SIPLACE CA4 V2规格说明书.pdf - 第4页
4 SIPLACE CA4 Contents Virtual Inkspot Handler (VIH) 41 ASM Software Products 42 Overview 42 Technical data 43 Electrical Ratings and C ompressed Air Supply 43 Electrical connection an d compr essed air supply 44 Dimensi…
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SIPLACE CA4
Contents
Overview of technical data 5
Maximum values 5
Machine description 6
Overview 6
Placement performance and accuracy 8
Pick up from the changeover table (SMT) 8
Pick up from the SIPLACE Wafer System 9
Placement heads 10
SIPLACE SpeedStar (C&P20 M2) 10
SIPLACE MultiStar (CPP M) 11
Nozzle changer 12
Technical data 13
Single lane and dual lane conveyor 14
Overview 14
Technical data 15
Placement modes 16
Alternating placement mode 17
PCB warpage 18
Panel lane and wafer lane conveyor 20
Panel lane conveyor 20
Wafer lane conveyor 21
Technical data 22
Wafer and panel level fan out process 23
Workpiece carrier warpage 24
Component feeding 25
Component trolley X 25
SIPLACE SmartFeeder X / Xi 26
Alternative SIPLACE modules 27
SIPLACE MeasuringFeeder X 28
SIPLACE JTF-M 29
Technical data 30
SIPLACE Wafer System 31
Overview 31
Component supply 32
Technical data 33
List of options 34
SIPLACE Vision 35
OnBoard Inspection and Pattern Matching 35
Cracked Die and Chipping Detection 36
PCB position recognition 37
Barcode types 39
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SIPLACE CA4
Contents
Virtual Inkspot Handler (VIH) 41
ASM Software Products 42
Overview 42
Technical data 43
Electrical Ratings and Compressed Air Supply 43
Electrical connection and compressed air supply 44
Dimensions and setup conditions 45
Placement machine dimensions 46
Placement machine center of gravity 46
Maneuvering radii for the X component trolleys 47
Spacing distances single lane conveyor 48
Spacing distances dual lane conveyor 49
Spacing distances with SIPLACE Wafer System 50
Dimensions with JTF-M 51
Transportation and delivery configuration 52
List of options 53
Placement machine 53
Configuration overview 55
Overview of languages 56
Certificates 57
SEMI S2/S8 57
ESD equipment 58
Clean room 59
Notes 60
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Overview of technical data
Maximum values
Accuracy
a
a) 10µm at 3
σ in placement process with the "Embedded wafer level ballgrid array" option (on request).
Heads
Flip Chip Die Attach SMT
C&P20 M2
CPP M
± 10 µm at 3σ
± 10 µm at 3σ
± 10 µm at 3σ
± 10 µm at 3σ
± 15 µm at 3σ
± 15 µm at 3σ
Placement performance
b
b) The placement performance depends on several project-specific parameters. The ex-
pected throughput can be individually calculated on request.
Heads
Flip Chip Die Attach
4 SWS 4 SWS SMT
C&P20 M2
CPP M
46,000 die/h
41,000 die/h
30,000 die/h
29,000 die/h
126,500 com-
ponents/h
85,500 compo-
nents/h
Die / component size
Heads
Flip Chip Die Attach SMT
C&P20 M2
CPP M
0.5 x 0.5 mm
c
d
to 6 x 6 mm
0.5 x 0.5 mm
c d
to 15 x 15 mm
c) Smaller dies on request
d) Dipping: depends on process
0.8 x 0.8 mm
to 6 x 6 mm
0.8 x 0.8 mm to 15 x 15 mm
See page 10
See page 11
Die / component supply and feeding
Feeder module
types
Tape feeder module, waffle pack tray, stick magazine
feeders, bulk case, dip module, application-specific
OEM feeder modules, SIPLACE Wafer Feeder (SWS)
Supply capacity
(Component trolley
SIPLACE X)
160 tape feeder modules 8 mm X
Component range C&P20 M2: 0.12 mm x 0.12 mm (0201 metric) to 6 mm x 6 mm
CPP M: 0.11 mm x 0.11 mm (01005) to 15 mm x 15 mm
Workpiece carrier -
size
50 mm x 50 mm to 650 mm x 700 mm
Workpiece thick-
ness
0.3
e
mm to 4.5 mm
e) Thinner than 0.3 mm on request