NXTII spec.pdf - 第39页

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Edition 2.0E - 38 - NXT II Specifications

Tray drawer stand Stand used to store tray drawers. (Max.: 21) C

Tray unit-M (M6(S), M6II,

M6IISP module)

Mounted on device pallet.

Max. 2 units/stage. Slot qty.: 20

Drawer qty.: 10 (1 tray/drawer)

Tray size: 135.9 (W) × 322.6(L) mm (JEDEC standard)

For more information, refer to the “Device Unit

Specifications Manual.”

C

Chip tray pallet for tray unit-M

A pallet which holds chip trays. One tray unit-M can hold

up to 10 pallets.

C

Head maintenance stand

Stand used to secure the head while performing

maintenance

C

PSU (Pallet Stand Unit)

Stand used to store the device pallet. There are 4 types.

• Stand for four M3II pallets

• Stand for two M6II, M6IISP pallets

• Stand for four M3II bucket-type pallets

• Stand for two M6II, M6IISP bucket-type pallets

Leveling sheet specification is standard. Optional caster

type is also available (more floor space is required than

standard type).

C

MSU (Module Stand Unit)

Stand used to hold spare modules.

2 M3II modules and 1 M6II, M6IISP module can be set.

C

Engineering panel stand

Stand for the computer with the engineering panel.

Casters are attached.

C

PCB ID (2D code) read

function using the

Fiducial mark camera

This function is used to read IDs (2D codes) on the PCB

surface with the fiducial mark camera.

This is a Fujitrax option and can be selected when using

Fujitrax Profiler.

B

DFU (Dip Flux Unit)

Unit used to apply flux to bumps of parts.

Loaded on the device pallet. Equipped with automatic

flux supply unit.

Select from two types; the bridge type (flux reservoir

slides back and forth) and rotary type (flux reservoir

rotates).

1. Bridge type

Occupies 9 slots

Thickness of the flux: 0.030 ~ 0.500 mm (adjustable)

Flux thickness shape: 45 x 45 (H01,H02 1 nozzle),

20 x 20 (H02 2 nozzles),

15 x 15 (G04)

2. Rotary type

Occupies 12 slots

Thickness of the flux: 0.03 ~ 0.150 mm

(adjustable)

Flux thickness shape: 45 x 45 (H01, H02 1 nozzle),

20 x 20 (H02 2 nozzles),

15 x 15 (G04)

C

Coplanarity sensor

This sensor checks the height of leads and bumps. It can

be installed onto a M6II, M6IISP module. Refer to the

“Coplanarity sensor specifications manual” for details.

A

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Edition 2.0E - 39 - NXT II Specifications

M

Tray feeder for chip trays.

Loaded on the M3II or M6II, M6IISP device pallet (11

slots required).

Adapter for 2" tray is attached to the unit as standard,

while those for 3" and 4" trays are optional.

Refer to the "Device unit specifications manual" for

details.

C

Tray feeder

L

Tray feeder for chip and JEDEC trays.

Loaded on the M6II, M6IISP device pallet (14 slots

required).

One JEDEC tray can be loaded on a tray feeder-L.

Adapters for chip trays (2", 3" and 4") are optional.

Refer to the "Device unit specifications manual" for

details.

C

Parts presence check function

This function checks for the presence of parts on the

nozzle tip before and after placement and is an optional

function for the head. Refer to "7.2 Parts Presence

Check Function" for details.

A

Tray unit-M change unit

This is used when removing a tray unit-M from a feeder

pallet.

It is possible to set one tray unit-M on a tray unit-M

change unit.

These are dedicated for NXT machines.

A: Installed during machine assembly

B: On-site option installation possible

C: Supported with purchase of individual unit

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Edition 2.0E - 40 - NXT II Specifications

7.2. Parts Presence Check Function

This function detects the presence of parts on the nozzle tip. On H12HSQ,

H12SQ and H08Q heads, and it is also possible to check for tombstoning.

A sensor for the parts presence check function is attached to the head when it is

assembled. It is not possible to modify the head or purchase the sensor after the

machine has shipped.

Restrictions and specifications for this function are shown below.

Item H12HSQ H12SQ H08Q G04Q

M3II 22500 18000

11000

6800

M6II 22500 18000

11000

6800

Parts

presence

function OFF

M6IISP 18500 17000

10000

6200

M3II 22500 15000

10000

6800

M6II 22500 15000

10000

6800

Check

before/after

placement

M6IISP 18500 14000

9000

6200

M3II 22500 16500

10500

6800

M6II 22500 16500

10500

6800

Throughput

CPH

Note 1,2

(chip/hour)

Tombstone

check

M6IISP 18500 15500

9500

6200

Applicable part size

Same as

standard heads

(see 3.4 Head

Specifications)

← ← ←

Part thickness (Parts presence check

function ON)

0.12 ~ ← ← ←

Part thickness (Parts tombstoning check

function ON)

*4

0.12 ~ 1.2 0.12 ~ 1.2 0.12 ~ 1.2 0.12 ~ 1.5

Applicable nozzles

Nozzles with

rubber pads

cannot be used

← ←

All

nozzles