AOIGUI_ProgrammingManual_CHN.pdf - 第4页

K oh Y oung Technolo g y Inc. 4 目录 1. 序言 .................................................................................................................... 6 1.1. 必备程序及信息 ...............................................…

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修订记录
编号
日期
说明
备注
1.0
2012-09-07
AOIGUI 2.3.1
1.1
2014-02-25
AOIGUI 2.3.6
2.0
2016-04-15
AOIGUI 2.6.0
2.1
2017-02-10
AOIGUI 2.7.0
2.2
2017-06-30
AOIGUI 2.7.1
2.3
2018-07-12
AOIGUI 2.7.3
2.4
2019-02-27
AOIGUI 2.7.4
2.5
2019-11-07
AOIGUI 2.7.4.2
Koh Young Technology Inc.
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目录
1. 序言 .................................................................................................................... 6
1.1. 必备程序及信息 ....................................................................................................................................... 6
1.2. 程式编程步骤及检测项目 .................................................................................................................... 6
2. 基本软件 ............................................................................................................ 9
2.1. ePM-AOI ..................................................................................................................................................10
2.2. AOI GUI .....................................................................................................................................................12
2.3. 维修站 .......................................................................................................................................................65
3. 加载程式 ......................................................................................................... 74
3.1. 打开程式文件 .........................................................................................................................................74
3.2. 自动导入最近打开的程式文件 .........................................................................................................81
4. 生成程式文件 ................................................................................................. 82
4.1. 生成KYPCB文件 .....................................................................................................................................83
4.2. 基准点校准 ..............................................................................................................................................87
4.3. 采集图片 ..................................................................................................................................................97
4.4. CRD导入 ................................................................................................................................................ 100
4.5. 封装登录 ............................................................................................................................................... 102
4.6. 代替料号(Alternative Part) ............................................................................................................... 107
4.7. 设置检测条件 ...................................................................................................................................... 113
4.8. Copy & Paste Condition ................................................................................................................... 115
5. 检测条件设置 ............................................................................................... 117
5.1. 定义检测算法&封装类型................................................................................................................. 118
5.2. 对元件本体的预设置及检测条件设置 ........................................................................................ 121
5.3. 对元件引脚的预设置及检测条件设置 ........................................................................................ 137
5.4. 对Chips的检测条件设置(Solder Fillet only) ............................................................................... 151
5.5. 在不良视图上确认检测结果 ........................................................................................................... 155
5.6. PressFit Inspection Condition ......................................................................................................... 159
5.7. Through Hole Inspection ................................................................................................................. 162
6. OLP(Off-line Programming) ................................................................... 168
6.1. 收集数据 ............................................................................................................................................... 168
6.2. 运行OLP模式 ....................................................................................................................................... 171
6.3. Job Deploy ............................................................................................................................................ 172
Koh Young Technology Inc.
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7. 整板异物检测 (Whole Board Foreign Material Inspection) .......... 174
7.1. 需求 ......................................................................................................................................................... 174
7.2. 使用方法 ............................................................................................................................................... 175
7.3. WFMI 手动检测 .................................................................................................................................. 184
8. 侧面相机(Side Camera Option) ............................................................ 186
8.1. 设置方法 ............................................................................................................................................... 186
8.2. 校准方法 ............................................................................................................................................... 188
8.3. 用户界面更改 ...................................................................................................................................... 191
8.4. 检测尺寸大于侧面相机FOV的元件 .............................................................................................. 193
9. 高级功能（Advanced Functions） ......................................................... 199
9.1. Job Tag Set（程式标记） ............................................................................................................... 199
9.2. Array Barcode Automatic Mapping .............................................................................................. 206
9.3. Register All Chips ................................................................................................................................ 209
9.4. 距离检测功能(Pairing Inspection) ................................................................................................. 213
9.5. Auto-Tuning (Inspection Condition Learning, ICL) ................................................................. 219
9.6. 2D本体定位功能(2D Body Finding) ............................................................................................. 222
9.7. Flipper（翻转机） ............................................................................................................................. 227
9.8. 以GPU重建元件的3D图像 ............................................................................................................... 230
9.9. 2nd Position for Cam Barcode功能 .............................................................................................. 234
9.10. 偏移补偿 (Offset Compensation) ................................................................................................. 237
9.11. 重新识别条码与手动输入条码的功能 ........................................................................................ 242