SIPLACE CA4 V2规格说明书.pdf - 第7页

7 Machine description Overview Placement head range available SpeedStar (C&P20 M) MultiStar (CPP) Selection of conveyor Single l ane convey or Dual lane con veyor Panel lane con veyor Wafer lane conveyor Selection of…

Machine description

Overview

General

The SIPLACE CA4 V2 (chip

assembly) platform can

place bare dies directly from

the wafer, using the die at-

tach or flip chip process. This

provides additional support

for the SMT placement op-

tions available with SIPLACE

X-Series S machines. The

SIPLACE CA4 V2 can either

be used only for bare die or

SMT placement or in single

pass mode. In this case, both

bare dies and SMT compo-

nents can be placed during

the same process. Users

benefit from a combination of

greater process flexibility and

higher placement speeds

which is unique to the elec-

tronics production industry.

The SIPLACE CA4 V2 is pro-

vided with 4 gantries and can

be configured with up to 4

SWSs (S

IPLACE Wafer

ystem).

The SWS provides the place-

ment head with components

(dies) directly from the wafer

(max. 12“).

Overview

The SIPLACE CA4 V2 sup-

ports the wafer level fan out

process up to 300 mm diam-

eter with flip chip and die

attach processes, plus the

panel level process with a

maximum workpiece carrier

size of 700 mm x 650 mm.

This machine is therefore the

optimum solution to support

the accuracy and perfor-

mance requirements of the

advanced packaging pro-

cesses. For standard boards

from 50 mm x 50 mm up to

850 mm x 560 mm with long

board option.

The SIPLACE CA4 V2 also

supports virtual inkspot han-

dling (this corresponds to an

electronic substrate map).

The maximum quantity of

placement positions is

120,000 components per

SIPLACE CA4 V2 (200,000

components per panel for

panel level on request).

Placement machine

The placement machine

uses the Collect&Place?

method for high-speed

placement of standard com-

ponents.

The moving head picks the

components up from the

waiting SWS and places

them on the waiting printed

circuit board. This proven

SIPLACE principle has many

advantages:

• No downtime due to refill-

ing or splicing

• Reliable pickup of even

the smallest components

• No shifting of the compo-

nents on the circuit board

• Minimized travel range

High flexibility, economic effi-

ciency and reliable setups

are the guarantee for the

high level of productivity in

theSIPLACE CA4 V2.

Minimum down times

increase utilization and thus

help to increase productivity.

Even the very small 03015/

0201 (metric) components

can be processed with the

SIPLACE CA4 V2.

SIPLACE Wafer System

(SWS)

The integration of the

SIPLACE Wafer Systems

(SWS) in the

SIPLACE CA4 V2 enables

you to place dies directly

from the wafer, using the

standard SMT placement

procedure. This unique

placement platform supports

both the flip chip and the die

attach process.

• Processes supported:

Flip chip, die attach (chip

on board), SMT

• Hoopring handling

• Horizontal wafer system

• Automatic wafer change

• Linear Dipping Unit

• Die attach unit

• Wafer map connection

(e.g. ALPS)

• Multi-die capability

Machine description

Overview

Placement head range available

SpeedStar (C&P20 M)

MultiStar (CPP)

Selection of conveyor

Single lane conveyor

Dual lane conveyor

Panel lane conveyor

Wafer lane conveyor

Selection of component infeed

Component trolley

JTF-M

Feeder modules available

X tape feeder modules

Linear Dipping Unit X

SIPLACE PowerConnector X

SIPLACE Wafer System

Placement performance and accuracy

Pick up from the changeover table (SMT)

Placement head types:

SIPLACE SpeedStar (C&P20 M2)

SIPLACE MultiStar (CPP M)

Placement performance:

The placement performance is affected by the different head combinations and positions, plus the

conveyor configuration. Individual options and customized applications also influence the placement

performance. On request, SIPLACE can calculate the actual performance of your product with your

machine configuration.

Placement accuracy: SIPLACE benchmark value [components/h]

The values are measured during the machine acceptance tests and correspond to the conditions set

out in the SIPLACE scope of service and supply.

The relevant placement accuracy is only guaranteed if the room temperature is between 18°C and

28°C, does not vary by more than ± 1°C and was stable at least 48h before the placement process.

Single lane and dual lane conveyor with pickup from changeover table (SMT)

Process 4 gantries are evaluated statistically together.

The CMK value is included IN the calculation.

PA 1 PA2 Accuracy Placement

performance

2 x C&P20 M2 2 x C&P20 M2 25 µm/3σ 126,500

2 x C&P20 M2 2 x CPP M_L 25 µm/3σ 105,500

2 x CPP M_L 2 x CPP M_L 25 µm/3σ 85,500

Process: 4 gantries are evaluated statistically together.

The CMK value is included IN the calculation.

PA 1 PA2 Accuracy Placement

performance

2 x C&P20 M2 2 x C&P20 M2 20 µm/3σ 126,000

2 x C&P20 M2 2 x CPP M_L 20 µm/3σ 105,500

2 x CPP M_L 2 x CPP M_L 20 µm/3σ 85,000

Panel lane conveyor with pickup from changeover table (SMT)

Process 2 gantries work in one placement area and are evaluated independently from

one another for statistical purposes.

The CMK value is included IN the calculation.

PA 1 PA2 Accuracy Placement

performance

2 x C&P20 M2 2 x C&P20 M2 15 µm/3σ 83,000

2 x C&P20 M2 2 x CPP M_L 15 µm/3σ 73,000

2 x CPP M_L 2 x CPP M_L 15 µm/3σ 63,000