KE-3010A_SPE_EN.pdf - 第22页

- 17 - Note 13: The s ize of a co mponen t to be rec ognized w ith each n ozzle is s hown in t he table bel ow . Nozzle number Simult aneous mea sureme nt Clearance (Betw een the laser s urface and a component) App licab…

- 16 -

Note 1: The minimum size of a component to be recognized with a standard VCS shall be □3.0 mm,

and the size of its mold shall be □1.7 mm or more.

The area to be recognized of the maximum-sized component shall be within the field view of

□52 mm of a standard VCS including the component placement position error and a teaching

error caused when the component is picked up.

For the maximum size of a component that is to be recognized with an MNVC head, the

pick-up XY error shall be 1 mm or less, and the angle error shall be ±3°or less.

When an MNVC head is used for a component whose size exceeds □10 mm, any other

component cannot be assigned to adjacent heads.

When a component is recognized with the back light, and the position 1.3 mm or less far from

the edge of the component is picked up, the shadow of a nozzle may prevent the component

from being recognized stably.

Note 2: The minimum size of a component to be recognized with an optional VCS is 1.0×0.50 mm.

The area to be recognized of the maximum-sized component shall be within the field view of

□25 mm of a standard VCS including the component placement position error and a teaching

error caused when the component is picked up.

For the maximum size of a component to be recognized with an MNVC head, the pick-up XY

error shall be 1 mm or less, and the angle error shall be ±3°or less.

When an MNVC head is used for a component whose size exceeds □10 mm, any other

component cannot be assigned to adjacent heads.

When a component is recognized with the back light, and the position 1.3 mm or less far from

the edge of the component is picked up, the shadow of a nozzle may prevent the component

from being recognized stably. Use a standard VCS as a back light for a large component.

Note 3: When the diagonal line of the external size of a component is 88 mm or more, the height of the

component to be placed on a board is restricted so that it cannot interfere with the LNC.

Note 4: A component whose size is □10 mm is processed with the software as a component whose

diagonal line is 15 mm long (□10.6 mm).

Note 5: The pitch of a general-purpose vision component type of lead component that can be

recognized (such as a multi-pitch connector) is 0.50 to 22.0 mm for a standard VCS or 0.30 to

11.0 mm for an optional high-resolution VCS, which are different from those described in the

table above.

Note 6: The pitch of a general-purpose vision component type of ball component that can be recognized

(such as a composite array) is 1.0 to 22.0 mm for a standard VCS or 0.25 to 11.0 mm for an

optional high-resolution VCS, which are different from those described in the table above.

Note 7: When image of a component is divided to be recognized with using the back light, the minimum

width of the component shall be 17 mm or more. If the width is less than 17 mm, a hole for

moving up/down a nozzle is shot, and the recognition accuracy cannot be guaranteed.

Note 8: When the back light is used to recognize a lead, the lead looks thinner because completely

parallel light is not used.

For some area of the field view, the light illumination from the bottom is used as the back light

with being reflected onto the background plate of the head. Therefore, the lead looks further

narrower when it is positioned in the area lighted with the light from the bottom because the light

is reflected to the lead surface. In some case, the lead cannot be seen at all. As a result,

recognition of a lead with the back light is not guaranteed.

Note 9: The image of a component whose outline is to be recognized cannot be divided into 2×2 for

recognition.

Note 10: Up to 0.4 mm-lead can be recognized with a standard VCS, while up to 0.14-mm lead can be

recognized with an optional high-resolution VCS. Note that if the length of a lead is 0.4 mm or

less, recognition of the lead cannot be guaranteed unless the shape of the lead tip is flat.

Note 11: Neither a lead pitch nor a ball pitch is recognized with laser.

Note 12: To recognize image of a component whose type is not applicable in the list of applicable

component types (such as a resistor chip whose size is from 1.0×0.5 to □3 mm), recognize it as

a general-purpose vision component.

- 17 -

Note 13: The size of a component to be recognized with each nozzle is shown in the table below.

Nozzle

number

Simultaneous measurement

Clearance

(Between the laser surface

and a component)

Applicable component

size

0.40 x 0.20 mm to □10.00 mm

(Diameter: 15.0 mm or less)

2.15 mm □20.00mm (See Note 14.)

2.81 mm □33.50 mm

2.15 mm □20.00 mm (See Note 14.)

26.5

53.0

120.0

17.5

Note 14: □22.5 mm to□ 33.5mm can be used in L3 or L4 only.

Note 15: Even thoguh the size exceeds

□ 20 mm,

a component whose size is 24 mm×11 mm is applicable.

Note 16: The minimum component height does not affect recognition of a component with a VCS.

It shall be recognized with the CDS.(KE-3020V only)

Note 17: When the component size is less than

□ 3 mm,

recognize and place the component on a board with an LNC60 head.

Note 18: To recognize the image of a resistor chip, trimmer, SOT or LED component whose size is

from 1.0×0.5 mm to

□ 3mm with a VCS, recognize it as a general-purpose vision

component.

- 18 -

4.6. Component Placement Accuracy

*1 The regulated value of a component to be recognized with laser is “Cpk ≥ 1.”

*2 The placement accuracy that can be obtained when a placement position is corrected

by recognizing component image shall be the absolute value from the component

reference mark or PWB reference mark.

*3 The placement accuracy of a 0402 component described below is realized if local

fiducial marks are used, the distance between two marks is 20 mm or less, and a 0402

component is placed within the mark.

(1) Placed positions (X, Y)

(Unit:μm)

Laser

Vision (VCS)

LNC60 FMLA MNVC IC head

Square chip

0402, 0603

± 50 ― ― ―

Square chip

1005 or bigger

± 50 ± 50 ― ―

QFP

(Pitch: 0.5, 0.4, 0.3)

± 40

(When a component positioning

mark is used)

± 30

(When a component positioning mark

is used)

(2) Placed posture (

) (Unit:°)

Laser Vision (VCS)

LNC60

FMLA

MNVC

IC head

Square chip

0402 ±5.0 ―

― ―

0603 ±3.0 ―

1005 ±2.5 ±2.5

1608 or more ±2.0 ±2.0

QFP

(Pitch: 0.5, 0.4, 0.3)

50 mm or more ― ― － ±0.04

From 40 mm to less than 50 mm

― ― － ±0.05

From 30 mm to less than 40 mm

― ― ± 1.11 ±0.07

From 20 mm to less than 30 mm

― ― ±0.12 ±0.1

From 10 mm to less than 20 mm

― ― ±0.22 ±0.2

10 mm or less

―

±0.33

±0.3

Adjacent pitch

- 0402: 0.15 mm

- 0603: 0.20 mm