KE-3010A_SPE_EN.pdf - 第14页

- 9 - 4. S pecifi cation s 4.1. Features of each model ① Basic specifications KE - 3010A / KE - 3010 A C KE - 3020V A / KE - 3020V RA Board specific ations M PW B L PW B M PW B L PW B Board dimensions * S ee Note 4. S ta…

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Model name

KE-3010A

KE-3010AC

KE-3020VA

KE-3020VRA

Feeder bank (Electric type and both mechanical type and electric type)

Electric feeder bank (fixed type)

●

*1 *16

●

Electric overall change table system

●

*1 *16

●

Overall change table for electric feeder (EF)

●*1 ●*1 *16 ●*1 ●*1

Overall change table for electric feeder (RF)

●

Intelli trolley for electric feeder

●

*8 *16

●

Tape cutter unit

●*1 ●*1 ●*1 ●*1

IC collection belt

● ● ● ●

Component supply unit

EF series electric feeder

●

*8 *19

●

*8 *19

●

*8 *19

●

*8 *19

RF series electric feeder

● - ● ●

Stick feeder

●

*8 *19

●

*8 *19

●

*8 *19

●

*8 *19

Tray supply unit

MTC *14

●

*8 *9

●

*8 *9

●

*8 *9

MTS

●

*8 *9

●

*8 *9

●

*8 *9

DTS

●*8*9*20

●*8*9*20 ●*8*9*20

Tray holder

●*8*9

●*8*9 ●*8*9

Wafer supply unit

T Multi-die server (DF01)

●

*15

●

*15

●

*15

Fluxer: Type 3 (To be attached on a bank/rear side only)

●

*1*13*20

- ●

*1*13*20

●

*1*13*20

Rotary-type solder transfer device

(To be attached on a bank/front side only)

●*1*13*20 - ●*1*13*20 ●*1*13*20

Feeder setup stand for E-feeder (EF)

● ● ● ●

Feeder setup stand for E-feeder (RF)

● - ● ●

RF_ETF_Attachment

●*19 - ●*19 ●*19

Offline power supply for an electric bank

● ● ● ●

Feeder bank for both mechanical type and electric type ●*1*10*18 - ●*1*10*18 ●*1*10*18

*1 This option is a factory-set option.

*2 Both MNVC and component recognition camera are provided as a set.

*3 This is applicable to the M PWB machine and L PWB machine.

*4 When the L-wide PWB specification is adopted, pin reference cannot be selected.

*5 Applicable only to the L PWB machine.

*6 The MNVC function is required.

*7 To use the component database, PC is separately required.

*8 To use the production management system, Applicable to FRID is required.

(For mountable models and models for which a countermeasure can be taken later, refer to the

PRODUCT SPECIFICATIONS of production management system.)

*9 For installing MTS, it is necessary to change the rear side of the main unit into an overall change tabl

ype.

*10 For the options of both mechanical and electric feeder banks, refer to the description of each feeder

bank.

*11 This is not mounted on the machine when a placement monitor is selected.

*12 An LNC 61 and an LNC62 are heads exclusively designed for a placement monitor into which

ltra-miniature camera is incorporated.

The specifications of recognition with laser are equivalent with those of an LNC60.

*13 Select either of a fluxer and a rotary-type solder transfer device.

*14 You cannot select both a fluxer (Type 2: to be attached on the main unit) and an MTC at the same

time.

*15 This unit can be attached on the rear bank of the main unit designed for a feeder exchange trolley.

*16 This unit can be attached on the front side of the main unit only.

*17 This is handled as a KE-3010A.

*18 Only an EN specification machine for a large-sized board is supported.

*19 Attach the RF_ETF_Attachment when electric feeders are used by a feeder trolley (RF). (If you use t

F_ETF_Attachment, non-teaching and synchronous adsorption guarantee are excluded.)

*20 It does not correspond to the Feeder exchange trolley RF.

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Specifications

4.1. Features of each model

① Basic specifications

KE-3010A / KE-3010AC

KE-3020VA / KE-3020VRA

Board specifications M PWB L PWB M PWB L PWB

Board

dimensions

* S

ee Note 4.

Standard

330×250 ㎜ 410×360 ㎜ 330×250 ㎜ 410×360 ㎜

L-Wide -

510×360 ㎜

Long PWB

650x250 ㎜ 800×360 ㎜ 650x250 ㎜ 800×360 ㎜

L-Wide(long PWB) -

1010×360 ㎜

Board transport reference position

Front reference

Rear reference

* See Note 5

Front reference

Rear reference

Supported languages

English, Japanese and Chinese is selected in real time.

