User-Manual-NeoDen-K1830-20200618.pdf - 第43页
slot rath er tha n tha t of c omponent. (3) Du e to p eel stre ngth or installat ion issue of was ted film, the film on tap e won’t b e pe eled completel y (4)The nozzle was b locked (5) Th e n ozzle is damaged or has a …
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10.
First trial and test
10.1 Program first dry run
Usually we would suggest you to have a dry run (no components are loaded) before production test. After it
goes smoothly, you can start to produce few boards.
10.2 First production test
1 Make a programming file
2 Test the file to pick and place components.
10.3 Component Inspection
Inspection items
●Check if the specification, direction, polarity of components is aligned with what they should be.
●Whether the components are damaged or the pins are distorted.
●Whether the component is off beyond allowance.
The inspection methods vary from the equipment that you have.
Except visual inspection, all of amplifier, microscope, online or offline AOI equipment can be applied if the
pitch of IC is quite small to check.
Please follow SOP to do inspection or any other general standards (IPC Standard and SJ /
T10670-1995 SMT
General Technical Requirements). Adjust the programming file according to the placement
effect after the first production test.
If there is any issue of specification, direction and polarity, please follow process file to amend. If the components are
off, please adjust the file by following two methods
1. If the placement effects of all components are off in the same direction, it would be the
fiducial issues. Please resolve this issue by adjusting the coordinate of fiducials according to its value
of deviation
2. If there are several components off beyond allowance, you’d better adjust their coordinates on working file with
down-looking camera. If there are couple of issues occur during test, some other points need to be considered.
●Frequent pickup failure. Some suggestions are listed below
(1) The pick height is inappropriate, please revise the value after an inspection or a pick-test
(2) The pick offset needs an adjustment, it should be aligned with the center of component reel
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slot rather than that of component.
(3) Due to peel strength or installation issue of wasted film, the film on tape won’t be peeled
completely
(4)The nozzle was blocked
(5) The nozzle is damaged or has a crack
(6) The size issue of nozzle would cause air leakage or insufficient suction.
(7) The air hose is blocked or has a leakage problem, and even the pump has an issue.
●Frequently throwing components. Some suggestions are listed below,
(1) Up-looking camera can’t take a clear picture of component due to brightness issue for example.
(2) The pins are distorted
(3) The size or shape isn’t aligned with that in “Footprint library’’
(4) The size of nozzle is inappropriate or insufficient suction. (5) The nozzle has solder paste or rubbish cause air
leakage
(6) The nozzle is damaged or cracked cause air leakage
10.4 Continuous SMT production
Follow the SOP to start production
Notes:
(1) Do not touch the surface to board to avoid damaging the printed solder paste.
(2) When the error message occurs, please check out and solve it a.s.a.p.
(3) Once reloading the component during production, pay attention to the model, specification, polarity and direction of
components.
(4) Clear the reject box timely to avoid wasted materials stacked too high to damage the mount head
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11. Structure and maintenance instruction
11.1 Feeder Brief Introduction
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