IPC-SM-782A-表面贴装焊盘图形设计标准.pdf.pdf - 第134页

4.0 COMPONENT DIMENSIONS Figure 2 provides the component dimensions for CFP components. CFP Component Identiﬁer Pin Count L (mm) S (mm) W (mm) T (mm) A (mm) B (mm) H (mm) E min max min max min max min max min max max max…

1.0 SCOPE

This subsection provides the component and land pattern

dimensions for ceramic flat packs (CFP components) with

gullwing leads on two sides. Basic construction of the CFP

device is also covered. At the end of this subsection is a list-

ing of the tolerances and target solder joint dimensions used

to arrive at the land pattern dimensions.

2.0 APPLICABLE DOCUMENTS

See Section 9.0 and the following for documents applicable to

this subsection.

JEDEC Publication 95 Registered and Standard Outlines for

Solid State and Related Products:

Outline Issues Title

MO-003 C Flatpack Family, 5.08 Width, 1.27

Pitch

MO-004 C Flatpack Family, 7.62 Width, 1.27

Pitch

MO-018 — Flatpack Family, 10.16 Width,

1.27 Pitch

MO-019 D Flatpack Family, 10.16 Width,

1.27 Pitch

MO-020 C Flatpack Family, 12.70 Width,

1.27 Pitch

MO-021 C Flatpack Family, 15.24 Width,

1.27 Pitch

MO-022 D Flatpack Family, 17.78 Width,

1.27 Pitch

MO-023 C Flatpack Family, 22.86 Width,

1.27 Pitch

Application for copies should be addressed to:

Global Engineering Documents

1990 M Street N.W.

Washington, DC

3.0 COMPONENT DESCRIPTIONS

3.1 Basic Construction

See Figure 1. Basic construction

consists of a ceramic body and metallic leads. Leads are

trimmed and formed into gullwing shape as shown in Figure 2.

3.1.1 Termination Materials Leads should be solder-

coated with a tin/lead alloy. The solder should contain

between 58 to 68% tin. Solder may be applied to the termi-

nation by hot dipping or by plating from solution. Plated sol-

der terminations should be subjected to a post-plating reflow

operation to fuse the solder. The tin/lead finish should be at

least 0.00075 mm [0.0003 in] thick.

3.1.2 Marking All parts shall be marked with a part num-

ber and an index area. The index area shall identify the loca-

tion of pin 1.

3.1.3 Carrier trays are used for handling CFPs.

3.1.4 Resistance to Soldering Parts should be capable of

withstanding ten cycles through a standard reflow system

operating at 215°C. Each cycle shall consist of 60 seconds

exposure at 215°C. Parts must also be capable of withstand-

ing a minimum of 10 seconds immersion in molten solder at

260°C.

IPC-782-9-5-1

Figure 1 CFP construction

IPC-SM-782

Surface Mount Design

and Land Pattern Standard

Date

8/93

Section

9.5

Revision Subject

CFP

Page1of4

4.0 COMPONENT DIMENSIONS

Figure 2 provides the component dimensions for CFP components.

CFP

Component

Identiﬁer

Count

L (mm) S (mm) W (mm) T (mm) A (mm)

(mm)

