IPC-SM-782A-表面贴装焊盘图形设计标准.pdf.pdf - 第227页
Revision History for IPC-SM-782 Standard The following is a listing of major alterations and additions to the IPC-SM-782 Standard since its initial publication in March 1987. The standard went through a comprehensive rev…
ANSI/IPC-T-50 Terms and Definitions for
Interconnecting and Packaging Electronic Circuits
Definition Submission/Approval Sheet
The purpose of this form is to keep
current with terms routinely used in
the industry and their definitions.
Individuals or companies are
invited to comment. Please
complete this form and return to:
IPC
2215 Sanders Road
Northbrook, IL 60062-6135
Fax: 847 509.9798
SUBMITTOR INFORMATION:
Name:
Company:
City:
State/Zip:
Telephone:
Date:
❑ This is a NEW term and definition being submitted.
❑ This is an ADDITION to an existing term and definition(s).
❑ This is a CHANGE to an existing definition.
Term Definition
If space not adequate, use reverse side or attach additional sheet(s).
Artwork: ❑ Not Applicable ❑ Required ❑ To be supplied
❑ Included: Electronic File Name:
Document(s) to which this term applies:
Committees affected by this term:
Office Use
IPC Office Committee 2-30
Date Received:
Comments Collated:
Returned for Action:
Revision Inclusion:
Date of Initial Review:
Comment Resolution:
Committee Action: ❑ Accepted ❑ Rejected
❑ Accept Modify
IEC Classification
Classification Code • Serial Number
Terms and Definition Committee Final Approval Authorization:
Committee 2-30 has approved the above term for release in the next revision.
Name:
Committee: Date:
IPC 2-30
ASSOCIATION CONNECTING
ELECTRONICS INDUSTRIES
Revision History for IPC-SM-782 Standard
The following is a listing of major alterations and additions
to the IPC-SM-782 Standard since its initial publication in
March 1987. The standard went through a comprehensive
revision in August 1993, followed by an amendment in
October 1996.
Changes addressed within Revision A:
• Complete revision of document to establish independent
sections (8.0 - 13.0) representing requirements for fami-
lies of surface-mountable components. Each section,
in turn, was broken down into four subsections high-
lighting component description, component dimensions,
land pattern dimensions, and finally, tolerance analysis.
• Listing of all registered land pattern numbers for com-
ponent types in both existing and future sections.
• Inclusion of a dedicated section (3.3) establishing
dimensional criteria for components, land patterns, and
positional accuracy of component placement capabilities.
Also contains examples of typical package styles and
their respective double letter designators.
• Inclusion of a dedicated section (3.5) highlighting envi-
ronmental constraints. Addresses worst-case use envi-
ronments for surface mount electronic assemblies in
nine major use categories. Includes discussion of both
design service life and acceptable cumulative failure
probability for each of these categories.
Changes addressed within Amendment 1:
• Alteration of formulas within Section 3.3.1 on Compo-
nent Tolerancing.
• Corrections to technical and typographical errors
throughout Section 3.6 on Component Spacing.
• Corrections to technical and typographical errors
throughout Section 3.7 on Outer Layer Finishes.
• Replacement of 15 figures throughout the first seven
sections, as well as a subsequent replacement of 39
tables in Sections 8 through 13 that address corrections
to component and land pattern dimensions for various
component families.
Changes addressed within Amendment 2:
• Inclusion of Section 14.0 addressing land patterns for
components with ball grid array contacts.
December 1999 IPC-SM-782A
ASSOCIATION CONNECTING
ELECTRONICS INDUSTRIES
2215 Sanders Road, Northbrook, IL 60062-6135
Tel. 847.509.9700 Fax 847.509.9798
www.ipc.org
ISBN #1-580981-21-6