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6 Vision functions User M anual SIPLACE S -23 HM 6.7 Guidelines for Describing Pa ckage Forms Software Version SR.406.xx 02/00 US Edition 310 The illumi nation system co nsists of th ree differen t illumi nation lev els.…

User Manual SIPLACE S-23 HM 6 Vision functions

Software Version SR.406.xx 02/00 US Edition 6.7 Guidelines for Describing Package Forms

309

Fig. 6.7 - 6 Typical measuring modes with standard components

6.7.6 Setting the Components Illumination at the 12-Segment Revolver Head Camera

6.7.6.1 General Information on Illumination Methods

The idea of illumination setting is to obtain an image of the leads of a component which is as high-

contrast as possible. At the same time it is also important to suppress representation of the body

of the component. 6

These instructions are intended to help you find the best possible illumination parameters. This,

however, does not imply that you rigidly comply with the values specified in these instructions. The

way you should proceed is first to follow these instructions and then to adjust the parameters your-

self where necessary. It may well be that you come across a component where the leads are better

illuminated using values different than the ones suggested in these instructions. 6

Flip

Chip

General

SIZE

high

resolution

0402,

0603, etc.

SIZE

LEAD

outer tip

LEAD

outer tip

SIZE

Tantalum

capacitor

Melf IC

BGA, µBGA

Flipchip

SOJ,

PLCC

Small

SIZE

CORNER

outer tip

LEAD

outer tip

LEAD

outer tip

CORNER

outer tip

ROW

outer tip

SO,

QFP

Large

Small Large

BGA

GRID

BALL

PLCC

SIZE

CORNER

Beinmitte

CORNER

lead center

LEAD

lead center

ROW

lead center

LEAD

lead center

GRID

BALL

SIZE

(depend-

ing on

component

size)

SIZE

(depend.on

component

size)

6 Vision functions User Manual SIPLACE S-23 HM

6.7 Guidelines for Describing Package Forms Software Version SR.406.xx 02/00 US Edition

310

The illumination system consists of three different illumination levels. The intensities can be pro-

grammed individually. By using the individual illumination levels one at a time or in combination,

you can adapt the illumination to suit a wide range of components. 6

Flat illumination level 6

The flat illumination level is used for illuminating BGAs, µBGAs, flip-chips, J-lead components

(PLCC), Melfs and components with convex-type leads. It tends to emphasize body and lead

edges. It is, however, less suitable for displaying bright component bodies and ceramic compo-

nents. 6

Middle illumination level 6

The middle illumination level can be used universally with a wide range of components. With bright

component bodies, ceramic components, µBGAs and flip-chips it should, however, only be used

at lower intensity levels. 6

Steep illumination level 6

The main application for the steep illumination level is for reflective leads, ceramic components

and bright component bodies. It is less suitable for reflective component bodies, flip-chips or

µBGAs. 6

NOTE 6

Most components will require a combination of these three illumination levels to achieve optimum

illumination. Using

one

illumination level will only be successful in exceptional cases. 6

User Manual SIPLACE S-23 HM 6 Vision functions

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311

6.7.6.2 Pseudo color representation

The pseudo color representation provides a powerful and objective assessment of the illumina-

tion, by representing a brightness value in a color. 6

A contrast of at least 4 color scales between the lead and body is required for a measurement. In

the ‘Illumination’ menu of the package form manipulator, components are displayed in the pseudo

color representation on the station computer monitor. 6

6.7.6.3 Settings for Illuminating Standard Components

The standard range of components includes chips (0402 to 2220), tantalum capacitors, Melf com-

ponents, PLCCs, QFPs, SOs, SOJs, TSOPs, ICs, power components, flip-chips, µBGAs and

BGAs. 6

For the components which are listed below the GF interpreter in the station computer uses the

default illumination parameters listed in Fig. 6.7 - 7: 6

– Chips (0402 to 2220)

– Tantalum capacitors (component bodies, non-reflective)

–Melf

– PLCC, QFP, SO, SOJ, TSOP, ICs, power ICs

– Flip-chips, µBGAs, BGAs (not ceramic BGAs)

Color scale Brightness

white light

yellow

orange

red

brown

green

light blue

blue

violet

black dark

Tab. 6.7.2