IPC-TM-650 EN 2022 试验方法1.pdf - 第798页
Figure 2 Su ggested Dipping Device for Solderability T est IPC-TM-650 Page 2 of 2
Table I Test Temperatures
Condition Temperature
Figure 1 Wire Hole Termination
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Figure 2 Suggested Dipping Device for Solderability Test
IPC-TM-650
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Table 1 Thermal Shock Test Conditions (One Cycle)
Step Temperature, °C Time
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