OPERATING MANAUAL(FOR ENGINEERS).pdf - 第37页
Page 1-1 3Y3C-E-EMD01-A01-03 Chapter 1 OUTLINE OF UNIT OUTLINE OF UNIT CM88 The CM88 is the ultra high-speed chip mounter of the rotary head system, which can mount parts ranging from 1005 chips to large components such …
Page 36
3Y3C-E-EMD00-A04-00
Page 1-1
3Y3C-E-EMD01-A01-03
Chapter 1
OUTLINE OF UNIT
OUTLINE OF UNIT
CM88
The CM88 is the ultra high-speed chip mounter of the rotary head system, which can
mount parts ranging from 1005 chips to large components such as PLCC (8 to 44
mm taped components) with high-speed and high accuracy.
(CM88S is available for 0603 chip CSP as an option.)
The excellent productivity of 0.085 seconds par chip and ability to support various
components will contribute largely to the improvement of your productivity.
The original head structure prevents the tact time from wasting against a nozzle
change or the change of mounting angle. And according to the shape of components,
the most suitable irradiation method of Through and Reflex is automatically selected.
More high-quality mounting of SOJ or PLCC is achieved by directly recognizing their
electrodes.
CM88
4G3C-AA01
Page 1-2
3Y3C-E-EMD01-A01-01
1-1 Features
1-1-1 High Productivity
Physical acceleration added on chip components is suppressed, and ultra high-speed mounting
of 0.085 sec / chip is achieved by drastically shortening the image processing time.
∗ 0.085 sec / chip can be mounted under the following conditions.
• Mounting area
• Mounting angle • Mounting index
High-speed mounting of large components is achieved by adapting the pad nozzle.
Removing and setting the pads are very easy, and mounting without the pad is also possible.
0.085 s /All angles 0.085 s /All Nozzles
Pad nozzle
Large component
Nozzle (No.5)
Pad
X
Y
36 mm
22 mm
3Y3C-013E
Mounting area of
0.085 s
Mounting area of 0.10 s
Nozzle
3Y3C-014E 3Y3C-015E
0°
90°-90°
180°