OM-1076-001.pdf - 第3页
Contents Page Before Use ........................................................................................... 1 Contents ............................................................................................…
Before Use
We are grateful to you for purchasing our machine.
This instruction manual is prepared, assuming how the
machine will be used. It is also assumed that these manu-
als will be used as textbooks for internal education.
Please read this manual carefully for correct operations
and pay special attention to safety precautions. Always
keep this manual at hand.
This manual is made of recycled paper.
MULTI-FUNCTIONAL MOUNTER
INSTRUCTION MANUAL
COMPONENT LIBRARY
TIM-X Series
0304-001 1 Tg0502-PM-CL
OM-1076-001
Fig. X1
Contents
Page
Before Use ........................................................................................... 1
Contents ............................................................................................... 2
Section 1 Scope
..........................................................................
1- A
1. Purpose .........................................................................................1- 1
2. Component IDs and Component Library Data ...........................1- 1
3. Retrieval of Standard Component ID ..........................................1- 3
4. Classification of Component Shapes .........................................1- 4
4.1 Leadless Components .............................................................1- 4
4.2 Leaded Components ................................................................1- 5
4.3 Area Array Components ...........................................................1- 7
Section 2 Component Library Data
..................................
2- A
1. List of Data ....................................................................................2- 1
1.1 List of Common Component Data ...........................................2- 2
1.1.1 Leadless, Leaded and Area Array Components................2- 2
1.2 List of Individual Component Data .........................................2- 5
1.2.1 Leadless Components.........................................................2- 5
1.2.2 Leaded Components ...........................................................2- 7
1.2.3 Area Array Components ......................................................2- 9
2. Data Explanation...........................................................................2- 11
A01 Idefication Data ......................................................................2- 11
A02 Control Data ...........................................................................2-13
A03 Carrier Data ............................................................................2-28
B01 Shape Data .............................................................................2-38
B02 Recognition Data ...................................................................2-86
3. Max. and Min. Sizes by View Range.......................................... 2-105
Section 3 Naming Standards of
Component Library
............................
3- A
1. Naming Standards of Component Library .................................3- 1
2. Naming Standards of User Component Library ........................3- 1
3. Naming Standards of Standard Component Library .................3- 1
3.1 General Components (ICs excluded) ......................................3- 2
3.1.1 Component Name, Component Size, Component
Thickness, Manufacturer's Model No.
and No. of Leads ..................................................................3- 2
3.1.2 Serial No. ..............................................................................3- 6
3.1.3 Abbreviated Name of Component Makers .........................3- 7
3.1.4 Taping Specifications ..........................................................3- 8
3.2 ICs ..............................................................................................3-12
3.2.1 Component Name and No. of Leads ..................................3-12
3.2.2 Serial No. ..............................................................................3-13
3.2.3 Abbreviated Name of Component Makers .........................3-14
3.2.4 Taping Specifications ..........................................................3-14
0206-003 2
Tg0502-PM-CL
Contents
Page
Section 4 Creation of New Component Library
.........
4- A
1. Steps for Data Creation ................................................................4- 1
2. Confirmation of Component Shape ............................................4- 3
2.1 Check Procedure ......................................................................4- 3
2.2 Typical Example of Each Component ..................................... 4- 7
3. Measurement of Component Dimensions ..................................4- 9
3.1 Leadless Components .............................................................4- 9
3.1.1 Cylindrical Components ......................................................4- 9
3.1.2 Square Components ............................................................4-10
3.1.3 Deform (Simple) Components ............................................4- 11
3.2 Area Array Components ...........................................................4-13
3.2.1 BGA/CSP Components ........................................................4-13
Section 5 Component Library Data Sheets
..................
5- A
1. Leadless Components .................................................................5- 1
1.1 Cylindrical Components ..........................................................5- 1
1.2 Square Components .................................................................5- 5
1.3 Deform (Simple) Components .................................................5- 9
1.4 Deform (Complex) Components ..............................................5-14
2. Leaded Components ....................................................................5-18
2.1 IC (Simple) .................................................................................5-18
2.2 IC (Complex)..............................................................................5-23
2.3 Connector (Simple)...................................................................5-28
2.4 Connector (Complex) ...............................................................5-33
2.5 Other Leaded (Simple) Components ......................................5-38
2.6 Other Leaded (Complex) Components ...................................5-43
3. Area Array Components ...............................................................5-48
3.1 BGA/CSP Components.............................................................5-48
0206-002 3
Tg0502-PM-CL