00195779-0102_UM_D4_SR605_EN.pdf - 第87页
User manual SIPLACE D4 3 Technical data for the machine From software version SR.605.xx 07/2008 EN Edition 3.1 Performance data 87 3 T echnical dat a for the machine 3.1 Performance dat a 3 Types of placement head 12-seg…
2 Operational safety User manual SIPLACE D4
2.11 ESD guidelines From software version SR.605.xx 07/2008 EN Edition
86
Always place the modules on a conductive surface (table with an ESD coating, conductive ESD
foam, ESD bag or container).
Do not bring modules near visual display units, monitors or televisions. Keep them at least 10 cm
away from the screen.
2.11.4 Measurements and modifications to ESD modules
Do not take measurements on the modules unless the following conditions are fulfilled:
– the measuring device is earthed (e.g. via PE conductors) or
– you discharge the measuring head just before taking measurements with a potential-free
measuring device (e.g. by touching an unpainted metal part of the controller casing).
→ Always use an earthed soldering iron if you carry out any soldering work.
2.11.5 Dispatching ESD modules
→ Always store modules and components in conductive packaging (e.g. metallized plastic bags
or metal sleeves) and dispatch them in conductive packaging.
If the packaging is not conductive, place the modules in a conductive envelope before pack-
aging. Use conductive expanded rubber, ESD bags, domestic aluminum foil or paper, for ex-
ample. NEVER use plastic bags or film. 2
→ If the module has integral batteries, ensure that the conductive packaging does not touch or
short-circuit the battery terminals and, if necessary, first cover the terminals with insulating
tape or material.
User manual SIPLACE D4 3 Technical data for the machine
From software version SR.605.xx 07/2008 EN Edition 3.1 Performance data
87
3 Technical data for the machine
3.1 Performance data
3
Types of placement
head
12-segment Collect&Place head (C&P12)
PLEASE NOTE IPC value [comp./h]
According to the vendor-neutral conditions of the IPC 9850 standard
published by the Association of Connecting Electronics Industries.
SIPLACE Benchmark value [comp./h]
The SIPLACE benchmark value is measured during the machine
acceptance tests. It corresponds to the conditions set out in the
SIPLACE scope of service and supply.
Theoretical maximum output value [comp./h]
The theoretical maximum output value is calculated from the most
favorable conditions for each machine type and setting, and corre-
sponds to the theoretical conditions normally used in the industry.
Number of gantries
4
IPC value Benchmark value Theoretical value
Placement head con-
figuration and place-
ment head rate
[comp./h]
4 x C&P12 57,000 66,000 81,500
Range of components 0.4 x 0.2 mm² (01005)
a
; 0.6 x 0.3 mm (0201)
b
to 18.7 x 18.7 mm²
Component height 6 mm
Placement accuracy CO camera type 28 (18x18): ± 50 μm (3σ), ± 67 μm (4σ)
CO camera type 29 (27x27): ± 50 μm (3σ), ± 67 μm (4σ)
CO camera type 38 (16x16): ± 50 μm (3σ), ± 67 μm (4σ)
Angular accuracy CO camera type 28 (18x18): ± 0.53° (3σ), ± 0.71° (4σ)
CO camera type 29 (27x27): ± 0.53° (3σ), ± 0.71° (4σ)
CO camera type 38 (16x16): ± 0.53° (3σ), ± 0.71° (4σ)
Component feeding 4 component trolleys with tape reel container and integral waste
container (12 x 30 mm wide locations per component trolley )
Feeder module types Tapes, bulk cases, stick magazines, application-specific OEM feeder
modules, surftape feeder modules (8, 12, 16 mm)
3 Technical data for the machine User manual SIPLACE D4
3.2 Ratings From software version SR.605.xx 07/2008 EN Edition
88
3.2 Ratings
3.2.1 Electrical ratings
3
Feeding capacity 48 tape feeder modules 3 x 8 mm S (144 tracks)
48 tape feeder modules 2 x 8 mm S (96 tracks)
48 tape feeder modules 12/16 mm S (48 tracks)
32 tape feeder modules 24/32 mm S (32 tracks)
PCB format
(LxW)
Single conveyor
50 x 50 mm² to 368 x 460 mm²
50 x 110 mm² to 610 x 460 mm² (Long board option)
Width up to 508 mm for Wide board configuration
Dual conveyor
50 x 50 mm² to 368 x 216 mm²
50 x 120 mm² to 610 x 216 mm² (Long board option)
Width up to 242 mm for Wide board configuration
Dual conveyor in Single conveyor mode
50 x 50 mm² to 368 x 380 mm²
50 x 120 mm² to 610 x 380 mm² (Long board option)
PCB thickness 0.3 to 4.5 mm (thicker PCBs available on request)
a) With 01005 package
b) With 0201 package
Supply voltage 3 x 200 VAC ± 5%; 50/60 Hz (Japanese version)
3 x 208 VAC ± 5%; 50/60 Hz (U.S.A. version)
3 x 230 VAC ± 5 %; 50/60 Hz
3 x 380 VAC ± 5 %; 50/60 Hz
3 x 400 VAC ± 5%; 50/60 Hz (European version)
3 x 415 VAC ± 5 %; 50/60 Hz
Fuse 3 x 32 A (3 x 200 VAC / 3 x 208 VAC / 3 x 230 VAC)
3 x 16 A (3 x 380 VAC / 3 x 400 VAC / 3 x 415 VAC)
Nominal apparent power 3.3 kVA
Rated current consumption 8.2 A / 3 x 400 VAC