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MX - 3600 / CXI3600M X / Specification confidential 30 / 39 spec_mx3600_sys_10.11.doc 4.2. MIPS_Inspect / X-RAY Solder Joint Inspection Algorithm Library (MIPS_SJ- L) The core of the inspec tion process is the alg orithm…

MX-3600 / CXI3600MX / Specification

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4. MX-3600 / Application Features

4.1. Fiducial Test (Pass Marking Test)

The fiducial test should run before starting inspection of a new PCB sample or

any other sample what has potential fiducial points on it. The fiducial test can

correct the following in-tolerances in the inspection process:

 Sample board is not (unparallel,..) in correct loading position

 Sample board is slightly bent during clamping

 Board warpage, which effects the x-y positions

 Board outside dimensions are slightly off as result of an intolerant de-

panelisation process

The following fiducial types can be used:

 Layout printed fiducials (dark contrast check) – soldered or unsoldered

like cross points, double cross points, circle, ring, squares, …!

 Layout based drilled hole fiducials – like drilling holes and vias.

Fiducial test principle:

The fiducial test is correcting the off-positions from

the ideal CAD position coordinates by searching in

a predefined search window the specified fiducial-

pattern (in the example fig. 16 a dark circle) – after

locating the fiducial the object will be centred.

This procedure needs to be done at least at one

more fiducial ideally 3 or 4 fiducials. The detected

centre point coordinates are then processed and

corrected against the machine based cad point

position. The results of the fiducial calculation

process are shown in table 8.

Fig. 16: Fiducial object with search

window and cad point (red cross)

Fiducial test result to be used for X-Y CAD position correction:

Table 8: fiducial test result data

Fiducial Test

DeltaX

Corrected Fid. Cad X-Position

DeltaY

Corrected Fid. Cad Y-Position

FiducialError

= 0 Fid.-object successfully located

= 1 no Fid. Object detected or

multiple objects detected

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4.2. MIPS_Inspect / X-RAY Solder Joint Inspection Algorithm

Library (MIPS_SJ-L)

The core of the inspection process is the algorithm library for solder joints and

components.

A detailed description and specification of the algorithm are documented in:

 SMT/THT X-RAY Inspection algorithm specification

 MX3600-Algorithm Manual

An overview about the inspection capabilities and the defect classes is

documented in:

 AppendiX: F Solder joint inspection & component defect library

(attached to this document!)

The classification techniques for the defect detection are shown in

Fig. 17: Inspection program generation with Gencad Cad Import

MX-3600 / CXI3600MX / Specification

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4.3. Slice-Filter Technique (SFT™)

The new (3D) Slice-Filter Technique provides the capability for double-sided

PCB-assembly inspection of 2 x Reflow processed boards.

Fig.18: SFT Principle

Fig. 19a: Processed Slice-Filter Example