MIL- STD-883F 2004 TEST METHOD STANDARD MICROCIRCUITS.pdf - 第621页

MIL-STD-883F METHOD 5005.14 18 June 2004 5 TABLE I. Gr oup A electr ical test s for clas ses level S and level B devices - Conti nued. 1 / 1 / The s pecif ic par ameters to be inc luded for tes ts i n each subgr oup shal…

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MIL-STD-883F
METHOD 5005.14
18 June 2004
4
TABLE I. Group A electrical tests for classes level S and level B devices. 1/
Subgroups 2
/
Quality/accept no. = 116/0 3
/ 4/ 5/
Subgroup 1
Static tests at 25°C
Subgroup 2
Static tests at maximum rated operating temperature
Subgroup 3
Static tests at minimum rated operating temperature
Subgroup 4
Dynamic tests at 25°C
Subgroup 5
Dynamic tests at maximum rated operating temperature
Subgroup 6
Dynamic tests at minimum rated operating temperature
Subgroup 7
Functional tests at 25°C
Subgroup 8A
Functional tests at maximum rated operating temperatures
Subgroup 8B
Functional tests at minimum rated operating temperatures
Subgroup 9
Switching tests at 25°C
Subgroup 10
Switching tests at maximum rated operating temperature
Subgroup 11
Switching tests at minimum rated operating temperature
See footnotes at top of next page.
MIL-STD-883F
METHOD 5005.14
18 June 2004
5
TABLE I. Group A electrical tests for classes level S and level B devices - Continued. 1/
1
/ The specific parameters to be included for tests in each subgroup shall be as specified in the applicable acquisition
document. Where no parameters have been identified in a particular subgroup or test within a subgroup, no group
A testing is required for that subgroup or test to satisfy group A requirements.
2
/ At the manufacturer's option, the applicable tests required for group A testing (see 1/) may be conducted individually
or combined into sets of tests, subgroups (as defined in table I), or sets of subgroups. However, the manufacturer
shall predesignate these groupings prior to group A testing. Unless otherwise specified, the individual tests,
subgroups, or sets of tests/subgroups may be performed in any sequence.
3
/ The sample plan (quantity and accept number) for each test, subgroup, or set of tests/subgroups as predesignated
in 2
/, shall be 116/0.
4
/ A greater sample size may be used at the manufacturer's option; however, the accept number shall remain at zero.
When the (sub)lot size is less than the required sample size, each and every device in the (sub)lot shall be
inspected and all failed devices removed from the (sub)lot for final acceptance of that test, subgroup, or set of
tests/subgroups, as applicable.
5
/ If any device in the sample fails any parameter in the test, subgroup, or set of tests/subgroups being sampled, each
and every additional device in the (sub)lot represented by the sample shall be tested on the same test set-up for all
parameters in that test, subgroup, or set of tests/subgroups for which the sample was selected, and all failed
devices shall be removed from the (sub)lot for final acceptance of that test, subgroup, or set of tests/subgroups, as
applicable. For class level S only, if this testing results in a percent defective greater than 5 percent, the (sub)lot
shall be rejected, except that for (sub)lots previously unscreened to the tests that caused failure of this percent
defective, the (sub)lot may be accepted by resubmission and passing the failed individual tests, subgroups, or set of
tests/subgroups, as applicable, using a 116/0 sample.
MIL-STD-883F
METHOD 5005.14
18 June 2004
6
TABLE IIa. Group B tests for class level S devices. 1/
Test
MIL-STD-883 Quantity (accept no.)
Sample size no.
accept no.
Method Condition
Subgroup 1
a. Physical dimensions 2
/
b. Internal water-vapor
content 2
/ 3/
2016
1018
5,000 ppm maximum water
content at 100°C
2(0)
3(0) or 5(1) 4
/
Subgroup 2 5/
a. Resistance to solvents
b. Internal visual and
mechanical
c. Bond strength
(1) Thermocompression
(2) Ultrasonic
(3) Flip-chip
(4) Beam lead
d. Die shear or substrate
attach strength test
2015
2013,
2014
2011
Failure criteria from design and
construction requirements of
applicable acquisition document
1. Test condition C or D
2. Test condition C or D
3. Test condition F
4. Test condition H
In accordance with method
2019 or 2027 for the applicable
die size
3(0)
2(0)
Sample size 6
/
number = 22, c = 0
3(0)
Subgroup 3
Solderability 7
/
2003
Soldering temperature
of 245°C ±5°C
Sample size
number = 22, c = 0
Subgroup 4 2/
a. Lead integrity 8
/
b. Seal
(a) Fine
(b) Gross
c. Lid torque 9
/
2004
1014
2024
Test condition B2, lead fatigue
As applicable
As applicable
Sample size
number = 45, c = 0
Subgroup 5 10/
a. End-point electrical
parameters 11
/
b. Steady state life
c. End-point electrical
parameter 11
/
1005
As specified in the applicable
device specification
Test condition C, D, or E
As specified in the applicable
device specification
Sample size
number = 45, c = 0
See footnotes at end of table.