AppX.A_spec_mx3600_sys_10.11.pdf - 第14页
MX - 3600 / CXI3600M X / Specification confidential 14 / 39 spec_mx3600_sys_10.11.doc 2.3. Motion System 2.3.1. Load/Unload Hand ling The load/unload section is designed f or high s peed through put. F or fas ter load an…
MX-3600 / CXI3600MX / Specification
confidential 13/39 spec_mx3600_sys_10.11.doc
2.2.5. Image Geometry & Resolution
The MX-3600 Image Geometry (Magnification) can be continuously
programmed between 15.0 mm to 26.5 mm Field of View Size (FOV) by
changing FOD (Focus to Object Distance).
This is realised in the MX-3600 by the programmable z-axis motion for the X-
RAY tube.
Fig.8: Image Geometrie
FOD Focus to Object Distance
FDD Focus to Detector Distance
FOV Field of View
Table 1: Max. FOV-Geometries
FOV (mm)
FOD (mm)
FDD (mm)
Mag.
lp/mm
µm/Pixel
25,5
200
400
2
16
25
12,5
66,7
266,7
4
>20
12,5
Table 2: Typical FOV Setup for SMT applications
The comparison to the CXI systems displays the advantages in respect of
resolution and FOV-size of the CXI (MX) and X2 systems versus the old
CXI3600 standard setup.
MX-3600 / CXI3600MX / Specification
confidential 14/39 spec_mx3600_sys_10.11.doc
2.3. Motion System
2.3.1. Load/Unload Handling
The load/unload section is designed for high speed throughput. For faster load
and unload cycles a board buffering in the input and output conveyor is used.
During the inspection and load/unload cycle the X-Ray power is permanently
one, which is saving x-ray ramp-up and down cycles. Via timer the X-Ray
switches in stand-by mode, if no sample board is loaded.
Status definitions in the MX-3600 load/unload system:
IC Status/Input - Conveyor
XY-T Input Conveyor to Table
OC Status/Output-Conveyor
Table 3: Summary of all process-steps for load/unload of inspection sample:
Load/Unload Step
IC
XY-T
OC
X-RAY
SMEM
A
Inspection
Unload Board from
XY-T to OC
loaded
Load to
free
free to
load
Beam-On
Ready
No
Move XY-T to IC
loaded
Free
loaded
Beam-On
Busy
No
Load Board from IC
to XY-T
load to
free
free to
load
load to
free
Beam-On
Busy
No
XY-T inspection
move
free to
load
loaded
free
Beam-On
Stop
Active
Auto Beam-Off
Cycle
IC
XY-T
OC
X-RAY
SMEM
A
Inspection
Unload Board from
XY-T to OC
free
Load to
Free
Free to
load
Beam-On
Stop
No
Move XY-T to IC
Free
Free
loaded
Beam-On
Stop
No
Load Board from IC
to
XY-T
Free
to
free
Free to
free
Load to
free
Beam-Off
Ready
No
Optional:
Dual Board Load:
two boards are loaded on-to the x/y table to run inspection mode
together !
dual load board size: 2 x (200mm x 305mm) or (8’’ x 12’’)
time saving effect: approx. 3-4s per board!
(close to half loading cycle / 1 loading cycle = 8s)
MX-3600 / CXI3600MX / Specification
confidential 15/39 spec_mx3600_sys_10.11.doc
Key-Features of the MX-3600 load/unload and handling system:
Load/unload board buffering in input and output conveyor
No-shutter times because of long external conveyor
Beam-On/Off cycle generates zero ramping time loss
Table 4: Load/Unload Handling Parameter
Parameter
Input-Section
Output-Section
Total
Load-Unload Time
<4s
<4s
< 8s
Top Clearance (incl.
Board thickness)
Optional:
up to 12,5 mm
15 mm
up to 12,5mm
15mm
up to 12,5mm
15mm
Bottom Clearance
up to 37,5mm
up to 37,5mm
up to 37,5mm