MIL- STD-883F 2004 TEST METHOD STANDARD MICROCIRCUITS.pdf - 第395页

MIL-STD-883F METHOD 2027.2 22 March 1989 3 1 x 10 -4 sq in 1 x 10 -3 sq in 1 x 10 -2 sq in 1 x 10 -1 sq in 1 sq in 100 s q mils 1,000 sq mils 10,000 sq mil s 100,000 s q mils 1,000,000 sq mi ls 6. 5 x 10 -4 sq cm 6.5 x 1…

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MIL-STD-883F
METHOD 2027.2
22 March 1989
2
FIGURE 2027-1. Die contact tool adhered to die top surface prior to lift off
.
MIL-STD-883F
METHOD 2027.2
22 March 1989
3
1 x 10
-4
sq in 1 x 10
-3
sq in 1 x 10
-2
sq in 1 x 10
-1
sq in 1 sq in
100 sq mils 1,000 sq mils 10,000 sq mils 100,000 sq mils 1,000,000 sq mils
6.5 x 10
-4
sq cm 6.5 x 10
-3
sq cm 6.5 x 10
-2
sq cm 6.5 x 10
-1
sq cm 6.5 sq cm
NOTE: The X-axis is a log scale and intermediate points not shown must be calculated based on the formulas,
(1.0 X: y = 3.32 logX + 13.3, 2.0 X: y = 6.63 logX + 26.6) not extrapolated from the graph.
FIGURE 2027-2. Die attach strength criteria (minimum force versus die attach area)
.
MIL-STD-883F
METHOD 2027.2
22 March 1989
4
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