SIPLACE CA4 V2规格说明书.pdf - 第3页
3 SIPLACE CA4 Contents Overview of technical data 5 Maximum values 5 Machine descripti on 6 Overview 6 Placement performance and accuracy 8 Pick up from the chan geover table (SMT) 8 Pick up from the SIPLAC E Wafer Syste…
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SIPLACE CA4
Contents
Overview of technical data 5
Maximum values 5
Machine description 6
Overview 6
Placement performance and accuracy 8
Pick up from the changeover table (SMT) 8
Pick up from the SIPLACE Wafer System 9
Placement heads 10
SIPLACE SpeedStar (C&P20 M2) 10
SIPLACE MultiStar (CPP M) 11
Nozzle changer 12
Technical data 13
Single lane and dual lane conveyor 14
Overview 14
Technical data 15
Placement modes 16
Alternating placement mode 17
PCB warpage 18
Panel lane and wafer lane conveyor 20
Panel lane conveyor 20
Wafer lane conveyor 21
Technical data 22
Wafer and panel level fan out process 23
Workpiece carrier warpage 24
Component feeding 25
Component trolley X 25
SIPLACE SmartFeeder X / Xi 26
Alternative SIPLACE modules 27
SIPLACE MeasuringFeeder X 28
SIPLACE JTF-M 29
Technical data 30
SIPLACE Wafer System 31
Overview 31
Component supply 32
Technical data 33
List of options 34
SIPLACE Vision 35
OnBoard Inspection and Pattern Matching 35
Cracked Die and Chipping Detection 36
PCB position recognition 37
Barcode types 39
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SIPLACE CA4
Contents
Virtual Inkspot Handler (VIH) 41
ASM Software Products 42
Overview 42
Technical data 43
Electrical Ratings and Compressed Air Supply 43
Electrical connection and compressed air supply 44
Dimensions and setup conditions 45
Placement machine dimensions 46
Placement machine center of gravity 46
Maneuvering radii for the X component trolleys 47
Spacing distances single lane conveyor 48
Spacing distances dual lane conveyor 49
Spacing distances with SIPLACE Wafer System 50
Dimensions with JTF-M 51
Transportation and delivery configuration 52
List of options 53
Placement machine 53
Configuration overview 55
Overview of languages 56
Certificates 57
SEMI S2/S8 57
ESD equipment 58
Clean room 59
Notes 60