AppX.A_spec_mx3600_sys_10.11.pdf - 第31页
MX - 3600 / CXI3600M X / Specification confidential 31 / 39 spec_mx3600_sys_10.11.doc 4.3. Slice- Filter Technique (SFT™) The new (3D) Slice -Filter Techni que provides the capabilit y for double -sided PCB-assem bly ins…
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4.2. MIPS_Inspect / X-RAY Solder Joint Inspection Algorithm
Library (MIPS_SJ-L)
The core of the inspection process is the algorithm library for solder joints and
components.
A detailed description and specification of the algorithm are documented in:
SMT/THT X-RAY Inspection algorithm specification
MX3600-Algorithm Manual
An overview about the inspection capabilities and the defect classes is
documented in:
AppendiX: F Solder joint inspection & component defect library
(attached to this document!)
The classification techniques for the defect detection are shown in
Fig. 17: Inspection program generation with Gencad Cad Import
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4.3. Slice-Filter Technique (SFT™)
The new (3D) Slice-Filter Technique provides the capability for double-sided
PCB-assembly inspection of 2 x Reflow processed boards.
Fig.18: SFT Principle
Fig. 19a: Processed Slice-Filter Example
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Fig. 19b: Processed Slice-Filter Example
4.4. AXI Inspection Criteria’s
The inspection performance is related to the following key parameters:
Defect detection rate (related to solder-joints and components)
False Calls (related to solder-joints and components)
Repeatability (according detection rate results)
The specific HB inspection criteria’s are defined in AppendiX G.
4.5. X-RAY dose test (optional item)
The X-Ray dose test is providing the information about the typical and max.
radiation dose range during an automatic inspection.
Version A: Dose test according automatic inspection run – one direct shot with
max. of SMT solder-joint inspection plus 100 side view shots
simulating the PCB inspection shot portfolio.
Version B: Dose test according repeat view cycling: 10 repeat views with direct
shots !
The dose test results incl. the radiation levels are documented in test report
AppendiX: H