IPC-SM-782A-表面贴装焊盘图形设计标准.pdf.pdf - 第126页

4.0 COMPONENT DIMENSIONS Figure 2 provides the component dimensions for SOPIC components. Component Identiﬁer (mm) T ype L (mm) S (mm) W (mm) T (mm) A (mm) B (mm) H (mm) P (mm) min max min max min max min max min max max…

1.0 SCOPE

This subsection provides component and land pattern dimen-

sions for small outline packages (SOP components) with gull-

wing leads on two sides. Basic construction of the SOP

device is also covered. At the end of this subsection is a list-

ing of the tolerances and target solder joint dimensions used

to arrive at the land pattern dimensions.

2.0 APPLICABLE DOCUMENTS

See Section 9.0 and the following for documents applicable to

this subsection.

2.1 Electronic Industries Association of Japan (EIAJ)

EIAJ-7402-1

General Rules for the Preparation of Outine

Drawings of Integrated Circuits Small Outline Packages

3.0 COMPONENT DESCRIPTIONS

3.1 Basic Construction

IPC-SM-782 has defined center-

to-center spacing for the land pattern slightly differently than is

indicated in the EIAJ specification ED 7402-1.

This specification allows for 6 families of the SOP. EIAJ clas-

sifies the families by the center-to-center distance of the land

patterns and the outer extremities of the leads (dimension ‘‘L’’

in IPC-SM-782). The basic construction of the SOP specified

by EIAJ is the same construction as for SOIC specified by

JEDEC. Both have gullwing leads on 1.27 mm centers.

The EIAJ specification allows for a number of positions of the

components to be in any of the families (e.g., body width). The

sizes shown in Figure 2 are the most common, however, there

are Type II SOP 14s and there are also Type I SOP 16s. See

Figure 2.

3.1.1 Termination Materials Leads must be solder-

coated with a tin/lead alloy. The solder should contain

between 58 to 68% tin. Solder may be applied to the leads by

hot dipping or by plating from solution. Plated solder termina-

tions should be subjected to post-plating reflow operation to

fuse the solder. The tin/lead finish should be at least 0.0075

mm [0.0003 in] thick.

3.1.2 Marking Parts are available with or without part

number markings. Usually an index mark indicates pin 1.

3.1.3 Carrier Package Format Bulk rods, 24 mm tape/

8–12 mm pitch is preferred for best handling. Tube carriers

are also used.

3.1.4 Resistance to Solder Parts should be capable of

withstanding ten cycles through a standard reflow system

operating at 215°C. Each cycle shall consist of 60 seconds

exposure at 215°C. Parts must also be capable of withstand-

ing a minimum of 10 seconds immersion in molten solder at

260°C.

IPC-782-9-3-1

Figure 1 SOPIC construction

IPC-SM-782

Surface Mount Design

and Land Pattern Standard

Date

5/96

Section

9.3

Revision

Subject

SOP

Page1of4

4.0 COMPONENT DIMENSIONS

Figure 2 provides the component dimensions for SOPIC components.

Component

Identiﬁer

(mm) Type

L (mm) S (mm) W (mm) T (mm) A (mm)

(mm)

