SIPLACE CA4 V2规格说明书.pdf - 第20页

20 Panel lane and wafer lane conveyor Panel lane conveyor There are two different vac- uum tooling options available for the panel lane conveyor : • Vacuum tooling L625 x W615 for wide workpiece ca rriers • Vacuum toolin…

Single lane and dual lane conveyor

PCB warpage

PCB warpage during placement

To avoid impairing the placement quality and

speed, we recommend using a PCB support e.g.

Smart Pin Support so that the PCB warpage

downwards does not exceed 0.5 mm.

PCB warpage up, max. 2 mm

PCB support

PCB warpage down, max. 2 mm

Changes in the surface position are automatically applied by the functions for learning the height.

Panel lane and wafer lane conveyor

Panel lane conveyor

There are two different vac-

uum tooling options available

for the panel lane conveyor:

• Vacuum tooling

L625 x W615 for wide

workpiece carriers

• Vacuum tooling

L330 x W315 for narrow

workpiece carriers

Panel lane conveyor with vacuum tooling L625 x W615

Panel lane conveyor with vacuum tooling L330 x W315

Panel lane and wafer lane conveyor

Wafer lane conveyor

There are two different vac-

uum tooling options for the

different workpiece carrier

thicknesses available for the

wafer lane conveyor:

• DM 300 ST 0.55 for thin

workpiece carriers

• DM 300 ST 1.2 for thick

workpiece carriers

The vacuum tooling DM 300

can be temperature-con-

trolled. The corners feature

glass fiducials to compen-

sate the precise position of

the vacuum tooling in the

machine and the deformation

of the machine.

A temperature regulating

system to keep the set pro-

cess temperature constant is

available for the tempera-

ture-controlled vacuum tool-

ing.

Wafer lane conveyor with vacuum tooling DM 300