00198374-04_UG_OSC_Package_R19-2_DE_EN.pdf - 第53页

4 Working with the OSC Features 4.1 Features Introduced with R16-2 Bedienungsanleitung OSC Package User Guide OSC-Paket 11/2019 53 4 Working with the OSC Features This chapter describes how to work with the single OSC fe…

3 Prerequisites

3.2 Hardware Requirements

52 Bedienungsanleitung OSC Package User Guide OSC-Paket 11/2019

Function Hardware

Automatic illumination optimization for

Non‑standard and Connector component

types

Placement heads: All

Placement of an exceptionally high compo-

nent (1 use case)

Placement machine: SIPLACESXV2

Single conveyor

Placement head: only TwinVHF or

combination of TwinVHF and TwinVHF or

combination of TwinVHF and CPP in higher posi-

tion

One component of type SMT;

Height: max. 46mm

One component of type THT (e.g. Connector or In-

ductance);

Height: max. 46mm without protruding elements

which disappear into the board after placement

(e.g. centering pins), 50mm with protruding ele-

ments

Increased placement force on TwinHead

placement head to 30N (as for THHF)

Placement head: TH

Smart Pin Support is recommended

The following hardware requirements must be met for the released features of R19-1:

Function Hardware

Improved placement of exceptionally high

components with TwinVHF placement head

See hardware requirements for the released fea-

ture of R18-2 "Placement of an exceptionally high

component"

Improved placement of exceptionally high

components with CPP placement head

Placement head: CPP in high position

Maximum component height: 15.5mm

Component Chipping Inspection Component type: BareDie, BGA, CCGA, Chip,

Moulded, or Nonstandard

The following hardware requirements must be met for the released feature of R19-2:

Function Hardware

Increased component weight that can be

placed with TwinVHF placement

Placement head: TwinVHF Maximum

component weight: 240g Nozzle adapter

for Twin VHF, item no. [03149670‑xx]

4 Working with the OSC Features

4.1 Features Introduced with R16-2

Bedienungsanleitung OSC Package User Guide OSC-Paket 11/2019 53

4 Working with the OSC Features

This chapter describes how to work with the single OSC features. There is a designated chapter for

each release. Each of these designated chapters contains all features and options that have been

introduced with the respective release, as well as improvements and changes to previously re-

leased features.

► Make use of the information provided in the Online Help files for SIPLACE Pro and the station

software. These files contain additional, detailed information about the OSC features.

4.1 Features Introduced with R16-2

In this chapter all features that have been introduced with R16-2 are listed. To see if there are up-

dates for one of the features listed here, please check the segments of later releases.

4.1.1 Placement of Snap-In Components

When placing snap-in components, it must be ensured that the components lock correctly into the

board. The system can verify this by an improved method.

Example

Snap-in component

Snap-in component – not placed correctly

Snap-in component – placed correctly

The actual Z-axis position of every snap-in placement will be compared with its corresponding

height reference value during the verification. These values must match each other.

4 Working with the OSC Features

4.1 Features Introduced with R16-2

54 Bedienungsanleitung OSC Package User Guide OSC-Paket 11/2019

The snap-in placement process has to be enabled for the component shape in SIPLACE Pro. Addi-

tionally, the snap-in threshold that shall be used for comparing the two values has to be specified.

After the first board has been completely produced, it will be transferred to the output section or the

configured inspection station and marked for manual inspection. The operator has to inspect every

snap-in placement position and confirm whether the placement is correct or not. If correct, the cor-

responding Z-axis position will be stored as reference position and used as placement position for

all subsequent boards. If not correct, the measured height will be ignored and the operator must

confirm it again for the next board. The snap-in check is active now. If the Z-axis position deviates

more than the snap-in threshold value from the reference position in a subsequent placement, an

error is reported.

The height reference values are not uploaded to SIPLACE Pro. When the job is changed at the

placement machine or the machine is shut down, the height reference values need to be taught

again.

NOTICE

Using SIPLACE Smart Pin Support

For reliable snap-in detection it is recommended to set support pins close to the snap-in

placement positions. Detailed information on Smart Pin Support can be found in the

SIPLACE Smart Pin Support Operation and Configuration User Manual, item no.

[00197001-xx].

4.1.1.1 Procedure

The following overview lists the single work steps that have to be performed in the specified order

to place snap-in components.

Placement of Snap-In Components

Step Action SIPLACE program

1) Enabling OSC package SIPLACE Pro

2) Selecting the snap-in placement process for the component

shape

SIPLACE Pro

3) Enabling the snap-in detection SIPLACE Pro

4) Setting Z-threshold (Default: 0.500 mm) SIPLACE Pro

5) If necessary, configuring the inspection station (Default:

Output section)

Station Software

6) Verifying and confirming all placement positions at the inspec-

tion station

Station Software

4.1.1.2 Application Example

Step 1: SIPLACE Pro

► In the Station Editor under Placement Station,

enable the OSC Package option under Installed

options.