User-Manual-of-NeoDen4-PNP-machine.pdf - 第53页
48 EC Declara tion o f Co nformity The manufacturer/seller Hangzhou NeoDen Techno logy Co., Ltd. Building 3, Diaoyu Industrial and Technology Park, No .8-2, Keji Avenue, Yuhang District, Hangzhou, China Hereby declares t…
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a. Nozzle had been wearing or become aging, the crack causes leakage. - replace with a new nozzle
b. The nozzle’s bottom surface is uneven or get suck by solder paste or other dirt Please wipe it
off and use cleaning needle to clean the nozzle
c. Current nozzle size is not suit to component, change another one
d. Surface uneven on the component, replace with a qualified one
e. Component is sticking to the bottom tape;
f. Burrs on tape hole stuck component;
g. Component’s pin gets stuck in the corner of the den;
h. Gap between components and tape package hole is not big enough, uncover the plastic tape and
upside down to check if the components can fall down or not.
i. Plastic adhesive tape is too sticky or flimsy and then cannot be unfolded. Or plastic adhesive tape
has been tearing down from edge side.
j. Pick up position offset. Actual Feed box is offset from Feeding center, check X, Y, Z data and do
reprogram.
Placement offset
Solutions:
a. Programming issue (some components’ positions are inaccurate), amend the coordinates; If all
components are offset, please modify fiducials.
b. The components’ thickness setting errors, modify components information on Footprint Library
c. Pick height is too high that causes components being dropped. Please reset the Pick Height value
d. Pick height is too low that causes slide problem during placement
e. High speed issue. Lower the speed to achieve a more accurate rotation and placement effect.
5.6
Related issues during solder paste printing process
(1)
Stencil Printing Technology
Screen printing technology refer to using ready-made stencil, directly contact to the printer in a
certain way, make the solder paste evenly flow on the stencil and then leak into the mesh through
the holes. When getting the stencil away, solder paste had been covered to the printed circuit board
solder graphics, corresponding, thus complete the solder paste printing on the PCB.
(2)
Inspecting of solder paste printing
Printing process is one of the key working procedures to ensure the quality of surface mounting.
According to the statistics, under the premise of guaranteed quality about components and PCB,
correctly PCB design, 70% of the surface quality problem caused during printing process. In order
to ensure the quality of SMT assembly, it is necessary to strictly control the quality of the solder
paste printing. The amount of solder paste printing requirements are as follows:
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a. The using amount of solder paste should be uniform, good consistency. Solder paste graphics
should be clear, try to avoid adhesion between adjacent graphics. Solder paste graphics and solder
graphics should be consistent.
b. In general, keep unit area amount of solder paste about 0.8 mg/mm². For fine pitch components,
should be 0.5 mg/mm²(using stencil thickness and hole size to control in the actual operation).
c. Printed on the substrate of solder paste compared with required value, a certain deviation is
permissible, the covering area of the solder paste on each solder pad should be more than 75%.
d. Should be no seriously collapsing problem and edges neatly after solder paste had been printed,
the dislocation shouldn’t be larger than 0.2 mm, for solder pad of fine pitch components, dislocation
shouldn’t be larger than 0.1MM, pollution by solder paste is not permitted to the PCB.
(3)
The defects of solder paste printing, reasons andsolutions
Excellent printing graphics should be uniform in both vertical and horizontal direction, full, clean
all round, solder paste fill solder pad. Using above such printing graphics device, after reflow
soldering, will get good welding effect then.
a. Solder paste graphics dislocation
Reasons: Holes on the stencil not good match with solder pad; No enough precision of the Printing
machine
Issues: easily cause bridge connection
Solutions: Adjust the stencil position; Adjust the printing machine.
b. Solder paste graphics have icicles and dents
Reasons: Scraper’s pressure is too large; Rubber scraper’s hardness is not enough; Holes are too big
in the stencil
Issues: Solder paste’s required volume is not enough, easy to appear faulty soldering; solder joint
strength is not enough.
Solutions: Adjust the printing pressure; Use metal scraper; Improved holes designing in the stencil.
c.Too much solder paste
Reasons: Holes are too big in the stencil; The gap is too big between stencil and PCB. Issues: easily
cause bridge connection
Solutions: Check the holes size in stencil; Adjust the parameters of printing, especially the gap
between PCB and stencil
d. Graphic uneven (havebreakpoints)
Reasons: Holes’ wall are not smoothness enough; not wipe residual solder paste in using for many
times; Solder paste’s thixotropy is bad.
Issues: Easy cause no enough solder paste, lead to the problem such as faulty soldering. Solutions:
Wipe the stencil
e. Contamination of thegraphics
Reasons: Not wipe residual solder paste in stencil after using for many times; Poor quality of solder
paste; Shake problem when getting the stencil way
Issues: easily cause bridge connection
Solutions: Wipe and clean stencil; replace solder paste; adjust the machine.
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EC Declaration of Conformity
The manufacturer/seller
Hangzhou NeoDen Technology Co., Ltd.
Building 3, Diaoyu Industrial and Technology Park, No.8-2, Keji Avenue,
Yuhang District, Hangzhou, China
Hereby declares that the following product:
Model: NeoDen4
Product: Automatic Pick & Place Machine, intended to use for electronics
assembly
Is in compliance with the following EU Directives:
⚫
Electromagnetic Compatibility Directive 2014/30/EC
⚫
Machinery Directive 2006/42/EC
⚫
RoHS Directive 2011/65/EC
The following harmonized standards were applied:
⚫
EN61000-6-2:2005
⚫
EN61000-6-4:2007+A1:2011
⚫
Annex 1 of 2006/42/EC
⚫
EN ISO 12100:2010
⚫
EN 60204-1:2006+A1:2009+AC:2010
All applicable tests were carried out in cooperation with TÜV NORD (Hangzhou) Co., Ltd.
In case of making any modification to the machine, not authorized by the manufacturer,
the declaration for this unit shall become void.
Place: Hangzhou, China
Date: December 12, 2016
Jianyong Weng
(Chairman of the Board of Directors)