KE-3010A_SPE_EN.pdf - 第15页

- 10 - ② The relationship a mong the model names, recognition devices and heads is show n below . KE - 3010 A KE - 3010 AC KE - 3020V A KE - 3020VR A Explanat ion LNC60 ○ ○ ○ ○ This c an place sm all - shape and thin c h…

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4.
Specifications
4.1. Features of each model
① Basic specifications
KE-3010A / KE-3010AC
KE-3020VA / KE-3020VRA
Board specifications M PWB L PWB M PWB L PWB
Board
dimensions
* S
ee Note 4.
Standard
330×250 ㎜ 410×360 ㎜ 330×250 ㎜ 410×360 ㎜
L-Wide -
510×360 ㎜
-
510×360 ㎜
Long PWB
650x250 ㎜ 800×360 ㎜ 650x250 ㎜ 800×360 ㎜
L-Wide(long PWB) -
1010×360 ㎜
-
1010×360 ㎜
Board transport reference position
Front reference
Rear reference
* See Note 5
Front reference
Rear reference
Supported languages
English, Japanese and Chinese is selected in real time.
Conveyor height
900 ㎜±20 ㎜
950 ㎜±20 ㎜ (option, EN machine: standard)
Component height
SC（6 ㎜）
NC
（
12
㎜）
NC（12 ㎜）
HC
（
20
㎜）
Component
placement
speed
* S
ee Note
1, 2.and 7
Chip component
（IPC9850）
18,500(CPH) 17,100(CPH)
IC component
9,000(CPH)
* S
ee Note 3.
KE-3020VA(LNC60+IC head)
9,470(CPH) 9,350(CPH)
KE-3020VRA(LNC60)
9,000(CPH)
Component
size
* See Note 1.
Laser recognition
0402
～□
33.5
㎜
or opposite angle 47
㎜
Image recognition
(MNVC)
* See Note 3
Standard camera: □3～□33.5 ㎜
High-resolution camera (option): 1005～□20 ㎜
Image recognition
(IC head)
-
Standard camera: □3～50×150 ㎜ or □74 ㎜
High-resolution camera: 1005
～
50×120
㎜
or
□
48
㎜
Placement
accuracy
* See Note 1.
Laser recognition
±50μm (Cpk
≧
1)
Image recognition
(MNVC)
* See Note 3
±40μm ±40μm
Image recognition
(IC head)
- ±30μm
Number of component to be placed
A maximum of 160 types (when using EF08HD)
EN Specifications
Enable * See Note 6
* Note 1: For details of specifications, refer to Section 1-5 Target components.
* Note 2: Transport: Front reference, Component height: 6 mm (KE-3010A/3010AC)/12 mm
(KE-3020VA/20VR M specification/L specification)
* Note 3: It is the approximate value when MNVC (option for KE-3010A and KE-3010AC is excluded.) is
used and/or the components are simultaneously picked up with 6 nozzles.
* Note 4 KE-3010AC is the only L size specification.
* Note 5 KE-3010AC is the only front reference.
* Note 6 KE-3010AC is excluded.
*Note 7 Except case of using the RF_ETF_ATTACHMENT.
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② The relationship among the model names, recognition devices and heads is shown below.
KE-3010A
KE-3010AC
KE-3020VA KE-3020VRA Explanation
LNC60 ○
○
○ ○
This can place small-shape
and thin chips at a high
speed by 6 nozzles.
IC
head
(CDS)
-
-
○ -
This head can place IC
components of large-shape
QFP, CSP, BGA, etc. by
vision recognition.
IC
head
(FMLA)
-
-
- ○
This head can place
components by laser
recognition and vision
recognition. All types of
nozzles such as gripper
nozzle and particular
ordering nozzle can be
used for the IC head
(FMLA).
VCS
-
* See
N
ote 1.
-
○ ○
VCS can perform vision
recognition of IC
components. An optional
high-resolution camera can
be added.
*Note 1: The standard camera is attached to MNVC (option). The high-resolution camera is also
attached.
③ Recognition function
KE-3010A KE-3010AC KE-3020VA KE-3020VRA Explanation
MNVC Option - ○ ○
Vision recognition can be
performed by LNC60. IC
components of
small-shape QFP, CSP,
BGA, etc. can be placed at
a high speed. Vision
recognition can be
performed by VCS in the
high-speed non-stop
mode. (S-VCS)
・LN
C60 :Enables the high-speed placement of small chip components or thin chip-shaped
components with 6 nozzles on a board.
(The laser recognition specifications of an LNC61 and an LNC62 are equivalent to those of
an LNC60.)
・IC head (CDS) :Enables recognition of ICs such as large QFPs, CSPs, and BGAs with a VCS,
and placement of them on a board.
・IC head (FMLA) :Enables the placement with laser recognition unit attached on IC head on a
board. Moreover, all the IC head (FMLA) can use almost all types of nozzle such as
gripper nozzle and particular ordering nozzle.
・VCS :Enables the placement of IC components using image recognition on a board. Moreover,
high-resolution camera (Option) can be added to it.
・MNVC :Enables the placement using image recognition with LNC60.
Small QFPs, CSPs, and BGAs can be then placed at high speed on a board.
LNC60 = Laser Align New Concept CDS = Component Detection Sensor
FMLA = Focused Modular Laser Align VCS = Vision Centering System
MNVC = Multi-Nozzle Vision Centering S-VCS = Scaning Vision Centering System
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4.2. Mechanical/Electrical Specifications
4.2.1. Usage environment conditions
KE-3010A/3010AC/3020VA/3020VRA
Power supply
Voltage
Three-phase 200V, 220V, 240V, 380V, 400V, 415V AC ±10% (See
Note 1)
Frequency 50/60Hz
Rated apparent power 3.0kVA
Air supply
Air pressure 0.5±0.05 MPa dry air
Maximum air
consumption
50L/min (ANR) (See Note 2)
Environment
requirements
During operation
Ambient temperature
+ 10 to + 35 °C
Placement accuracy
guarantee temperature
+ 20 to + 25 °C
Relative humidity 30 % to 80% RH (No condensation)
Altitude 1,000m or less
During transportation
or storage
Ambient temperature
- 15°C to + 70°C
Relative humidity 20 % to 95% RH (No condensation)
Noise
73 dB (A) or less (See
Note 3
)
Installation
conditions
(for a EN
machine)
Overvoltage category Category III according to IEC60664-1
Pollution degree Degree 3 according to IEC60664-1
Note 1: No power supply cable at the primary side is attached thereto.
We make NO WARRANTIES against any accident of the primary side wiring caused by
short–circuit of the power cable and so on. Please use a 5.5-mm
2
or more diameter of
power cable for each phase. (Note: the appropriate cross-section area of the cable
varies depending on the supplied power voltage and the length of the power cable.)
Cable length
(m)
Conductor cross section (mm
2
)
200Vseries 400Vseries
Less than 20
5.5
5.5
30 8.0 5.5
40
10.0
6.0
50
14.0
6.0
・
Peak current (at AC200V 3phase power) : 40A
Note 2: ANR conditions are as follows:
Temperature = 20
°
C,
Absolute pressure = 0.1MPa (=100kPa=1bar),
Relative humidity = 65%
Note 3: This value was measured with conforming to the JIS Z8731 regulation.