00198374-04_UG_OSC_Package_R19-2_DE_EN.pdf - 第52页

3 Prerequisites 3.2 Hardware Requirements 52 Bedienungsanleitung OSC Package User Guide OSC-Paket 11/2019 Function Hardware Automatic illumination optimization for Non‑standard and Connector component types Placement hea…

3 Prerequisites

3.1 Software Requirements

Bedienungsanleitung OSC Package User Guide OSC-Paket 11/2019 51

3 Prerequisites

The necessary system requirements for the OSC Package correspond to the system requirements

for SIPLACEPro and are described in the SIPLACEPro Version Description, item no. [00198763-

xx].

3.1 Software Requirements

The following table lists the software requirements that must be met for the released features per

release.

Release Required software

For features of R16-2

●

SIPLACEPro version 14.0 or higher

●

Stationsoftware version 710.0 or higher

●

SIPLACEVision version 5.4.1 or higher

For features of R18-2

●

SIPLACEPro version 16.0 or higher

●

Stationsoftware version 712.0 or higher

●

SIPLACEVision version 5.6.1 or higher

For features of R19-1

●

SIPLACEPro version 16.1 or higher

●

Stationsoftware version 712.1 or higher

●

SIPLACEVision version 5.6.2 or higher

For features of R19-2

●

SIPLACEPro version 17.0 or higher

●

Stationsoftware version 713.0 or higher

●

SIPLACEVision version 5.7.1 or higher

3.2 Hardware Requirements

The following hardware requirements must be met for the released features of R16-2:

Function Hardware

Improved placement of snap-in components Placement heads: TwinVHF

Smart Pin Support is recommended

Stereo Measurement for THT Pins Placement heads: CPP, TH, THHF, TwinVHF

Camera types: SST33, SST25

Customer-specific Pattern Features Placement heads: All

Special position evaluation Placement heads: All

Support for finding the best acceleration Placement heads: All

Increased placement force on TwinVHF

placement head to 100N

Placement head: TwinVHF

Can only be used with function status -03!

Smart Pin Support is recommended

The following hardware requirements must be met for the released features of R18-2:

Function Hardware

Improved placement of components with

centering pins (Pin in Paste height check)

Placement heads: CPP, TH, TwinVHF

Smart Pin Support is recommended

Improved teaching of snap-in components Placement head: TwinVHF

Stereo measurement for Gullwing and Pat-

ternFeatures lead group types

Placement heads: CPP, TH, THHF, TwinVHF

Camera types: SST33, SST25

Measurement parameter 4x image capture

as option in the stereo measurement

Placement heads: CPP, TH, THHF, TwinVHF

Camera types: SST33, SST25

3 Prerequisites

3.2 Hardware Requirements

52 Bedienungsanleitung OSC Package User Guide OSC-Paket 11/2019

Function Hardware

Automatic illumination optimization for

Non‑standard and Connector component

types

Placement heads: All

Placement of an exceptionally high compo-

nent (1 use case)

Placement machine: SIPLACESXV2

Single conveyor

Placement head: only TwinVHF or

combination of TwinVHF and TwinVHF or

combination of TwinVHF and CPP in higher posi-

tion

One component of type SMT;

Height: max. 46mm

One component of type THT (e.g. Connector or In-

ductance);

Height: max. 46mm without protruding elements

which disappear into the board after placement

(e.g. centering pins), 50mm with protruding ele-

ments

Increased placement force on TwinHead

placement head to 30N (as for THHF)

Placement head: TH

Smart Pin Support is recommended

The following hardware requirements must be met for the released features of R19-1:

Function Hardware

Improved placement of exceptionally high

components with TwinVHF placement head

See hardware requirements for the released fea-

ture of R18-2 "Placement of an exceptionally high

component"

Improved placement of exceptionally high

components with CPP placement head

Placement head: CPP in high position

Maximum component height: 15.5mm

Component Chipping Inspection Component type: BareDie, BGA, CCGA, Chip,

Moulded, or Nonstandard

The following hardware requirements must be met for the released feature of R19-2:

Function Hardware

Increased component weight that can be

placed with TwinVHF placement

Placement head: TwinVHF Maximum

component weight: 240g Nozzle adapter

for Twin VHF, item no. [03149670‑xx]

4 Working with the OSC Features

4.1 Features Introduced with R16-2

Bedienungsanleitung OSC Package User Guide OSC-Paket 11/2019 53

4 Working with the OSC Features

This chapter describes how to work with the single OSC features. There is a designated chapter for

each release. Each of these designated chapters contains all features and options that have been

introduced with the respective release, as well as improvements and changes to previously re-

leased features.

► Make use of the information provided in the Online Help files for SIPLACE Pro and the station

software. These files contain additional, detailed information about the OSC features.

4.1 Features Introduced with R16-2

In this chapter all features that have been introduced with R16-2 are listed. To see if there are up-

dates for one of the features listed here, please check the segments of later releases.

4.1.1 Placement of Snap-In Components

When placing snap-in components, it must be ensured that the components lock correctly into the

board. The system can verify this by an improved method.

Example

Snap-in component

Snap-in component – not placed correctly

Snap-in component – placed correctly

The actual Z-axis position of every snap-in placement will be compared with its corresponding

height reference value during the verification. These values must match each other.