min max min max min max min max min max max max basic

SOP 6 I 5.72 6.99 3.72 5.11 0.35 0.51 0.60 1.00 3.92 4.72 6.35 1.5 1.27

SOP 8 I 5.72 6.99 3.72 5.11 0.35 0.51 0.60 1.00 3.92 4.72 6.35 1.5 1.27

SOP 10 I 5.72 6.99 3.72 5.11 0.35 0.51 0.60 1.00 3.92 4.72 8.89 1.5 1.27

SOP 12 I 5.72 6.99 3.72 5.11 0.35 0.51 0.60 1.00 3.92 4.72 8.89 1.5 1.27

SOP 14 I 5.72 6.99 3.72 5.11 0.35 0.51 0.60 1.00 3.92 4.72 11.43 1.5 1.27

SOP 16 II 7.62 8.89 5.62 7.01 0.35 0.51 0.60 1.00 5.02 6.22 11.43 2.0 1.27

SOP 18 II 7.62 8.89 5.62 7.01 0.35 0.51 0.60 1.00 5.02 6.22 13.97 2.0 1.27

SOP 20 II 7.62 8.89 5.62 7.01 0.35 0.51 0.60 1.00 5.02 6.22 13.97 2.0 1.27

SOP 22 III 9.53 10.80 7.53 8.92 0.35 0.51 0.60 1.00 6.33 8.13 16.51 2.5 1.27

SOP 24 III 9.53 10.80 7.53 8.92 0.35 0.51 0.60 1.00 6.33 8.13 16.51 2.5 1.27

SOP 28 IV 11.43 12.70 9.43 10.82 0.35 0.51 0.60 1.00 8.23 10.03 19.05 3.0 1.27

SOP 30 IV 11.43 12.70 9.43 10.82 0.35 0.51 0.60 1.00 8.23 10.03 21.59 3.0 1.27

SOP 32 V 13.34 14.61 11.34 12.73 0.35 0.51 0.60 1.00 10.14 11.94 21.59 3.5 1.27

SOP 36 V 13.34 14.61 11.34 12.73 0.36 0.51 0.60 1.00 10.14 11.94 24.13 3.5 1.27

SOP 40 VI 15.24 16.51 13.24 14.63 0.35 0.51 0.60 1.00 12.04 13.84 27.94 4.0 1.27

SOP 42 VI 15.24 16.51 13.24 14.63 0.35 0.51 0.60 1.00 12.04 13.84 27.94 4.0 1.27

Figure 2 SOPIC component dimensions

▼

IPC-782-9-3-2

IPC-SM-782

Subject

SOP

Date

5/96

Section

9.3

Revision

Page2of4

5.0 LAND PATTERN DIMENSIONS

Figure 3 provides the land pattern dimensions for SOPIC

components. These numbers represent industry consensus

on the best dimensions based on empirical knowledge of fab-

ricated land patterns.

In the table, the dimensions shown are at maximum material

condition (MMC). The least material condition (LMC) should

not exceed the fabrication (F) allowance shown on page 4.

The LMC and the MMC provide the limits for each dimension.

The dotted line in Figure 3 shows the grid placement court-

yard which is the area required to place land patterns and

their respective components in adjacent proximity without

interference or shorting. Numbers in the table represent the

number of grid elements (each element is 0.5 by 0.5 mm) in

accordance with the international grid detailed in IEC publica-

tion 97.

RLP No.

Component

Identiﬁer Z (mm) G (mm) X (mm)

Y (mm) C (mm) D (mm) E (mm)

Placement Grid

(No. Grid

Elements)ref ref ref basic

360A SOP 6 7.40 3.00 0.60 2.20 5.20 2.54 1.27 16x14

361A SOP 8 7.40 3.00 0.60 2.20 5.20 3.81 1.27 16x14

362A SOP 10 7.40 3.00 0.60 2.20 5.20 5.08 1.27 16x18

363A SOP 12 7.40 3.00 0.60 2.20 5.20 6.35 1.27 16x18

364A SOP 14 7.40 3.00 0.60 2.20 5.20 7.62 1.27 16x24

365A SOP 16 9.40 5.00 0.60 2.20 7.20 8.89 1.27 20x24

366A SOP 18 9.40 5.00 0.60 2.20 7.20 10.16 1.27 20x28

367A SOP 20 9.40 5.00 0.60 2.20 7.20 11.43 1.27 20x28

368A SOP 22 11.20 6.80 0.60 2.20 9.00 13.97 1.27 24x34

369A SOP 24 11.20 6.80 0.60 2.20 9.00 13.97 1.27 24x34

370A SOP 28 13.20 8.80 0.60 2.20 11.00 16.51 1.27 28x40

371A SOP 30 13.20 8.80 0.60 2.20 11.00 17.78 1.27 28x44

372A SOP 32 15.00 10.60 0.60 2.20 12.80 19.05 1.27 32x44

373A SOP 36 15.00 10.60 0.60 2.20 12.80 21.59 1.27 32x50

374A SOP 40 17.00 12.60 0.60 2.20 14.80 24.13 1.27 36x56

375A SOP 42 17.00 12.60 0.60 2.20 14.80 25.40 1.27 36x56

Figure 3 SOPIC land pattern dimensions

▼

GC Z

▼

Grid

placement

courtyard

IPC-782-9-3-3

IPC-SM-782

Subject

SOP

Date

5/96

Section

9.3

Revision

Page3of4