RX-8_SPE_EN.pdf - 第16页
12 4-5 Appl icable comp onents 4-5-1 P 20 nozzle head Component na m e Component type Compon ent size Square c hip res istor Square c hip com ponent/ Outlin e recognit ion compone nt 0201 ( N ote 1 ), 03015 ( N ote 1 ) ,…
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Number of nozzles that can be stored
Equipped with a P20 nozzle head:
Up to two spare ATCs each of which stores 20 nozzles can be set in the unit.
* Up to 1/unit in standard, up to 2/unit can be set when OPTION is installed.
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4-5 Applicable components
4-5-1 P20 nozzle head
Component name
Component type
Component size
Square chip resistor
Square chip component/
Outline recognition
component
0201 (Note 1), 03015 (Note 1),
0402, 0603
○
1005, 1608, 2012, 3216, 3225,
5025
○
6432 -
Network resistor
（Excluding an SOP, SOJ
and PLCC types
）
Network resistor/ Outline
recognition component
□5mm or less
Height 3mm or less
○
MELF resistor
MELF / Outline recognition
component
1.6×φ1.0, 2.0×φ1.25, 3.5×φ1.4,
○
Laminated ceramic
capacitor
Square chip component/
Outline recognition
component
0402, 0603 ○
1005, 1608, 2012, 3216, 3225 ○
4532 ○
Tantalum chip capacitor
Square chip component/
Outline recognition
component
3216, 3528 ○
6032, 7343 -
Aluminum electrolytic
capacitor
Aluminum electrolytic
capacitor
-
GaAsFET GaAsFET
□
5mm or less
Height 3mm or less
○
Chip film capacitor
Square chip component/
Outline recognition
component
□5mm or less
Height 3mm or less
○
Variable trimmer capacitor,
Chip potentiometer, trimmer
Outline recognition
component
□
5mm or less
Height 3mm or less
○
Chip Ferrite Beads
MELF / Outline recognition
component
1005, 1608, 2012, 3216, 3225
type cylinder
○
Chip inductor
Square chip component/
Outline recognition
component
1005, 1608, 2012, 2520, 3216,
3225
○
SOT SOT
□
5mm or less
Height 3mm or less
○
SOP, TSOP, HSOP SOP, TSOP, HSOP -
SOJ SOJ -
PLCC PLCC -
QFP, BQFP, QFN QFP, BQFP, QFN -
BGA BGA
Ball diameter: 0.25 mm or more
Ball pitch: 0.4 mm or more
○
FBGA FBGA -
Note 1) For the nozzles for 0201 and 03015, contact our sales office.
Note 2) Lead/BGA components whose size is □5mm and whose thickness is 3 mm or less are
supported.
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4-6 Component placement accuracy
4-6-1 P20 nozzle head
• The component placement accuracy is determined with considering 20 nozzles in total and that of
each axis is not regulated.
• If you change the setup of the machine, this accuracy shall be applied to the second use of nozzles
(that is, the 21
st
and subsequent component placements) after all nozzles finish placing components
once.
• The ball diameter of BGA, 0.25 mm and, the pitch are 0.4 mm or more.
(1) Component placement position
(Unit: μm)
P20 nozzle head
(20 nozzle)
Square chip 0402R/0402C
±40
Square chip 0603R
±40
Square chip 0603C
±40
Square chip 1005R/1005C
±40
Square chip 1608
(for reference) ± 80
Square chip 2012 or larger
(for reference) ±100
Edge light LED
(for reference) ±150
CPK ≧ 1 or more shall be applied to a 0603R only.
(2) Component placement attitude accuracy
P20 head placement attitude accuracy (Unit: º)
Square chip 0402R/0402C
±3
Square chip 0603R/0603C
±3
Square chip 1005R/1005C
±3
Square chip 1608 or larger
(for reference) ±2.5
Edge light LED
(for reference) ±2.5
CPK ≧ 1 or more is not regulated.