User-Manual-NeoDen3V-PNP-machine.pdf - 第3页

2.5.3.3. Inspectio n Stan dard............................... .................... .................... .................... ..................... .. 30 2.6. Co ntinuous SMT Production....................................…

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Content
1. NeoDen 3V Introduction..................................................................................................................................... 1
1.1. Brief Introduction.....................................................................................................................................1
1.2. Structure of NeoDen 3V...........................................................................................................................2
1.3. Operation Flow Chart...............................................................................................................................3
1.4. Procedure for Making a Programming File............................................................................................. 4
2. Edit on the Operation Interface........................................................................................................................... 5
2.1. PCB Information Interface.......................................................................................................................5
2.1.1. PCB Feed Setting.......................................................................................................................... 5
2.1.2. Panelized First Chip Setup............................................................................................................6
2.1.2.1. Single Board.......................................................................................................................6
2.1.2.2. Panelized Board................................................................................................................. 8
2.1.2.3. Mirror Board...................................................................................................................... 9
2.1.2.4. PCB Angle Correction......................................................................................................11
2.1.2.5. Bad Board Detection........................................................................................................ 11
2.1.3. Component Setting......................................................................................................................12
2.1.3.1. PCB Mark Setting............................................................................................................ 12
2.1.3.2. Manual Programming...................................................................................................... 14
2.1.3.3. Re-Edit............................................................................................................................. 15
2.1.3.4. Import PCB Coordinate File............................................................................................ 16
2.1.4 Feeder Settings............................................................................................................................. 17
2.1.4.1. Feeder Arrangement.........................................................................................................17
2.1.4.2. Feeder Configuration....................................................................................................... 17
2.2. File Mount.............................................................................................................................................. 21
2.3. Manual Test............................................................................................................................................ 22
2.3.1. Placement Head.........................................................................................................................223
2.3.2. Host Control................................................................................................................................ 23
2.3.3. Feeder Test...................................................................................................................................24
2.4. Factory Settings......................................................................................................................................25
2.4.1. Feeder Configuration.................................................................................................................. 26
2.4.2. System Configuration..................................................................................................................27
2.4.2.1 Default Parameters 1 Setting............................................................................................ 27
2.4.2.2. Nozzle Alignment.............................................................................................................28
2.4.2.3. Nozzle 1 and Camera Relative Position.......................................................................... 28
2.5. First Trial and Test..................................................................................................................................29
2.5.1. First Dry Run...............................................................................................................................29
2.5.2. Production Test............................................................................................................................29
2.5.3. Component Inspection................................................................................................................ 29
2.5.3.1. Inspection Items............................................................................................................... 29
2.5.3.2. Inspection Methods.......................................................................................................... 29
2.5.3.3. Inspection Standard..................................................................................................................30
2.6. Continuous SMT Production..................................................................................................................30
3. Structure and maintenance instruction..............................................................................................................31
3.1. Structure Chart................................................................................................................................................31
3.1.1. Peel Box...................................................................................................................................... 31
3.1.2. Tape Reel Loading.......................................................................................................................32
3.1.3. Nozzle..........................................................................................................................................32
3.1.3.1. Size of Nozzle.................................................................................................................. 32
3.1.3.2. Reference of Nozzle Selection.........................................................................................33
3.2. Maintenance........................................................................................................................................... 34
3.2.1. Reinforce Daily Maintenance..................................................................................................... 34
3.2.2. Requirement for Operator........................................................................................................... 34
3.2.3. Formulate Measures to Reduce/ Avoid Mistake......................................................................... 34
3.2.4. Maintenance of Device............................................................................................................... 35
3.2.4.1. Check Below Points Daily............................................................................................... 35
3.2.4.2. Check Below Points Monthly.......................................................................................... 35
3.2.5. Related Issues During Solder Paste Printing Process................................................................. 36
3.2.5.1. Stencil Printer Technology...............................................................................................36
3.2.5.2. Inspecting of Solder Paste Printing..................................................................................36
3.2.5.3. Instruction about Soldering Printing................................................................................37
IMPORTANT
IN ORDER TO USE THE PICK AND PLACE MACHINE
SAFELY, PLEASE READ THIS USER MANUAL
COMPLETELY AND UNDERSTAND IT THOROUGHLY
BEFORE OPERATING THIS UNIT AND RETAIN THIS
BOOKLET FOR FUTURE REFERENCE
Safety Device, Warning Label
1. Before operation, please ensure the presence of adequate guarding and safety devices to avoid accident.
2. When tear down the safety device, please keep it in the original position,and make sure it works in good
condition.
3. Please make sure the warning label can be seen clearly. If peeled off or stained, please contact us freely
for a new one. When safety device malfunctions, no running of the machine after removing safety device.
Or it will cause severe injuries and casualty accidents.
Usage
1. You agree that you will solely be responsible for your using of any products and services provided to you
and that you will use our products and services legally and only for the purposes that they are intended to
be used for.
2. You agree that you will not misuse the products and/or services supplied and that you will abide by any
laws applicable to this agreement or the operation of it.
Training
In case of any accidents that caused by improper operation, only those who have the training designated by
Neoden, equipped with proper knowledge and operation skills can operate this machine.
Notes
1. Please read this user manual completely before operating this unit and retain this booklet for
future reference.
2. The contents include all features of NeoDen 3V, some of which may not be equipped on
your machine.
3. Basic training and basic SMT knowledge is required for an operator.
4. For routine inspection and repair,please contact sales for operating instruction. During the
repairing process, please use the spare parts provided by Neoden.