200823.TR3000-IRV English Manual.pdf - 第27页
IR AUT O BGA R ework S tation TR3000-IRV Kukjetrading Co., Ltd. 27 6. Ope ration of Dev ic e 6.1 How to Remove Parts It i s for removing parts attached on t he PCB. ① Mount a PCB onto a tab le. P lease chec k a direction…
IR AUTO BGA Rework Station TR3000-IRV
Kukjetrading Co., Ltd.
26
In the mode 2,all the controls are made in the same as in the mode 1. However, when a period of
time for the zone is completed, it moves to the next zone even if a temperature does not reach the
goal temperature.
③ MODE 3 (Special Compensation Mode )
MODE 3is used for ground patterns or BGA operation which has a high reflection rate including
glass and metal BGA. This mode is for controlling temperatures by compensating the infrared ray
release.
This mode is effective for circumstances of which there are frequent errors or temperature does not
rise as expected in the general mode.
If it is used for the general PCB, a board can get burn or damaged. Thus, it should be used
only after setting a profile after measuring a temperature with a thermometer.
④ MODE 4
MODE4 is used when the K sensor on the front of the equipment is attached to the surface near
the BGA on the upper part of the PCB to read and control the temperature.
This is useful when working with a PCB where the size of the PCB is small or it is difficult to
secure the detection area of the infrared sensor due to the structure of the PCB.
When attaching a sensor to the bottom of the BGA, the set temperature is the same. However, if
you install it around the BGA, you need to adjust the setting value lower by 5 degrees, and if you
attach it to the bottom of the PCB, you can use it by setting it higher by 10 degrees. For example,
for a setting of 240 degrees, set it to 235 degrees when attaching around the BGA, and to 250
degrees when attaching to the bottom of the PCB.
If the sensor attached to the surface of the PCB is lifted or dropped, the control temperature may
change, so the sensor must be stably attached to a place where there is no foreign matter.
IR AUTO BGA Rework Station TR3000-IRV
Kukjetrading Co., Ltd.
27
6. Operation of Device
6.1 How to Remove Parts
It is for removing parts attached on the PCB.
① Mount a PCB onto a table. Please check a direction for mounting. There must be no reflective metal
parts or holes in the part that the sensor reads.
② Press a center button. Then, a vision head moves to be in alignment with the top heater. Move a table to
be in alignment.
③ Press a “REMOVE” button. Then, a head descends till a vacuum bit touches the surface of a part and
then elevates back to the heating position. If the center is off from center, move a slide table right and left
and front and back to align a vacuum bit with the center of a part.
④ The equipment proceeds by controlling the temperature according to the selected profile.
⑤ When the work is in progress at the highest temperature zone of the selected file, a notification sound is
sent out, and the vacuum button automatically turns on 8 seconds before the zone ends, the head descends,
picks up the part, and then rises again.
⑥ When the head rises, the cooling fan operates and starts cooling.
⑦ The vision head moves to the right, puts the removed part on the parts tray and returns to its original
position.
⑧ After the cooling time elapses, the cooling fan automatically stops.
6.2 Removal of Soldering Residual on PCB (Use a BOTTOM HEATER)
This process is for removal of soldering residual on the PCB. It is used for the ironing operation while the PCB
gets preheated. Also, it can be used for all the operations requiring of preheating.
① Mount a PCB on a table.
② When a “PRE-HEAT” button is pushed, only a bottom heater operates not a top head.
③ The bottom heater maintains at 180℃. At the OPTION, the temperature which has been set for the bottom
heater can be changed. .
④ When the PCB gets preheated, remove any excess lead with a wire solder and an iron first.
⑤ Then, remove any lead residual with a solder wick and an iron.
⑥ Touch a “RST” key to complete the process. .
6.3 How to Soldering
6.3.1 Soldering after Dipping
It is for placing low-viscosity solder (or Gell Flux) onto a dipping jig and then, execute the soldering after
dipping.
① After placing a dipping jig on the left side of a vision head, print a low-viscosity solder cream.
② Place parts on a part tray in accordance with the mounting direction and then, turn an adjusting screw to
place the parts on the center and then unscrew the adjusting screw a bit. If there is too small space between
the parts, they may not get lifted upon absorption by vacuum.
③ Click a “Dipping” button.
④ A vision camera and a top head automatically move to pick up the parts and dip a cream solder and then
move to a position to be waiting for adjusting of the mounting position. On the monitor, the PCB surface
and the ball surface of parts are displayed concurrently.
IR AUTO BGA Rework Station TR3000-IRV
Kukjetrading Co., Ltd.
28
⑤ Adjust XY-axis fine adjusting screws and a rotation handle to align the PCB surface where the parts
would be placed onto with the parts to be placed. With functions including the brightness control for
top/bottom lighting, zoom in/out and focus, make sure the alignment is made accurately.
⑥ Touch a RUN button. A head descends to mount the parts and execute the soldering. .
6.3.2 Soldering without Dipping
It is for applying gell flux onto the mounting surface of the BGA on top of the PCB for soldering.
① Applying gell flux evenly onto the mounting surface of the BGA with a brush or cotton swab. Apply it
with a brush several times.
② Place parts on a part tray in accordance with the mounting direction and then, turn an adjusting screw to
place the parts on the center and then unscrew the adjusting screw a bit.
③ Click a “Pick-up” button.
④ A vision camera and a top head automatically move to pick up the parts and move to a position to be
waiting for adjusting of the mounting position. On the monitor, the PCB surface and the ball surface of
parts are displayed concurrently.
⑤ Adjust XY-axis fine adjusting screws and a rotation handle to align the PCB surface where the parts
would be placed onto with the parts to be placed. With functions including the brightness control for
top/bottom lighting, zoom in/out and focus, make sure the alignment is made accurately.
⑥ Touch a RUN button. A head descends to mount the parts and execute the soldering. .
6.3.3 SOLDERING with No Use of Vision Function
It is for manually placing parts in alignment with a silk line to execute the soldering without using a vision
function.
① Applying Gell flux evenly onto the mounting surface of the BGA with a brush or cotton swab. Apply it
with a brush several times.
② Mount the parts in alignment with a silk line.
③ Touch a RUN button. A head descends to mount the parts and execute the soldering.
6.3.4 Reheating
It is used for the reheating operation due to cold welding, etc. .
<Warning> Main component for liquid Flux is alcohol. So there is a risk of fire if alcohol does not get
removed. Thus, a RST key must be pressed before operation to remove alcohol by operating a cooling
fan.
① Inject a small amount of liquid Flux into a gap of the BGA (Recommended FLUX: KOKI SV-PBF-304P).
② Mount a PCB onto a Table.
③ Click a center button to move a table to be at a position for heating.
④ Click a center button to restore the table back to its original position.
⑤ Press a RST button to operate a cooling fan..
⑥ Press a RUN button. A head descends to mount parts and the soldering gets executed.
6.4 MOUNT(Mounting Test)
It is used for checking whether parts which have been mounted on a PCB are still in alignment.
① When a Dipping or PICK-UP button is pressed, parts on a part tray gets absorbed and then, it waits at a
position where is for adjusting a vision camera position.