三星SM421 Introduction硬件装机手册_.pdf - 第11页
iii 6.1. Head 组件( Head As sembly ) ............ ............ .............. .......... .............. 6-1 6.1.1. Head 组件 ............. .......................... .................................... ...............…

Samsung Component Placer SM421 Introduction
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2.6.
PCB 规格 .............................................................................................. 2-7
2.6.1.
PCB 的规格,弯曲允许误差..................................................................... 2-7
2.6.2.
PCB 的条件 .............................................................................................. 2-8
2.7.
PCB Transport 规格.............................................................................. 2-9
2.7.1.
PCB Transport System............................................................................. 2-9
2.7.2.
PCB Conveyor System 的高度................................................................. 2-9
2.7.3.
Regulator 的压力设定............................................................................... 2-9
2.8.
吸嘴 (Nozzle) 规格 ............................................................................. 2-10
2.8.1.
一般吸嘴................................................................................................. 2-10
2.8.2.
特殊吸嘴..................................................................................................2-11
2.8.3.
吸嘴的配置 ............................................................................................. 2-12
2.9.
各贴片头的可接近 Slot 区域................................................................. 2-13
第 3 章.
设备的名称及构成 .................................................................................. 3-1
3.1.
设备的外观及名称.................................................................................. 3-1
3.2.
系统的构成 ............................................................................................ 3-3
3.2.1.
机械部分的构成 ........................................................................................ 3-3
3.2.2.
控制部分的构成 ........................................................................................ 3-4
3.3.
坐标系 ............................................................................................... 3-5
3.3.1.
X, Y 轴...................................................................................................... 3-5
3.3.2.
Z 轴 ......................................................................................................... 3-5
3.3.3.
Theta (R) 轴............................................................................................ 3-5
3.3.4.
Conveyor 轴 ............................................................................................ 3-6
第 4 章.
运行操作部分 ......................................................................................... 4-1
4.1.
运行面板的开关操作 .............................................................................. 4-1
4.2.
Signal Light 的亮灯基准 ........................................................................ 4-3
4.3.
示教盒(Teaching Box)的按键操作 .................................................... 4-4
第 5 章.
传感器的功能 ......................................................................................... 5-1
5.1.
门开关 (Door Switch) ........................................................................... 5-1
5.2.
喂料器 Check 传感器 ............................................................................. 5-2
5.3.
PCB 的感应传感器................................................................................. 5-3
5.4.
设备上传感器的位置 .............................................................................. 5-5
5.4.1.
The Sensor Lay-Out(传感器的排列图) ................................................ 5-5
5.4.2.
The Sensor Part List(传感器部品清单) ................................................ 5-6
第 6 章.
Module Function .................................................................................... 6-1

iii
6.1.
Head 组件(Head Assembly) .............................................................. 6-1
6.1.1.
Head 组件 .................................................................................................6-1
6.2.
X-Y 框架部分......................................................................................... 6-2
6.2.1.
结构 ..........................................................................................................6-2
6.3.
PCB Transport System ..........................................................................6-2
6.3.1.
构成 ..........................................................................................................6-2
6.3.2.
功能 ..........................................................................................................6-3
6.4.
部品吸着不良的检测...............................................................................6-4
6.5.
PCB 坐标的补偿功能 (基准点的识别) .................................................... 6-5
6.5.1.
Fiducial Inspection(基准点的检查) .......................................................6-5
6.6.
Flying Vision...........................................................................................6-7
6.6.1.
概要 ..........................................................................................................6-7
6.6.2.
光路控制....................................................................................................6-7
6.6.3.
照明 ..........................................................................................................6-9
6.7.
Stage Camera...................................................................................... 6-10
6.7.1.
光路控制..................................................................................................6-10
6.8.
ANC (Auto Nozzle Changer) ................................................................ 6-12
6.9.
吸嘴 (Nozzle).......................................................................................6-13
6.9.1.
吸嘴的种类 ..............................................................................................6-13
6.10.
喂料器底座(Feeder Station)部分 .....................................................6-14
6.11.
部品供应喂料器.................................................................................... 6-14
6.11.1.
带式喂料器(Tape feeder)....................................................................6-15
6.11.2.
振动杆式喂料器(Vibration stick feeder) ..............................................6-21
6.12.
压缩气动部分 ....................................................................................... 6-22
第 7 章.
设备安装操作步骤...................................................................................7-1
7.1.
设备安装 ............................................................................................... 7-1
7.1.1.
设备卸载....................................................................................................7-1
7.1.2.
包装拆卸及设备搬入..................................................................................7-1
7.1.3.
设备安装....................................................................................................7-4
7.1.4.
Power Connection...................................................................................7-12
7.1.5.
Motor I/O 确认 ........................................................................................7-15
7.1.6.
设置设备间的通信 Interface ....................................................................7-16
7.1.7.
Warming Up ............................................................................................7-19
7.2.
Calibration 及最后检查 ........................................................................ 7-20
7.3.
部品供给装置的准备............................................................................. 7-20

Samsung Component Placer SM421 Introduction
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7.4.
输送带设置 .......................................................................................... 7-20
7.5.
Backup Pin 设定................................................................................. 7-21