SIPLACE CA4 V2规格说明书.pdf - 第33页
33 SIPLACE Wafer System Technical data Dimensions and weight Length x width 1.580 mm x 720 mm Weight 350 kg Electrical ratings Supply voltage 3 x 400 VAC, 50 Hz (Europe) 3 x 208 VAC, 60 Hz (USA) Overall powe r 1.5 kW Rat…
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SIPLACE Wafer System
Component supply
Technical data Flip Chip Die Attach
Minimum die thickness (silicium) - without com-
ponent sensor
50 µm 50 µm
Minimum die thickness (silicium) - with compo-
nent sensor
100 µm 100 µm
Minimum bump size 50 µm n/a
Minimum bump grid 100 µm n/a
SIPLACE Wafer System SWS Horizontal system, automatic wafer change, MCM
SWS wafer size 4" to 12"
4" / 6" with adapter on request
Wafer frame 12“/8“
6" on request
4" with adapter
Wafer frame: Maximum height 12“: 8.1 mm
8": 7.6 mm
6": 5.8 mm
Wafer magazine
a
a) Depending on the wafer magazine, you may need to mechanically adjust the base plate for the wafer magazines.
Up to 12"
Die Ejection System Programmable ejection speed (synchronous and asynchronous)
Option: Linear Dipping Unit LDU Individually programmable speed
Flux viscosity 3,000 to 100,000 cPs
Accuracy of flux height ± 5 µm
33
SIPLACE Wafer System
Technical data
Dimensions and weight
Length x width 1.580 mm x 720 mm
Weight 350 kg
Electrical ratings
Supply voltage 3 x 400 VAC, 50 Hz (Europe)
3 x 208 VAC, 60 Hz (USA)
Overall power 1.5 kW
Rated current 2.7 A at 3 x 400 VAC
4.2 A at 3 x 208 VAC
Fuse 3 x 16 A
Nominal current consumption of largest consumer 2 A
Noise emissions
Max. noise emissions 74 dB (A)
Permissible environmental impact
Room temperature Between 15°C and 35°C
Atmospheric humidity 30 - 75 %
(No higher than 45% on average to
prevent any possibility of condensa-
tion on the machine)
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SIPLACE Wafer System
List of options
Available options SWS Notes
SIPLACE wafer transfer system (table: 1,3)
X
SIPLACE wafer transfer system (table: 2,4)
X
Adapter FF070 & FF 090 on standard frame FF 108
X
Adapter hoop ring 4" on FF 108
X
Adapter hoop ring 6" on FF 108
X
Adapter hoop ring 8" on FF 108
X
SIPLACE wafer expansion unit for 8" and 12" wafers
X
Wafer holder 8" for standard frame in combination with hoop
ring (table.: 1,3)
X
Wafer holder 8" for standard frame in combination with hoop
ring (table.: 2,4)
X
Wafer holder 12" for standard frame in combination with hoop
ring (table.: 1,3)
X
Wafer holder 12" for standard frame in combination with hoop
ring (table.: 2,4)
X
Wafer holder 8" for standard frame (table: 1,3)
X
Wafer holder 8" for standard frame (table: 2,4)
X
Wafer holder 12" for standard frame (table: 1,3)
X
Wafer holder 12" for standard frame (table: 2,4)
X
Multi needle eject system 3.5 x 3.5 mm min. needle pitch
X
Multi needle eject system 2.0 x 2.0 mm min. needle pitch
X
Small Die Eject System
X
Component handling standard, field of view: 12 mm x 12 mm
X
SIPLACE Linear Dipping Unit (LDU-X)
X
Integrated into the SWS:
Only one LDU per location.
Standard flux pot for LDU-X
X
SIPLACE CA LDU cavity plates, 20 - 400µm in 10µm steps
X
SIPLACE WS die attach unit
X
Nozzle changer C&P 20 M2
X
One bank in row 2
Row 1 on request
Nozzle changer CPP M
X
Single component traceability
X