MIL- STD-883F 2004 TEST METHOD STANDARD MICROCIRCUITS.pdf - 第627页

MIL-STD-883F METHOD 5005.14 18 June 2004 11 TABLE IV. Gr oup D (pack age related t ests ) (f or cl ass l evels B and S) - Continued. Test 1 / MIL- STD-883 Quanti ty/(ac cept no.) or sam ple size number accept number Meth…

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MIL-STD-883F
METHOD 5005.14
18 June 2004
10
TABLE III. Group C (die-related tests) (for class level B only).
Test
MIL-STD-883 Quantity/(accept no.)
or sample size number
accept number
Method Condition
Subgroup 1
a. Steady-state life test
b. End-point electrical
parameters
1005
Test condition to be specified
(1,000 hours at 125°C or
equivalent in accordance with
table I)
As specified in the applicable
device specification
Sample size
number = 45, C = 0
TABLE IV. Group D (package related tests) (for class levels B and S)
.
Test 1
/ MIL-STD-883 Quantity/(accept no.)
or sample size number
accept number
Method Condition
Subgroup 1 2/
a. Physical dimensions
2016
Sample size
number = 15, C = 0
Subgroup 2 2/
a. Lead integrity 3
/
b. Seal 4
/
(1) Fine
(2) Gross
2004
1014
Test condition B
2
(lead fatigue)
As applicable
Sample size
number = 45, C = 0
Subgroup 3 5/
a. Thermal shock
b. Temperature cycling
c. Moisture resistance 6
/
d. Visual examination
e. Seal
(1) Fine
(2) Gross 7
/
f. End-point electrical
parameters 8
/
1011
1010
1004
1014
Test condition B as a minimum,
15 cycles minimum.
Test condition C, 100 cycles
minimum.
In accordance with visual
criteria of method 1004 and
1010
As applicable
As specified in the applicable
device specification
Sample size
number = 15, C = 0
See footnotes at end of table.
MIL-STD-883F
METHOD 5005.14
18 June 2004
11
TABLE IV. Group D (package related tests) (for class levels B and S) - Continued.
Test 1
/ MIL-STD-883 Quantity/(accept no.)
or sample size
number
accept number
Method Condition
Subgroup 4 5/
a. Mechanical shock
b. Vibration, variable
frequency
c. Constant acceleration
d. Seal
(1) Fine
(2) Gross
e. Visual examination
f. End-point electrical
parameters
2002
2007
2001
1014
9
/
Test condition B minimum
Test condition A minimum
Test condition E minimum
(see 3), Y
1
orientation only
As applicable
As specified in the applicable
device specification
Sample size
number = 15, C = 0
Subgroup 5 2/
a. Salt atmosphere 6
/
b. Visual examination
c. Seal
(1) Fine 7
/
(2) Gross
1009
1014
Test condition A minimum
in accordance with visual
criteria of method 1009
as applicable
Sample size
number = 15, C = 0
Subgroup 6 2/
a. Internal water-vapor
content
1018
5,000 ppm maximum water
content at 100°C
3(0) or 5(1) 10
/
Subgroup 7 2/
a. Adhesion of lead
finish 11
/ 12/
2025
Sample size
number = 15, C = 0
Subgroup 8
2
/ 13/
a. Lid torque
2024
5(0)
1
/ In-line monitor data may be substituted for subgroups D1, D2, D6, D7, and D8 upon approval by the qualifying
activity. The monitors shall be performed by package type and to the specified subgroup test method(s). The
monitor sample shall be taken at a point where no further parameter change occurs, using a sample size and
frequency of equal or greater severity than specified in the particular subgroup. This in-line monitor data shall be
traceable to the specific inspection lot(s) represented (accepted or rejected) by the data.
2
/ Electrical reject devices from that same inspection lot may be used for samples.
MIL-STD-883F
METHOD 5005.14
18 June 2004
12
TABLE IV. Group D (package related tests) (for class levels B and S) - Continued.
3
/ The sample size number of 45, C = 0 for lead integrity shall be based on the number of leads or terminals tested
and shall be taken from a minimum of 3 devices. All devices required for the lead integrity test shall pass the seal
test if applicable (see 4
/) in order to meet the requirements of subgroup 2. For leaded chip carrier packages, use
condition B1. For pin grid array leads and rigid leads, use method 2028. For leadless chip carrier packages only,
use test condition D and a sample size number of 15 (C = 0) based on the number of pads tested taken from 3
devices minimum.
4
/ Seal test (subgroup 2b) need be performed only on packages having leads exiting through a glass seal.
5
/ Devices used in subgroup 3, "Thermal and Moisture Resistance" may be used in subgroup 4, "Mechanical".
6
/ Lead bend stress initial conditioning is not required for leadless chip carrier packages. For fine pitch packages
(≤ 25 mil pitch) using a nonconductive tie bar, preconditioning shall be required on 3 devices only prior to the
moisture resistance test with no subsequent electrical test required on these 3 devices. The remaining 12 devices
from the sample of 15 devices do not require preconditioning but shall be subjected to the required endpoint
electrical tests.
7
/ After completion of the required visual examinations and prior to submittal to method 1014 seal tests, the devices
may have the corrosion by-products removed by using a bristle brush.
8
/ At the manufacturer's option, end-point electrical parameters may be performed after moisture resistance and
prior to seal test.
9
/ Visual examination shall be in accordance with method 1010 or 1011.
10
/ Test three devices; if one fails, test two additional devices with no failures. At the manufacturer's option, if the
initial test sample (i.e., 3 or 5 devices) fails a second complete sample may be tested at an alternate laboratory
that has been issued suitability by the qualifying activity. If this sample passes the lot shall be accepted provided
the devices and data from both submissions is submitted to the qualifying activity along with 5 additional devices
from the same lot. If sample size (accept number) of 5(1) is used to pass the lot, the manufacturer shall evaluate
his product to determine the reason for the failure and whether the lot is at risk.
11
/ The adhesion of lead finish test shall not apply for leadless chip carrier packages.
12
/ Sample size number based on number of leads.
13
/ Lid torque test shall apply only to packages which use a glass-frit-seal to lead frame, lead or package body (i.e.,
wherever frit seal establishes hermeticity or package integrity).