Computer UNIX

6.1 Package Form Editor Software Version 403.xx Edition 06/97

6 - 16

6.1.2.7 Package Form Editor Selection Fields - "Handling data" Display

In the selection fields a button is located next to each "handling type" (see Fig. 6.1.4).

The required "handling type" can be activated or deactivated by clicking on the corresponding button.

Selection field "Handling instructions"

This field serves to define the type of handling a component type will be subjected to during the placement

cycle.

Vacuum test during pick-up When the component is picked up sensors are used to

check whether the component has been picked up.

Vacuum test during placement Prior to being placed, the component is interrogated by means

of sensors to verify that the component is still attached to the

nozzle.

Coplanarity check The coplanarity laser module determines by means of co-

planarity measurement whether pins of the component

are bent and whether it may have to be discarded.

Good nozzle contact In the case of cubic components, this setting provides

good nozzle contact by means of adequate vacuum supply.

Selection field "Centering"

This selection field serves to define the type of centering suited for the component type. For this purpose, the

setting "Centering in head" or "External centering" can be chosen from. Moreover, the centering procedure for

the particular centering type can be defined.

- Centering in head

The component is centered by means of the revolver head or the

placement head on the HS-180 if any one of the following three

options is selected in addition.

with H jaws mech. centering by means of h-jaws (measuring jaws) of the

placement head of the HS-180.

with Z jaws mech. centering by means of z-jaws of the placement head of

the HS-180.

with camera optical centering by means of the component camera of the

revolver head.

User’s Manual Line Computer UNIX 6 Product / Package Form

Software Version 403.xx Edition 06/97 6.1 Package Form Editor

6 - 17

- External Centering

The component is centered externally by means of appropriate

centering devices of an HS-180, or by means of the IC camera

or flip-chip camera of a SIPLACE 80F3/F

optical The component is centered by means of the optical centering

station of an HS-180, or by means of the IC camera or flip-chip

camera of a SIPLACE 80F3/F

mechanical The component is centered using the mechanical centering

station. (function is not currently used)

Rotate before centering The component is turned into placement position prior to being

measured (centered) by means of the optical centering station of

an HS-180 or the IC camera of a SIPLACE 80F3/F

(by 90°, 180° or 270°)

Selection field "Reduced acceleration"

When the setting "Special handling" is activated in the selection field you can reduce the speed at which the

placement head moves when performing pick-up, centering or placement operations along the x, y, z and

d-axes. It is thus possible to handle and and place also large components (e.g. PLCC's 84) securely.

- Special handling

"Special handling" is defined for the pick-up, centering and

placement cycles of a component.

Z during pick-up reduced acceleration of the z-axis of the RV or IC head

on picking up the component from the pick-up position

X during centering reduced acceleration of the X-axis during transporting the

component from the camera to the placement position by means

of the IC head

Y during centering reduced acceleration of the Y-axis during transporting the

component from the camera to the placement position by means

of the IC head

D during centering reduced acceleration of the dp1- and dp2-axes of the RV head

and of the d-axis of the IC head upon centering the component

X during placement reduced acceleration of the X-axis during transporting the

component from the pick-up to the placement position by means

of the RV head

reduced acceleration of the X-axis during transporting the

component from the IC camera to the placement position by

means of the IC head

Y during placement reduced acceleration of the Y-axis during transporting the

component from the pick-up to the placement position by means

of the RV head

reduced acceleration of the Y-axis during transporting the

component from the IC camera to the placement position by

means of the IC head