RX-8_SPE_EN.pdf - 第17页

13 4-6 Component placement accuracy 4-6-1 P 20 nozzle head • The component pl acement accur acy is determined with consid ering 20 nozzles in tot al and that of each axis is not regulate d. • If you change the setup of t…

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4-5 Applicable components
4-5-1 P20 nozzle head
Component name
Component type
Component size
Square chip resistor
Square chip component/
Outline recognition
component
0201 (Note 1), 03015 (Note 1),
0402, 0603
○
1005, 1608, 2012, 3216, 3225,
5025
○
6432 -
Network resistor
（Excluding an SOP, SOJ
and PLCC types
）
Network resistor/ Outline
recognition component
□5mm or less
Height 3mm or less
○
MELF resistor
MELF / Outline recognition
component
1.6×φ1.0, 2.0×φ1.25, 3.5×φ1.4,
○
Laminated ceramic
capacitor
Square chip component/
Outline recognition
component
0402, 0603 ○
1005, 1608, 2012, 3216, 3225 ○
4532 ○
Tantalum chip capacitor
Square chip component/
Outline recognition
component
3216, 3528 ○
6032, 7343 -
Aluminum electrolytic
capacitor
Aluminum electrolytic
capacitor
-
GaAsFET GaAsFET
□
5mm or less
Height 3mm or less
○
Chip film capacitor
Square chip component/
Outline recognition
component
□5mm or less
Height 3mm or less
○
Variable trimmer capacitor,
Chip potentiometer, trimmer
Outline recognition
component
□
5mm or less
Height 3mm or less
○
Chip Ferrite Beads
MELF / Outline recognition
component
1005, 1608, 2012, 3216, 3225
type cylinder
○
Chip inductor
Square chip component/
Outline recognition
component
1005, 1608, 2012, 2520, 3216,
3225
○
SOT SOT
□
5mm or less
Height 3mm or less
○
SOP, TSOP, HSOP SOP, TSOP, HSOP -
SOJ SOJ -
PLCC PLCC -
QFP, BQFP, QFN QFP, BQFP, QFN -
BGA BGA
Ball diameter: 0.25 mm or more
Ball pitch: 0.4 mm or more
○
FBGA FBGA -
Note 1) For the nozzles for 0201 and 03015, contact our sales office.
Note 2) Lead/BGA components whose size is □5mm and whose thickness is 3 mm or less are
supported.
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4-6 Component placement accuracy
4-6-1 P20 nozzle head
• The component placement accuracy is determined with considering 20 nozzles in total and that of
each axis is not regulated.
• If you change the setup of the machine, this accuracy shall be applied to the second use of nozzles
(that is, the 21
st
and subsequent component placements) after all nozzles finish placing components
once.
• The ball diameter of BGA, 0.25 mm and, the pitch are 0.4 mm or more.
(1) Component placement position
(Unit: μm)
P20 nozzle head
(20 nozzle)
Square chip 0402R/0402C
±40
Square chip 0603R
±40
Square chip 0603C
±40
Square chip 1005R/1005C
±40
Square chip 1608
(for reference) ± 80
Square chip 2012 or larger
(for reference) ±100
Edge light LED
(for reference) ±150
CPK ≧ 1 or more shall be applied to a 0603R only.
(2) Component placement attitude accuracy
P20 head placement attitude accuracy (Unit: º)
Square chip 0402R/0402C
±3
Square chip 0603R/0603C
±3
Square chip 1005R/1005C
±3
Square chip 1608 or larger
(for reference) ±2.5
Edge light LED
(for reference) ±2.5
CPK ≧ 1 or more is not regulated.
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4-7 Specifications of applicable boards
4-7-1 Board transport direction
Rightward flow (transporting from left to right viewed from the front side)
Leftward flow (transporting from right to left viewed from the front side)
4-7-2 Board dimensions and mass
Item
Specification
Transport weight
2.0 kg or less
*Contact us if the weight exceeds the upper limit.
When a board is transferred with a single lane (in Normal PWB mode)
Item
Specification
Dimensions of an
applicable board
When not equipped with a board
stopper
Min.: 50 mm x 50 mm
Max.: 42
0
mm x 450 mm
When equipped with a board stopper
(3) (The stopper is located at a “175
mm” position.)
Min.: 50 mm x 50 mm
Max.: 420 mm x 450 mm
Area of a board in
which a
component can
be placed
When not equipped with a board
stopper
X direction: A component can be placed in the
area ± 175 mm viewed from the center of the unit
according to the board stop position.
Y direction: 3 mm to (“Board width” – 3) mm on the
board front side
When equipped with a board stopper
(3) (The stopper is located at a “175
mm” position.)
X direction: No limitations
Y direction: 3 mm to (“Board width” – 3) mm on the
board front side
Board thickness 0.3 mm to 6.0 mm
When a board is transferred with a single lane (in Long PWB mode)
Item
Specification
Dimensions of an
applicable board
When not equipped with a board
stopper
Min.: 50 mm x 50 mm
Max.: 510 mm x 450 mm
When equipped with a board stopper
(3) (The stopper is located at a “175
mm” position.)
Min.: 50 mm x 50 mm
Max.: 510 mm x 450 mm
Area of a board in
which a
component can
be placed
When not equipped with a board
stopper
X direction: No limitations
Y direction: 3 mm to (“Board width” – 3) mm on the
board front side
When equipped with a board stopper
(3) (The stopper is located at a “175
mm” position.)
X direction: No limitations
Y direction: 3 mm to (“Board width” – 3) mm on the
board front side
Board thickness 0.3 mm to 6.0 mm