KE-3010A_SPE_EN.pdf - 第5页
7. Con trol Syst em ................................................................................................................................ . 70 7.1 . Control ....................................................…
5.2.10. Applicability to long PWB (factory-set option) ......................................................... 35
5.2.11. Solder recognition lighting (factory-set option) ........................................................ 35
5.2.12. Residual number-of-components control function (option) ..................................... 35
5.2.13. Auto PWB width adjusting function
(Automatic Board Adjustment/AWC factory-set option) ........................................ 35
5.2.14. Coplanarity (Factory-Set Option) ............................................................................ 36
5.2.15. Offset Placement After Solder Screen-printing (Factory-Set Option) ..................... 37
5.2.16. Fluxer (Factory-Set Option) ..................................................................................... 38
5.2.17. Electrical Leakage Breaker (Factory-Set Option) ................................................... 38
5.2.18. Ionizer (Factory-Set Option) .................................................................................... 39
5.2.19. IC Collection Belt (Option) ....................................................................................... 39
5.2.20. Handheld Operating Device (HOD: Factory-set option) ......................................... 39
5.2.21. Tape Cutter Unit (Option for the electric type of bank) ........................................... 39
5.2.22. Automatic Tape Cutter (Option) .............................................................................. 39
5.2.23. Connector Bracket (Option for the Fixed Bank) ...................................................... 39
5.2.24. Flexible Calibration System, The adjustment jig (FCS is an option.) ...................... 39
5.2.25. Placement Monitor (Factory-Set Option)................................................................. 40
5.2.26. Rotary-type Solder Device (Factory-Set Option) .................................................... 43
5.2.27. Multi-code Reader / Bottom view type Multi-code Reader
(Factory-Set Option) .............................................................................................. 44
5.2.28. Software to support production (Option) ................................................................. 44
6. Component supply unit..................................................................................................................... 46
6.1. List of Feeder Bank Specifications ......................................................................................... 46
6.2. Maximum Number of Feeders Available on a Mounter ......................................................... 47
6.3. Tape Feeder ........................................................................................................................... 49
6.3.1. Tape feeder for mechanical bank .............................................................................. 49
6.3.2. Tape feeder for electric bank ..................................................................................... 54
6.3.3. Feeder calibration jig ................................................................................................. 56
6.3.4. Feeder setup stand .................................................................................................... 57
6.3.5. Electric Trolley Power Station ................................................................................... 58
6.4. Stick Feeder ........................................................................................................................... 59
6.5. Stack Stick Feeder (for a mechanical bank) .......................................................................... 61
6.6. Tray Holder ............................................................................................................................. 62
6.7. TR Series ................................................................................................................................ 63
6.7.1. Overview .................................................................................................................... 63
6.7.2. Correspondence table for the TR series ................................................................... 64
6.7.3. Specifications ............................................................................................................ 64
6.7.4. Options ...................................................................................................................... 67
6.8. Multi-die server ....................................................................................................................... 68
6.8.1. Overview .................................................................................................................... 68
6.8.2. Basic Specifications ................................................................................................... 68
6.8.3. Facility Specification .................................................................................................. 69
6.8.4. External dimensions .................................................................................................. 69
6.8.5. Options ...................................................................................................................... 69
7. Control System ................................................................................................................................. 70
7.1. Control .................................................................................................................................... 70
7.1.1. Saving a program ...................................................................................................... 70
7.1.2. Limit of a production program.................................................................................... 70
7.2. Production Mode .................................................................................................................... 70
8. Other Specifications ......................................................................................................................... 71
8.1. Electrical interfaces ................................................................................................................ 71
8.1.1. Kinds and meanings of electrical signals .................................................................. 71
8.2. Specifications for connections between the front and rear devices....................................... 71
8.2.1. Specifications of the connecting cable ...................................................................... 72
8.3. Data interface ......................................................................................................................... 72
8.4. Utility connections................................................................................................................... 72
9. Safety specifications ......................................................................................................................... 73
9.1. Standards specifications ........................................................................................................ 73
9.2. Specifications for the CE Marking (for EN Machine) ............................................................. 73
10. Reliability specifications ................................................................................................................. 74
10.1. Lifetime of devices ................................................................................................................ 74
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1.
Introduction
1.1. General
KE-3010A/3010AC/3020VA/3020VRA, which inherit the flexibility in performance under the
modular concepts that have been built up so far in order to keep a key position of the future
flexible modular line, are general-purpose mounters with a multiple-head in an one-by-one
system that further improves the safety, reliability, maintainability and economy.
KE-3010A/3010AC/3020VA/3020VRA, having a good affinity for high-speed modular
mounter FX-3R, can construct the line that operates stably attaching electric feeders.
Moreover, KE-3010A/3020VA/3020VRA can also use the component supply unit (tape,
stick, or bulk feeders) and production program used in the existing KE series. This
permits a reduction of installation cost and a smooth startup of the system.
KE-3010A/3020VA/3020VRA is provided with an S-VCS function that permits vision
recognition continuously at a high speed, so that the tact has been improved about 61% as
compared with our existing machine model KE-3020/3020R (JUKI specified IC
Components).
Additionally, combination of this machine and floor productivity operating system to be
used with the JUKI mounters and dispensers, allow you to manage the productions not
only per line but also per floor. The floor productivity operating system manages and
optimizes the information and jobs for a whole manufacturing floor comprehensively to
provide you improved productivity, better manufacturing quality, and cost reduction.
* For details about compatibility between the existing machine models and banks, feeders,
etc., refer to "Chapter 6 Component supply unit ".
* For the detailed functions of floor productivity operating system, refer to the functional
specification of each system.
1.2. Model variations
KE-3010A: This model uses a multi-laser-head LNC60 sensor to place components
from small chip components to □33.5mm components at high speed thanks
to its laser recognition capability. When you attach an optional MNVC on
this model, image of components whose sizes are described above can be
recognized. This drastically improves the component placement cycle time
of these components, which are to be recognized with a VCS.
KE-3010AC: With high productivity and operability of the KE-3010A, it was an
easy-to-deploy unit specializing in basic performance.
KE-3020VA: This model is equipped with an MNVC as a standard device as well as a
multi-laser-head. This model can use its IC head to recognize image of IC
components such as large QFP and BGA components to place them on
boards also.
KE-3020VRA: This model has the same features as a KE-3020VA, and uses an FMLA as
an IC head to recognize various components from a small chip to □33.5mm
components with laser to place them on boards. Moreover, it uses the
multi-laser-head and the IC head to pick components at the same time to
place them on boards at the higher speed.
* For a table of recognition units, refer to “Chapter 4 Specifications.”