SIPLACE CA4 V2规格说明书.pdf - 第34页
34 SIPLACE Wafer System List of options Available options SWS Notes SIPLACE wafer transfer system (t able: 1,3) X SIPLACE wafer transfer system (t able: 2,4) X Adapter FF070 & FF 090 on standard frame FF 108 X Adapte…
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SIPLACE Wafer System
Technical data
Dimensions and weight
Length x width 1.580 mm x 720 mm
Weight 350 kg
Electrical ratings
Supply voltage 3 x 400 VAC, 50 Hz (Europe)
3 x 208 VAC, 60 Hz (USA)
Overall power 1.5 kW
Rated current 2.7 A at 3 x 400 VAC
4.2 A at 3 x 208 VAC
Fuse 3 x 16 A
Nominal current consumption of largest consumer 2 A
Noise emissions
Max. noise emissions 74 dB (A)
Permissible environmental impact
Room temperature Between 15°C and 35°C
Atmospheric humidity 30 - 75 %
(No higher than 45% on average to
prevent any possibility of condensa-
tion on the machine)
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SIPLACE Wafer System
List of options
Available options SWS Notes
SIPLACE wafer transfer system (table: 1,3)
X
SIPLACE wafer transfer system (table: 2,4)
X
Adapter FF070 & FF 090 on standard frame FF 108
X
Adapter hoop ring 4" on FF 108
X
Adapter hoop ring 6" on FF 108
X
Adapter hoop ring 8" on FF 108
X
SIPLACE wafer expansion unit for 8" and 12" wafers
X
Wafer holder 8" for standard frame in combination with hoop
ring (table.: 1,3)
X
Wafer holder 8" for standard frame in combination with hoop
ring (table.: 2,4)
X
Wafer holder 12" for standard frame in combination with hoop
ring (table.: 1,3)
X
Wafer holder 12" for standard frame in combination with hoop
ring (table.: 2,4)
X
Wafer holder 8" for standard frame (table: 1,3)
X
Wafer holder 8" for standard frame (table: 2,4)
X
Wafer holder 12" for standard frame (table: 1,3)
X
Wafer holder 12" for standard frame (table: 2,4)
X
Multi needle eject system 3.5 x 3.5 mm min. needle pitch
X
Multi needle eject system 2.0 x 2.0 mm min. needle pitch
X
Small Die Eject System
X
Component handling standard, field of view: 12 mm x 12 mm
X
SIPLACE Linear Dipping Unit (LDU-X)
X
Integrated into the SWS:
Only one LDU per location.
Standard flux pot for LDU-X
X
SIPLACE CA LDU cavity plates, 20 - 400µm in 10µm steps
X
SIPLACE WS die attach unit
X
Nozzle changer C&P 20 M2
X
One bank in row 2
Row 1 on request
Nozzle changer CPP M
X
Single component traceability
X
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SIPLACE Vision
OnBoard Inspection and Pattern Matching
OnBoard Inspection
The OnBoard PCB Inspec-
tion (SW option) uses the
PCB camera to inspect criti-
cal areas of the board, spec-
ified by the user, e.g. under
BGA or shields just before or
after placement, to make
sure that all components
were placed or to make sure
that there are no objects in
the way of the placement
process.
It is also possible to inspect
the solder paste to make
sure that it is present. How-
ever, this must always be
performed at the first place-
ment machine, before place-
ment begins.
A requirement for all inspec-
tion tasks is that a "good pat-
tern" has been saved before
starting.
Pattern Matching
Pattern matching can be
used for components with
very fine contact pads, which
can not be detected with the
existing component camera
resolution. Searching and
detection is performed over a
larger area, which contains
unique structures (patterns).
Once the specified area has
been detected, the compo-
nent is aligned and placed
according to the position of
this area and in relation to the
substrate.