AOIGUI_ProgrammingManual_CHN.pdf - 第5页

K oh Y oung Technolo g y Inc. 5 7. 整板异物检测 (Whole Board Foreign Material Inspection) .......... 174 7.1. 需求 .................................................................................................................…

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目录
1. 序言 .................................................................................................................... 6
1.1. 必备程序及信息 ....................................................................................................................................... 6
1.2. 程式编程步骤及检测项目 .................................................................................................................... 6
2. 基本软件 ............................................................................................................ 9
2.1. ePM-AOI ..................................................................................................................................................10
2.2. AOI GUI .....................................................................................................................................................12
2.3. 维修站 .......................................................................................................................................................65
3. 加载程式 ......................................................................................................... 74
3.1. 打开程式文件 .........................................................................................................................................74
3.2. 自动导入最近打开的程式文件 .........................................................................................................81
4. 生成程式文件 ................................................................................................. 82
4.1. 生成KYPCB文件 .....................................................................................................................................83
4.2. 基准点校准 ..............................................................................................................................................87
4.3. 采集图片 ..................................................................................................................................................97
4.4. CRD导入 ................................................................................................................................................ 100
4.5. 封装登录 ............................................................................................................................................... 102
4.6. 代替料号(Alternative Part) ............................................................................................................... 107
4.7. 设置检测条件 ...................................................................................................................................... 113
4.8. Copy & Paste Condition ................................................................................................................... 115
5. 检测条件设置 ............................................................................................... 117
5.1. 定义检测算法&封装类型................................................................................................................. 118
5.2. 对元件本体的预设置及检测条件设置 ........................................................................................ 121
5.3. 对元件引脚的预设置及检测条件设置 ........................................................................................ 137
5.4. 对Chips的检测条件设置(Solder Fillet only) ............................................................................... 151
5.5. 在不良视图上确认检测结果 ........................................................................................................... 155
5.6. PressFit Inspection Condition ......................................................................................................... 159
5.7. Through Hole Inspection ................................................................................................................. 162
6. OLP(Off-line Programming) ................................................................... 168
6.1. 收集数据 ............................................................................................................................................... 168
6.2. 运行OLP模式 ....................................................................................................................................... 171
6.3. Job Deploy ............................................................................................................................................ 172
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7. 整板异物检测 (Whole Board Foreign Material Inspection) .......... 174
7.1. 需求 ......................................................................................................................................................... 174
7.2. 使用方法 ............................................................................................................................................... 175
7.3. WFMI 手动检测 .................................................................................................................................. 184
8. 侧面相机(Side Camera Option) ............................................................ 186
8.1. 设置方法 ............................................................................................................................................... 186
8.2. 校准方法 ............................................................................................................................................... 188
8.3. 用户界面更改 ...................................................................................................................................... 191
8.4. 检测尺寸大于侧面相机FOV的元件 .............................................................................................. 193
9. 高级功能（Advanced Functions） ......................................................... 199
9.1. Job Tag Set（程式标记） ............................................................................................................... 199
9.2. Array Barcode Automatic Mapping .............................................................................................. 206
9.3. Register All Chips ................................................................................................................................ 209
9.4. 距离检测功能(Pairing Inspection) ................................................................................................. 213
9.5. Auto-Tuning (Inspection Condition Learning, ICL) ................................................................. 219
9.6. 2D本体定位功能(2D Body Finding) ............................................................................................. 222
9.7. Flipper（翻转机） ............................................................................................................................. 227
9.8. 以GPU重建元件的3D图像 ............................................................................................................... 230
9.9. 2nd Position for Cam Barcode功能 .............................................................................................. 234
9.10. 偏移补偿 (Offset Compensation) ................................................................................................. 237
9.11. 重新识别条码与手动输入条码的功能 ........................................................................................ 242
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1. 序言
ZENITH，Koh Young的3DAutomatic Optical Inspection系统为板检测而实行‘程式编程’。ZENITH的‘程式
编程’通过 ZENITH软件，收集并编辑元件信息和检测条件。
本文讲述为程式编程须知的信息，包括所需要的软件、程式编程程序及检测范围。
• ePM-AOI: 生成KYPCB文件。
• AOI GUI: 导入KYPCB文件或程式文件，转换或编辑。用结果程式文件实行检测。
• 维修站: 检查检测结果。
使用AOI系统进行基板检测时，为创建KYPCB文件，需要以下3种信息之一。
• PCB Gerber File / Files & Placement file
- Placement file: 包括元件的X/Y/角度、料号、封装名的txt文件或excel文件
• ODB++ files
- Intelligent CAD (One of Allegro Export files或Mentor Export files)
运行程式编程的基本步骤及可使用AOI系统检测的项目如下。
程式编程程序
为了 ZENITH 程式编程，准备所需要的文件(信息)。
提取板尺寸、各元件的位置(X, Y坐标和角度)、焊盘、料号、封装名、基准点及基板连班。将
这些信息保存在KYPCB文件。
从封装库和检测条件Library，自动或手动载入封装信息或检测条件。将这些保存在KYPCB文
件。
设置各封装、料号及元件的检测条件。
通过检测几个板，找出假性不良。为了特定元件，微调检测条件。
将该程式文件适用于生产。