Conveyor height

900 ㎜±20 ㎜

950 ㎜±20 ㎜ (option, EN machine: standard)

Component height

SC（6 ㎜）

（

㎜）

NC（12 ㎜）

（

㎜）

Component

placement

speed

* S

ee Note

1, 2.and 7

Chip component

（IPC9850）

18,500(CPH) 17,100(CPH)

IC component

9,000(CPH)

* S

ee Note 3.

KE-3020VA(LNC60+IC head)

9,470(CPH) 9,350(CPH)

KE-3020VRA(LNC60)

9,000(CPH)

Component

size

* See Note 1.

Laser recognition

0402

～□

33.5

㎜

or opposite angle 47

㎜

Image recognition

(MNVC)

* See Note 3

Standard camera: □3～□33.5 ㎜

High-resolution camera (option): 1005～□20 ㎜

Image recognition

(IC head)

Standard camera: □3～50×150 ㎜ or □74 ㎜

High-resolution camera: 1005

～

50×120

㎜

□

㎜

Placement

accuracy

* See Note 1.

Laser recognition

±50μm (Cpk

≧

Image recognition

(MNVC)

* See Note 3

±40μm ±40μm

Image recognition

(IC head)

- ±30μm

Number of component to be placed

A maximum of 160 types (when using EF08HD)

EN Specifications

Enable * See Note 6

* Note 1: For details of specifications, refer to Section 1-5 Target components.

* Note 2: Transport: Front reference, Component height: 6 mm (KE-3010A/3010AC)/12 mm

(KE-3020VA/20VR M specification/L specification)

* Note 3: It is the approximate value when MNVC (option for KE-3010A and KE-3010AC is excluded.) is

used and/or the components are simultaneously picked up with 6 nozzles.

* Note 4 KE-3010AC is the only L size specification.

* Note 5 KE-3010AC is the only front reference.

* Note 6 KE-3010AC is excluded.

*Note 7 Except case of using the RF_ETF_ATTACHMENT.

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② The relationship among the model names, recognition devices and heads is shown below.

KE-3010A

KE-3010AC

KE-3020VA KE-3020VRA Explanation

LNC60 ○

○

○ ○

This can place small-shape

and thin chips at a high

speed by 6 nozzles.

head

(CDS)

○ -

This head can place IC

components of large-shape

QFP, CSP, BGA, etc. by

vision recognition.

head

(FMLA)

- ○

This head can place

components by laser

recognition and vision

recognition. All types of

nozzles such as gripper

nozzle and particular

ordering nozzle can be

used for the IC head

(FMLA).

VCS

* See

ote 1.

○ ○

VCS can perform vision

recognition of IC

components. An optional

high-resolution camera can

be added.

*Note 1: The standard camera is attached to MNVC (option). The high-resolution camera is also

attached.

③ Recognition function

KE-3010A KE-3010AC KE-3020VA KE-3020VRA Explanation

MNVC Option - ○ ○

Vision recognition can be

performed by LNC60. IC

components of

small-shape QFP, CSP,

BGA, etc. can be placed at

a high speed. Vision

recognition can be

performed by VCS in the

high-speed non-stop

mode. (S-VCS)

・LN

C60 :Enables the high-speed placement of small chip components or thin chip-shaped

components with 6 nozzles on a board.

(The laser recognition specifications of an LNC61 and an LNC62 are equivalent to those of

an LNC60.)

・IC head (CDS) :Enables recognition of ICs such as large QFPs, CSPs, and BGAs with a VCS,

and placement of them on a board.

・IC head (FMLA) :Enables the placement with laser recognition unit attached on IC head on a

board. Moreover, all the IC head (FMLA) can use almost all types of nozzle such as

gripper nozzle and particular ordering nozzle.

・VCS :Enables the placement of IC components using image recognition on a board. Moreover,

high-resolution camera (Option) can be added to it.

・MNVC :Enables the placement using image recognition with LNC60.

Small QFPs, CSPs, and BGAs can be then placed at high speed on a board.

LNC60 = Laser Align New Concept CDS = Component Detection Sensor

FMLA = Focused Modular Laser Align VCS = Vision Centering System

MNVC = Multi-Nozzle Vision Centering S-VCS = Scaning Vision Centering System