RX-8_SPE_EN.pdf - 第23页

19 4-7-5 Board position correcting f unction Board positioning Reference for positioni ng a board Standard specificatio ns (without a stopper): the machin e stops a board at a target position by detecting the board edg e…

4-7-3 Allowable warpage of a board

4-7-4 Available area for placing a component on the topside and rear side of a board

As shown in the figure below, the machine cannot place any component in the area 3 mm from each

edge of a printed wiring board.

The maximum height of a component mounted on the rear side is 26 mm.

Component placement direction

Board

Flow

direction

Conveyor rail

section

Component installation

range that permits use of

the device

Board D

Board T

Board W

Bottom

side

26 mm

4-7-5 Board position correcting function

Board positioning

Reference for positioning a board

Standard specifications (without a stopper): the machine stops a board at a target position by

detecting the board edge.

Field of vision for recognizing a board reference mark

Field of vision of a camera: 14.2 × 10.7 mm

Depth of focus: ± 2 mm

Note: The values indicating the field of vision are the designed values. They do not match the

values of the actual machine completely.

Size of the window for recognizing a board reference mark

Although this size can be changed, you have to secure a clearance between a recognition mark and

its surrounding area as described in the sections “Shapes and dimensions of a recognition mark”

and “Clearance of a recognition mark.”

How to correct a recognition mark

Reference mark: Two or three (see Note) marks located on a board to correct the entire board.

When the machine detects two reference marks, it corrects the positioning, angle and

expansion/contraction of the entire board. When detecting three reference marks, it corrects the

perpendicularity in the X and Y direction also.

Note: The position of each mark is arbitrary. However, when three marks are located on a board,

they shall not be located in alignment with one another (it is recommended to locate these marks at

any of four corners of a board respectively.)

Basic material of a recognition mark

• The material of a recognition mark shall be uncoated copper or coated copper. (See the

description “Coating of a recognition mark” for coating.)

• Strong contrast between the surface of a recognition mark and the material used in adjacent

printed circuits is required.

• Any recognition mark shall not be oxidized and its material shall not become inferior.

Coating of a recognition mark

The surface of a recognition mark shall be coated as follows:

• Copper foil (may not be recognized depending on its oxidation or corrosion state.)

• Solder coat (may not be recognized depending on the solder shape or its surface condition.)

14.2 mm

10. 7 mm

Recognition mark

Board

Field of view for recognizing a board

Shapes and dimensions of a recognition mark

A recognition mark shall conform to JIS C5010 “General rules for printed wiring boards” and

JPCA-PB01-2004 “Printed Wiring Boards.”

The standard marks represent 12 shapes as shown in the following figure, “Shapes of recognition

marks.”

Shapes of recognition marks

A: 0.4 mm or more but 2.0 mm or less

B: Width of 0.2 mm or more

The size of mark is limited.

Clearance of a recognition mark

There shall be a space in which any other marks such as a conductor pattern, a solder resist and a

marking are not located around each recognition mark. It is preferable that the dimensions of this

space are larger than those of a square by 0.5 mm or more viewed from the outside of a recognition

mark.

Clearance of a recognition mark

0.5 mm or more

0.5mm or more 0.5 mm or more