OM-1461-001_w.pdf - 第9页

6 0712-001 2.Specications Item Description Special Item 5. Component Placeable Range Unit : mm Notes : (a) Theabovegureshowsthatthevacuumnozzlesarenot protruding from the outer shapes of components. (b) Com…

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5
3.0
PCB
PCB Support Pin
(Shows the time of PCB transfer.)
Previously-placed
Components Unallowed
Range
Component
3.0
3.0 3.0
F4
Max. 25.4
PCB Support Pin (Several Places)
Notes: (a) The pin can be shifted at "20 mm" pitch.
(The shifting is partly possible at "10 mm" pitch.)
(b) Set the support pins such that they do not touch
the already placed components.
(c) The figure shows that the PCB is being supported.
(Front Side of Machine)
Max. 30
1. Scope
0712-001
Unit : mm
1. Scope
This unit manages the multi-functional components in the Direct Drive
Modular Mounter GXH-3 series.
There are three nozzles, placed in series, for each head.
2. Specications
Item Description Special Item
1. Model Name
HM-G300
2. Construction
•Multi-Functional Head : HM-G300
• Multi-Functional Nozzle Stocker : MS-G-300L (For the Blocks 1 and 4)
: MS-G-300R (For the Blocks 2 and 3)
• For attaching to the main body : G-S050-09
(GXH-3 For the Blocks 1 and 4)
: G-S050-10
(GXH-3 For the Blocks 2 and 3)
3. Throughput Chip-Type Components : 24,000 CPH/4 Head
QFP : 20,000 CPH/4 Head
Note
: Excluding the PCB transition time under optimum conditions.
4. Conditions of
PCB before
Placement
(Regulation
of Component
Height)
Note :
The dimensions are those for design reference.
Leave some room for the actual setting.
60712-001
2.Specications
Item Description Special Item
5. Component
Placeable
Range
Unit : mm
Notes :
(a) Theabovegureshowsthatthevacuumnozzlesarenot
protruding from the outer shapes of components.
(b) Components cannot be placed in the shadowed area.
Components cannot be placed in the range (0.5 mm) around
the opening such as a hole.
QFP
Min. 3.5
Min. 3.8
Min. 3.5
Solder Paste
Glue
QFP
PCB
Max. 25.4
Upper
Surface of PCB
(Front Side of Machine)
7
Item Description Special Item
6. Applicable
Components
(1) Applicable Components
Size : 3.2
×
1.6 to 55
×
55 (100
×
26) mm
Thickness : Max. 25.4 mm
Lead Pitch : 0.4 mm pitch or more
Connector : Max. 100
×
26 mm
Note
: Some components cannot be used due to the mechanical
characteristics, shapes, etc.
Applicable Components for Reference
• Cylindrical Components
Resistors, Capacitors, Diodes and Other similar-shaped
components
• Square Components
Resistors, Laminated Capacitors, Coils, Chip Ceramic Filters and
Other similar-shaped components
• Deform Components
Semi-Fixed Potentiometers, Trimmer Capacitors and Other
similar-shaped components
• ICs
Mini-Flat ICs, Plastic Chip Carrier with Leads and Other similar-
shaped components
• Leaded Components
Mini-Mold Transistors, Mini-Power Transistors, Filters, LEDs,
Diodes, Coils, Tantalum Capacitors, Aluminum Electrolytic
Capacitors and Other similar-shaped components
• Connectors
Connectors for FFC / FPC, PCB-to-PCB Connectors, Wire-
to-PCB Connectors, PLCC Sockets and Other similar-shaped
components
• BGA/CSP Components (Option)
BGA, CSP, LGA and Other Similar-Shaped Components
Size : Max. 55
×
55 mm
Ball Diameter : Min.
φ
0.3 mm
Ball Pitch : 0.5 mm pitch or more
(2) Packaged Posture Standards
JIS or its equivalent
• Paper Tapes (Width : 8 mm)
• Embossed Tapes (Width : 8 to 72 mm)
• Reel Outer Diameter :
φ
382 mm or less
Note :
Some taping sizes are limited. Some taped components
cannot be used due to the mechanical characteristics.
2.Specications
0712-001
Item Description Special Item
6. Applicable
Components
(1) Applicable Components
Size : 3.2
×
1.6 to 55
×
55 (100
×
26) mm
Thickness : Max. 25.4 mm
Lead Pitch : 0.4 mm pitch or more
Connector : Max. 100
×
26 mm
Note
: Some components cannot be used due to the mechanical
characteristics, shapes, etc.
Applicable Components for Reference
• Cylindrical Components
Resistors, Capacitors, Diodes and Other similar-shaped
components
• Square Components
Resistors, Laminated Capacitors, Coils, Chip Ceramic Filters and
Other similar-shaped components
• Deform Components
Semi-Fixed Potentiometers, Trimmer Capacitors and Other
similar-shaped components
• ICs
Mini-Flat ICs, Plastic Chip Carrier with Leads and Other similar-
shaped components
• Leaded Components
Mini-Mold Transistors, Mini-Power Transistors, Filters, LEDs,
Diodes, Coils, Tantalum Capacitors, Aluminum Electrolytic
Capacitors and Other similar-shaped components
• Connectors
Connectors for FFC / FPC, PCB-to-PCB Connectors, Wire-
to-PCB Connectors, PLCC Sockets and Other similar-shaped
components
• BGA/CSP Components (Option)
BGA, CSP, LGA and Other Similar-Shaped Components
Size : Max. 55
×
55 mm
Ball Diameter : Min.
φ
0.3 mm
Ball Pitch : 0.5 mm pitch or more
(2) Packaged Posture Standards
JIS or its equivalent
• Paper Tapes (Width : 8 mm)
• Embossed Tapes (Width : 8 to 72 mm)
• Reel Outer Diameter :
φ
382 mm or less
Note :
Some taping sizes are limited. Some taped components
cannot be used due to the mechanical characteristics.