AppX.A_spec_mx3600_sys_10.11.pdf - 第6页

MX - 3600 / CXI3600M X / Specification confidential 6/ 39 spec_mx3600_sys_10.11.doc 1.2. General S y stem Setup Capabili ties & Interfacing  Standard Production T ype (Standard) : automatic / in -line Optional: au t…

MX-3600 / CXI3600MX / Specification

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Fig.1: In-Line Configuration with Pass-Through In/Out Conveyor

Fig.2: Operator Terminal with 19’’ Flatpanel

Fig.3: ASYS Autowidth Conveyor

MX-3600 / CXI3600MX / Specification

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1.2. General System Setup Capabilities & Interfacing

 Standard Production Type (Standard): automatic / in-line

Optional: automatic / off-line

 Inspection Technology (Standard): 2D / Transmission X-RAY

Optional: AOI for selective components

 Sample Load (Standard): Pass Through Conveyor

Technology

Optional: manual load (only with off-line

option)

 Handling- Interface (Standard): SMEMA

Optional: Customized Handshake

Interface

 Inspection Type (Standard): 100% inspection with data

and result output after

complete board inspection

Configurable with standard system: sample mode or conditional

failure mode!

 MIPS_Verify Link (Standard): Network Link to verification

and repair station incl.

Pass/Fail Select

Optional: Additional Verification Stations

Fig.4: AXI System with verification/repair process flow

MX-3600 / CXI3600MX / Specification

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1.3. MX-3600 / Inspection Functionalities

1.3.1. Inspection Process Requirements

 Post Reflow – Conveyor In-line Interfacing (SMEMA)

 Lead Free solder inspection capability

 Scan barcode for ser. number and product type

(top and bottom reader capability)

 Select inspection program via barcode or by central line server data

input

 Multi-Panel inspection capability

 Solder Joint and Component Inspection

 Result Data Report (Defect Tag, X-RAY Image, Measurement data by

request

 Sample board parameters:

Thickness: 0,8mm up to 5mm

Material: FR4 or similar

Warpage: <= 1 % of diagonal distance

Board edge 3mm

1.4. MX-3600 / System States

The following states are possible as result of an inspection process:

 Pass

No defects found, or defects left after full inspection run.

 Fail

There are pending defects found by an inspection system..

 Fail Overflow

The inspection system can set this state for a module with to many defects (in

this case are the individual defects not stored!).

 Fiducial-Fail

This state can only be set by an inspection system, if the fiducial test had

been failed. There are no individual defect records and the board does

typically need to be re-inspected until this error does not occur anymore

 Board-Check Fail

A special multi panel case – if a panel board check fails – the inspection will

stop and jump to the next panel and start with inspection process again. If the

last panel fails – the inspection is finished – the board will send out!