MIL- STD-883F 2004 TEST METHOD STANDARD MICROCIRCUITS.pdf - 第622页

MIL-STD-883F METHOD 5005.14 18 June 2004 6 TABLE IIa. Gr oup B test s for clas s level S devices . 1/ Test MIL-STD-883 Quantity ( acc ept no.) Sample si ze no. accept no. Method Condi tion Subgroup 1 a. Physi cal di mens…

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MIL-STD-883F
METHOD 5005.14
18 June 2004
5
TABLE I. Group A electrical tests for classes level S and level B devices - Continued. 1/
1
/ The specific parameters to be included for tests in each subgroup shall be as specified in the applicable acquisition
document. Where no parameters have been identified in a particular subgroup or test within a subgroup, no group
A testing is required for that subgroup or test to satisfy group A requirements.
2
/ At the manufacturer's option, the applicable tests required for group A testing (see 1/) may be conducted individually
or combined into sets of tests, subgroups (as defined in table I), or sets of subgroups. However, the manufacturer
shall predesignate these groupings prior to group A testing. Unless otherwise specified, the individual tests,
subgroups, or sets of tests/subgroups may be performed in any sequence.
3
/ The sample plan (quantity and accept number) for each test, subgroup, or set of tests/subgroups as predesignated
in 2
/, shall be 116/0.
4
/ A greater sample size may be used at the manufacturer's option; however, the accept number shall remain at zero.
When the (sub)lot size is less than the required sample size, each and every device in the (sub)lot shall be
inspected and all failed devices removed from the (sub)lot for final acceptance of that test, subgroup, or set of
tests/subgroups, as applicable.
5
/ If any device in the sample fails any parameter in the test, subgroup, or set of tests/subgroups being sampled, each
and every additional device in the (sub)lot represented by the sample shall be tested on the same test set-up for all
parameters in that test, subgroup, or set of tests/subgroups for which the sample was selected, and all failed
devices shall be removed from the (sub)lot for final acceptance of that test, subgroup, or set of tests/subgroups, as
applicable. For class level S only, if this testing results in a percent defective greater than 5 percent, the (sub)lot
shall be rejected, except that for (sub)lots previously unscreened to the tests that caused failure of this percent
defective, the (sub)lot may be accepted by resubmission and passing the failed individual tests, subgroups, or set of
tests/subgroups, as applicable, using a 116/0 sample.
MIL-STD-883F
METHOD 5005.14
18 June 2004
6
TABLE IIa. Group B tests for class level S devices. 1/
Test
MIL-STD-883 Quantity (accept no.)
Sample size no.
accept no.
Method Condition
Subgroup 1
a. Physical dimensions 2
/
b. Internal water-vapor
content 2
/ 3/
2016
1018
5,000 ppm maximum water
content at 100°C
2(0)
3(0) or 5(1) 4
/
Subgroup 2 5/
a. Resistance to solvents
b. Internal visual and
mechanical
c. Bond strength
(1) Thermocompression
(2) Ultrasonic
(3) Flip-chip
(4) Beam lead
d. Die shear or substrate
attach strength test
2015
2013,
2014
2011
Failure criteria from design and
construction requirements of
applicable acquisition document
1. Test condition C or D
2. Test condition C or D
3. Test condition F
4. Test condition H
In accordance with method
2019 or 2027 for the applicable
die size
3(0)
2(0)
Sample size 6
/
number = 22, c = 0
3(0)
Subgroup 3
Solderability 7
/
2003
Soldering temperature
of 245°C ±5°C
Sample size
number = 22, c = 0
Subgroup 4 2/
a. Lead integrity 8
/
b. Seal
(a) Fine
(b) Gross
c. Lid torque 9
/
2004
1014
2024
Test condition B2, lead fatigue
As applicable
As applicable
Sample size
number = 45, c = 0
Subgroup 5 10/
a. End-point electrical
parameters 11
/
b. Steady state life
c. End-point electrical
parameter 11
/
1005
As specified in the applicable
device specification
Test condition C, D, or E
As specified in the applicable
device specification
Sample size
number = 45, c = 0
See footnotes at end of table.
MIL-STD-883F
METHOD 5005.14
18 June 2004
7
TABLE IIa. Group B tests for class level S devices - Continued. 1/
Test
MIL-STD-883 Quantity (accept no.)
Sample size no.
Accept number
Method Condition
Subgroup 6
a. End-point electrical
parameters
b. Temperature cycling
c. Constant acceleration
d. Seal
(a) Fine
(b) Gross
e. End-point electrical
parameters
1010
2001
1014
As specified in the
applicable device
specification
Condition C, 100 cycles
minimum
Test condition E: Y
1
orientation only
As specified in the
applicable device
specification
Sample size
Number = 15, c = 0
Subgroup 7 12/
1
/ Electrical reject devices from that same inspection lot may be used for all subgroups when end-point measurements
are not required provided that the rejects are processed identically to the inspection lot through pre burn-in electrical
and provided the rejects are exposed to the full temperature/ time exposure of burn-in.
2
/ Not required for qualification or quality conformance inspections where group D inspection is being performed on
samples from the same inspection lot.
3
/ This test is required only if it is a glass-frit-sealed package. Unless handling precautions for beryllia packages are
available and followed method 1018, procedure 3 shall be used. See Subgroup 6 of table IV.
4
/ Test three devices; if one fails, test two additional devices with no failures. At the manufacturers option, if the initial
test sample (i.e., 3 or 5 devices) fails, a second complete sample may be tested at an alternate laboratory that has
been granted current suitability status by the qualifying activity. If this sample passes, the lot shall be accepted
provided the devices and data from both submissions is submitted to the qualifying activity along with five additional
devices from the same lot. If sample size (accept number) of 5(1) is used to pass the lot, the manufacturer shall
evaluate his product to determine the reason for the failure and whether the lot is at risk.
5
/ Resistance to solvents testing required only on devices using inks or paints as a marking medium.
6
/ Unless otherwise specified, the sample size number for conditions C and D is the number of bond pulls selected from
a minimum number of four devices, and for condition F or H is the number of dice (not bonds).
*