(mm) E

min max min max min max min max min max max max basic

MO-003 10 9.00 9.60 6.46 7.26 0.25 0.35 0.90 1.27 2.54 5.08 7.36 2.50 1.27

MO-003 14 9.00 9.60 6.46 7.26 0.25 0.35 0.90 1.27 2.54 5.08 9.90 2.50 1.27

MO-004 10 11.00 11.60 8.46 9.26 0.38 0.48 0.90 1.27 5.08 7.62 7.36 2.50 1.27

MO-004 14 11.00 11.60 8.46 9.26 0.38 0.48 0.90 1.27 5.08 7.62 9.90 2.50 1.27

MO-004 16 11.00 11.60 8.46 9.26 0.38 0.48 0.90 1.27 5.08 7.62 11.17 2.50 1.27

MO-018 20 11.00 11.60 8.46 9.26 0.25 0.35 0.90 1.27 7.62 10.16 13.71 2.50 1.27

MO-019 24 15.00 15.60 12.46 13.26 0.38 0.48 0.90 1.27 7.62 10.16 16.25 2.50 1.27

MO-019 28 15.00 15.60 12.46 13.26 0.46 0.56 0.90 1.27 7.62 10.16 18.79 2.50 1.27

MO-020 36 17.00 17.60 14.46 15.26 0.38 0.48 0.90 1.27 10.16 12.70 23.87 3.00 1.27

MO-020 40 17.00 17.60 14.46 15.26 0.33 0.43 0.90 1.27 10.16 12.70 26.41 3.00 1.27

MO-021 16 20.00 20.60 17.46 18.26 0.38 0.48 0.90 1.27 12.70 15.24 11.17 2.50 1.27

MO-021 24 20.00 20.60 17.46 18.26 0.38 0.48 0.90 1.27 12.70 15.24 16.25 2.50 1.27

MO-021 36 20.00 20.60 17.46 18.26 0.38 0.48 0.90 1.27 12.70 15.24 23.87 3.00 1.27

MO-022 20 22.00 22.60 19.46 20.26 0.38 0.48 0.90 1.27 15.24 17.78 13.71 2.50 1.27

MO-022 42 22.00 22.60 19.46 20.26 0.46 0.56 0.90 1.27 15.24 17.78 27.68 3.00 1.27

MO-023 36 27.00 27.60 24.46 25.26 0.38 0.48 0.90 1.27 20.32 22.86 23.87 3.00 1.27

MO-023 50 27.00 27.60 24.46 25.26 0.38 0.48 0.90 1.27 20.32 22.86 32.76 3.00 1.27

Figure 2 CFP component dimensions

▼

IPC-782-9-5-2

IPC-SM-782

Subject

CFP

Date

8/93

Section

9.5

Revision

Page2of4

5.0 LAND PATTERN DIMENSIONS

Figure 3 provides the land pattern dimensions for CFP com-

ponents. These numbers represent industry consensus on the

best dimensions based on empirical knowledge of fabricated

land patterns.

In the table, the dimensions shown are at maximum material

condition (MMC). The least material condition (LMC) should

not exceed the fabrication (F) allowance shown on page 4.

The LMC and the MMC provide the limits for each dimension.

The dotted line in Figure 3 shows the grid placement court-

yard which is the area required to place land patterns and

their respective components in adjacent proximity without

interference or shorting. Numbers in the table represent the

number of grid elements (each element is 0.5 by 0.5 mm) in

accordance with the international grid detailed in IEC publica-

tion 97.

RLP No.

Component

Identiﬁer

Count Z (mm) G (mm) X (mm)

(mm)

Placement Grid

(No. Grid

Elements)ref ref ref basic

420 MO-003 10 10.20 6.00 0.65 2.20 8.0 5.08 1.27 22x16

421 MO-003 14 10.20 6.00 0.65 2.20 8.0 7.62 1.27 22x22

422 MO-004 10 12.20 8.00 0.65 2.20 10.0 5.08 1.27 26x16

423 MO-004 14 12.20 8.00 0.65 2.20 10.0 7.62 1.27 26x22

424 MO-004 16 12.20 8.00 0.65 2.20 10.0 8.89 1.27 26x24

425 MO-018 20 12.20 8.00 0.65 2.20 10.0 11.43 1.27 26x28

426 MO-019 24 16.20 12.00 0.65 2.20 14.0 13.97 1.27 34x34

427 MO-019 28 16.20 12.00 0.65 2.20 14.0 16.51 1.27 34x38

428 MO-020 36 18.20 14.00 0.65 2.20 16.0 21.59 1.27 38x48

429 MO-020 40 18.20 14.00 0.65 2.20 16.0 24.13 1.27 38x54

430 MO-021 16 21.20 17.00 0.65 2.20 19.0 8.89 1.27 44x24

431 MO-021 24 21.20 17.00 0.65 2.20 19.0 13.97 1.27 44x34

432 MO-021 36 21.20 17.00 0.65 2.20 19.0 21.59 1.27 44x48

433 MO-022 20 23.20 19.00 0.65 2.20 21.0 11.43 1.27 48x28

434 MO-022 42 23.20 19.00 0.65 2.20 21.0 25.40 1.27 48x56

435 MO-023 36 28.20 24.00 0.65 2.20 26.0 21.59 1.27 58x48

436 MO-023 50 28.20 24.00 0.65 2.20 26.0 30.48 1.27 58x66

Figure 3 CFP land pattern dimensions

▼

Full radius

optional

▼

Grid

placement

courtyard

IPC-782-9-5-3

IPC-SM-782

Subject

CFP

Date

8/93

Section

9.5

Revision

Page3of4