User-Manual-NeoDen3V-PNP-machine.pdf - 第34页
29 Click “align” to enter follow ing interface: Operation Step: Mov e th e nozzle to a ny po sition a bove a PCB, stick on e c arbon paper on the PCB , c lick “ Tr ail”, the nozzle and needle will go do wn to leave e ach…
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Upward Photograph Angle: If find all chip have same angle problem during the placement, can adjust value
here(Temporary can't use)
Upward Photograph Exposure: Adjust the brightness of the up-looking camera
2.4.2.2. Nozzle Alignment
Find the” Align” button of each nozzle, click “Align” and choose nozzle center pos and then click “Lens rotation”,
up-looking camera will shine for many times, finally “Save “ the values. Also you can use the mouse to adjust the
cross-line to the center of each nozzle by manual.
2.4.2.3. Nozzle 1 and Camera Relative Position
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Click “align” to enter following interface:
Operation Step: Move the nozzle to any position above a PCB, stick one carbon paper on the PCB, click “Trail”,
the nozzle and needle will go down to leave each trails automatically , then click “nozzle1”, use the camera
to match the cross line to the trails center of nozzle 1 and needle, finally “save” the values.
Trash Box Position: Setting “throw components” position as you like.
2.5. First Trial and Test
2.5.1. First Dry Run
Usually we would suggest you to have a dry run (no components are loaded) before production test. After it goes
smoothly, you can start to produce few boards.
2.5.2. Production Test
Make a programming file
Test the file to pick and place components.
2.5.3. Component Inspection
2.5.3.1. Inspection Items
Check if the specification, direction, polarity of components are aligned with what they should be.
Whether the components are damaged or the pins are distorted.
Whether the component is off beyond allowance.
2.5.3.2. Inspection Method
The inspection methods vary from the equipment that you have.
Except visual inspection, all of amplifier, microscope, online or offline AOI equipment can be applied if the pitch
of IC is quite small to check.
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2.5.3.3. Inspection Standard
If there is any issue of specification, direction and polarity, please follow process file to amend.
If the components are off, please adjust the file by following two methods
1) If the placement effects of all components are off in the same direction, it would be the fiducial issues. Please
resolve this issue by adjusting the coordinate of fiducials according to its value of deviation.
2) If there are several components off beyond allowance, you’d better adjust their coordinates on working file
with down-looking camera.
If there are couple of issues occur during test, some other points need to be considered.
1) Frequent pickup failure. Some suggestions are listed below,
2) The pick height is inappropriate, please revise the value after an inspection or a pick-test;
3) The pick offset needs an adjustment, it should be aligned with the center of component reel slot rather than
that of component.
4) Due to peel strength or installation issue of wasted film, the film on tape won’t be peeled completely
5) The nozzle was blocked
6) The nozzle is damaged or has a crack
7) The size issue of nozzle would cause air leakage or insufficient suction.
8) The air hose is blocked or has a leakage problem, and even the pump has an issue.
Frequently throwing components. Some suggestions are listed below,
1) Up-looking camera can’t take a clear picture of component due to brightness issue for example.
2) The pins are distorted
3) The size or shape isn’t aligned with that in “Footprint library’’
4) The size of nozzle is inappropriate or insufficient suction.
5) The nozzle has solder paste or rubbish cause air leakage
6) The nozzle is damaged or cracked cause air leakage
2.6. Continuous SMT Production
Follow the SOP to start production
Notes:
Do not touch the surface to board to avoid damaging the printed solder paste.
When the error message occurs, please checkout and solve it a.s.a.p.
Once reloading the component during production, pay attention to the model,specification,polarity and
direction of components.
Clear the trash box timely to avoid wasted materials stacked too high to damage the mount head.