KE-3010A_SPE_EN.pdf - 第16页

- 11 - 4.2. Mechanical/Electri cal Specifications 4.2.1. Usage environment c onditions KE - 3010A / 3010A C/ 3020V A / 3020VRA Power supply V oltage Three - phas e 200V , 220V , 240V , 380V , 400V , 415V AC ± 10% ( See N…

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② The relationship among the model names, recognition devices and heads is shown below.

KE-3010A

KE-3010AC

KE-3020VA KE-3020VRA Explanation

LNC60 ○

○

○ ○

This can place small-shape

and thin chips at a high

speed by 6 nozzles.

head

(CDS)

○ -

This head can place IC

components of large-shape

QFP, CSP, BGA, etc. by

vision recognition.

head

(FMLA)

- ○

This head can place

components by laser

recognition and vision

recognition. All types of

nozzles such as gripper

nozzle and particular

ordering nozzle can be

used for the IC head

(FMLA).

VCS

* See

ote 1.

○ ○

VCS can perform vision

recognition of IC

components. An optional

high-resolution camera can

be added.

*Note 1: The standard camera is attached to MNVC (option). The high-resolution camera is also

attached.

③ Recognition function

KE-3010A KE-3010AC KE-3020VA KE-3020VRA Explanation

MNVC Option - ○ ○

Vision recognition can be

performed by LNC60. IC

components of

small-shape QFP, CSP,

BGA, etc. can be placed at

a high speed. Vision

recognition can be

performed by VCS in the

high-speed non-stop

mode. (S-VCS)

・LN

C60 :Enables the high-speed placement of small chip components or thin chip-shaped

components with 6 nozzles on a board.

(The laser recognition specifications of an LNC61 and an LNC62 are equivalent to those of

an LNC60.)

・IC head (CDS) :Enables recognition of ICs such as large QFPs, CSPs, and BGAs with a VCS,

and placement of them on a board.

・IC head (FMLA) :Enables the placement with laser recognition unit attached on IC head on a

board. Moreover, all the IC head (FMLA) can use almost all types of nozzle such as

gripper nozzle and particular ordering nozzle.

・VCS :Enables the placement of IC components using image recognition on a board. Moreover,

high-resolution camera (Option) can be added to it.

・MNVC :Enables the placement using image recognition with LNC60.

Small QFPs, CSPs, and BGAs can be then placed at high speed on a board.

LNC60 = Laser Align New Concept CDS = Component Detection Sensor

FMLA = Focused Modular Laser Align VCS = Vision Centering System

MNVC = Multi-Nozzle Vision Centering S-VCS = Scaning Vision Centering System

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4.2. Mechanical/Electrical Specifications

4.2.1. Usage environment conditions

KE-3010A/3010AC/3020VA/3020VRA

Power supply

Voltage

Three-phase 200V, 220V, 240V, 380V, 400V, 415V AC ±10% (See

Note 1)

Frequency 50/60Hz

Rated apparent power 3.0kVA

Air supply

Air pressure 0.5±0.05 MPa dry air

Maximum air

consumption

50L/min (ANR) (See Note 2)

Environment

requirements

During operation

Ambient temperature

+ 10 to + 35 °C

Placement accuracy

guarantee temperature

+ 20 to + 25 °C

Relative humidity 30 % to 80% RH (No condensation)

Altitude 1,000m or less

During transportation

or storage

Ambient temperature

- 15°C to + 70°C

Relative humidity 20 % to 95% RH (No condensation)

Noise

73 dB (A) or less (See

Note 3

)

Installation

conditions

(for a EN

machine)

Overvoltage category Category III according to IEC60664-1

Pollution degree Degree 3 according to IEC60664-1

Note 1: No power supply cable at the primary side is attached thereto.

We make NO WARRANTIES against any accident of the primary side wiring caused by

short–circuit of the power cable and so on. Please use a 5.5-mm

or more diameter of

power cable for each phase. (Note: the appropriate cross-section area of the cable

varies depending on the supplied power voltage and the length of the power cable.)

Cable length

(m)

Conductor cross section (mm

)

200Vseries 400Vseries

Less than 20

5.5

30 8.0 5.5

10.0

6.0

14.0

6.0

・

Peak current (at AC200V 3phase power) : 40A

Note 2: ANR conditions are as follows:

Temperature = 20

Absolute pressure = 0.1MPa (=100kPa=1bar),

Relative humidity = 65%

Note 3: This value was measured with conforming to the JIS Z8731 regulation.

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4.2.2. Outside dimension (except for the largest projections)

(Unit: mm)

PWB specification

Dimensions

M PWB L PWB L-Wide

A (transport length) 1,500 1,500 1,800

B (transport output amount) 50 50 200

E(Height of the signal light) 50 50 200

F (PWB transport path from the front side of the cover) 476 476 476

G(Depth of the machine (excluding protrusions)) 484 484 484

* The tolerance of the above dimensions is ±15 mm.

(Unit: mm)

Transport height

Dimensions

900mm 950mm

C (Top surface of the cover from the floor) 1500 1550

D (Top surface of the transport belt from the floor) 900 950

K (Bottom of the keyboard from the floor) 975 1025

* The tolerance of the above dimensions is ±5 mm.

4.2.3. Mass

(Unit: kg)

PWB specification

Model

M PWB L PWB

KE-3010A / 3010AC / 3020VA / 3020VRA 1,850 1,900