Maintenance (Micron) workbook Iss07.pdf - 第64页

64 Issue 6, Nov 14 Task 5: Using one or both of the methods above: test and, if necessary, adjust the USC settings for best performance. Iden tify the parameters and their optimum values below: Parameter Value Comments T…

Issue 6, Nov 14

Objective PM2: Test and Optimize the Under Screen Cleaner Settings

Testing the Cleaner

Method 1

 Set the machine to step mode.

 Press “Clean Screen”. A menu will appear. Set “Mode 1” to “W/V/D”.

 Step through the first cycle, monitoring the stencil surface to ensure that the cleaner

blades lift the stencil by about 1mm.

 Lift the head and ensure that the wet paper is between the wiper blades, and that the

paper is evenly wet.

 Close head and press “Step”. Lift the head again and ensure that dry paper is between

the wiper blades and the stencil apertures are clear. Check that no solder balls remain

on the stencil surface.

 Close head and “Step” again. Lift the head and ensure that all residues have been

removed from the stencil. Close head.

Method 2

 Remove the foil and mesh from an old stencil leaving just the frame. Load this into the

cleaner and perform a W/V/D clean while observing the performance through the front

cover. This is best done in step mode so you can mark how much paper is being

rotated between cleans to ensure clean paper is present.

64 Issue 6, Nov 14

Task 5:Using one or both of the methods above: test and, if necessary, adjust the

USC settings for best performance. Identify the parameters and their optimum

values below:

Parameter Value Comments

Task 6: If your machine has the Time to Go (TTG) functionality perform the tasks

below:

Using the procedures in the Technical Reference Manual:

1. Calibrate the Solvent Time To Go

2. Calibrate the Paper Time To Go

NOTES:

Issue 6, Nov 14

Module M-BT

Benchmark Test